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US-20260125307-A1 - SUPPORTING GLASS SUBSTRATE

US20260125307A1US 20260125307 A1US20260125307 A1US 20260125307A1US-20260125307-A1

Abstract

Suppressing deflection and reducing weight are to be achieved. A supporting glass substrate has a ratio of a Young's modulus (GPa) to a density (g/cm 3 ) that is 32.0 (GPa·cm 3 /g) or more and the ratio has a value larger than a ratio calculation value, the ratio calculation value being a ratio of a Young's modulus (GPa) calculated from a composition to a density (g/cm 3 ). The ratio calculation value is represented by the following expression: α=2·Σ{(V i ·G i )/M i ·X i }, where, in the expression, V i is a filling parameter of a metal oxide contained in the supporting glass substrate, G i is a dissociation energy of a metal oxide contained in the supporting glass substrate, M i is a molecular weight of a metal oxide contained in the supporting glass substrate, and X i is a molar ratio of a metal oxide contained in the supporting glass substrate.

Inventors

  • Mikio NAGANO
  • Seiji Inaba
  • Yasunari Saito
  • Kiyoshi Tamai
  • Kazutaka Ono
  • Yuha KOBAYASHI

Assignees

  • AGC Inc.

Dates

Publication Date
20260507
Application Date
20251222
Priority Date
20190729

Claims (9)

  1. 1 . A supporting glass substrate, comprising: wherein a content of SiO 2 is 52 mol % to 58 mol %, a content of Al 2 O 3 is 12 mol % to 17 mol %, a content of MgO is 14 mol % to 27 mol %, and a content of CaO is 7 mol % to 32 mol %, each with respect to a total amount of the supporting glass substrate, the supporting glass substrate has a ratio of a Young's modulus ε to a density d, ε/d, of 32.0 GPa·cm 3 /g or more, wherein a ratio calculation value α in GPa·cm 3 /g is α = 2 · ∑ { ( V i · G i ) / M i ) · X i } , where V i is a filling parameter of a metal oxide contained in the supporting glass substrate, G i is a dissociation energy of a metal oxide contained in the supporting glass substrate, M i is a molecular weight of a metal oxide contained in the supporting glass substrate, and X i is a molar ratio of a metal oxide contained in the supporting glass substrate, and wherein the supporting glass substrate has a structural factor M of 1.1 or more, which is defined as a ratio of ε/d to the ratio calculation value α.
  2. 2 . A supporting glass substrate, comprising: wherein a content of SiO 2 is 64 mol % to 68 mol %, a content of Al 2 O 3 is 10 mol % to 14 mol %, a content of MgO is 9 mol % to 13 mol %, a content of CaO is 6 mol % to 10 mol %, and a content of B 2 O 3 is 1 mol % to 5 mol %, each with respect to a total amount of the supporting glass substrate, and the supporting glass substrate has a ratio of a Young's modulus ε to a density d, ε/d, of 32.0 GPa·cm 3 /g or more.
  3. 3 . The supporting glass substrate of claim 1 , wherein the supporting glass substrate satisfies ε/d>α+2.0 GPa·cm 3 /g.
  4. 4 . The supporting glass substrate of claim 3 , wherein the supporting glass substrate satisfies ε/d>α+4.0 GPa·cm 3 /g.
  5. 5 . The supporting glass substrate of claim 1 , wherein ε/d is 37.0 GPa·cm 3 /g or more.
  6. 6 . The supporting glass substrate of claim 1 , wherein a filling density Vt is less than 13.8 cm 3 /mol and is defined as Vt=Σ(V i ·X i ).
  7. 7 . The supporting glass substrate of claim 1 , wherein the supporting glass substrate has a thickness in a range of 0.1 mm to 0.5 mm.
  8. 8 . The supporting glass substrate of claim 1 , wherein the supporting glass substrate is an amorphous glass.
  9. 9 . The supporting glass substrate of claim 1 , wherein the supporting glass substrate is configured to manufacture a fan out wafer level package or a fan out panel level package.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) The present application is a divisional application of U.S. application Ser. No. 17/585,787, filed Jan. 27, 2022, which is a continuation of International Patent Application PCT/JP2020/022363, filed Jun. 5, 2020, which is based on and claims the benefit of priority to International Patent Application PCT/JP2019/029695, filed Jul. 29, 2019. The entire contents of all the above applications are incorporated herein by reference. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a supporting glass substrate. 2. Description of the Related Art Along with the reduction in sizes of electronic devices, there is an increasing demand for techniques for mounting semiconductor devices used in these electronic devices at high density. In recent years, for example, a fan out wafer level package (FOWLP) and a fan out panel level package (FOPLP) have been proposed as the techniques for mounting semiconductor devices at high density. Hereinafter, the FOWLP and the FOPLP are collectively referred to as the FOWLP and the like. In the FOWLP and the like, a supporting glass substrate that supports a processing substrate may be used in order to suppress a deflection of the processing substrate on which semiconductor devices are stacked (see, for example, Japanese Patent No. 6443668). In a supporting glass substrate used for supporting members, such as the supporting glass substrate for the FOWLP and the like, a reduction in weight is also required in addition to suppression of the deflection. In the supporting glass substrate, in a case in which a thickness is increased in order to suppress the deflection, a mass is increased, and in a case in which a thickness is decreased in order to reduce the weight, the deflection tends to occur. Therefore, it may be difficult to achieve both suppressing deflection and reducing weight. The present disclosure has been made in view of the above problem, and an object of the present invention is to provide a supporting glass substrate in which suppressing deflection and reducing weight can be achieved. SUMMARY OF THE INVENTION It is an object of the present invention to at least partially solve the problems in the conventional technology. The supporting glass substrate of the present disclosure may have a ratio ε/d (GPa·cm3/g) of a Young's modulus ε (GPa) to a density d (g/cm3) that is 37.0 (GPa·cm3/g) or more and the ratio ε/d (GPa·cm3/g) has a value larger than a ratio calculation value α (GPa·cm3/g), the ratio calculation value α (GPa·cm3/g) being a ratio of a Young's modulus ε (GPa) to a density (g/cm3) calculated from a composition. The ratio calculation value α (GPa·cm3/g) is represented by the following expression: α=2·Σ{(Vi·Gi/Mi)·Xi} In the expression, Vi is a filling parameter of a metal oxide contained in the supporting glass substrate, Gi is a dissociation energy of a metal oxide contained in the supporting glass substrate, Mi is a molecular weight of a metal oxide contained in the supporting glass substrate, and Xi is a molar ratio of a metal oxide contained in the supporting glass substrate. According to the present disclosure, suppressing deflection and reducing weight can be achieved. The above and other objects, features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a supporting glass substrate according to the present embodiment; FIG. 2 is a graph for explaining performance of the supporting glass substrate according to the present embodiment; FIG. 3 is a schematic view illustrating a method of measuring deflection in Examples and Comparative Examples; and FIG. 4 is a graph illustrating features of supporting glass substrates in Examples and Comparative Examples. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a suitable embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the embodiment, and in a case in which there are a plurality of embodiments, the present invention also includes configurations in which the respective embodiments are combined with each other. FIG. 1 is a schematic view of a supporting glass substrate according to the present embodiment. As illustrated in FIG. 1, a supporting glass substrate 10 according to the present embodiment is used as a glass substrate for manufacturing a semiconductor package, and more specifically, a supporting glass substrate for manufacturing a FOWLP and the like. However, application of the supporting glass substrate 10 is not limited to manufacture of the FOWLP and the like and is optional, and the supporting glass substrate 10 may be used as a glass substrate used for s