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US-20260125315-A1 - MICROELECTRONIC ARTICLES THAT INCLUDE GLASS-BASED SUBSTRATES AND POLYMER LAYERS

US20260125315A1US 20260125315 A1US20260125315 A1US 20260125315A1US-20260125315-A1

Abstract

A microelectronic article includes a glass-based substrate having a first surface and a second surface, a first polymer layer disposed on the first surface, a second polymer layer disposed on the second surface, at least one redistribution layer disposed on the first polymer layer, the second polymer layer, or both, and a metallized through glass via extending from the first surface to the second surface. The first polymer layer and the second polymer layer include pores and have a porosity of from 5% to 70% and a Young's modulus of greater than 1 GPa. The at least one redistribution layer includes a metal material and a dielectric material.

Inventors

  • Mandakini Kanungo
  • Chukwudi Azubuike Okoro
  • Stanislav Sikulskyi
  • Rajesh Vaddi

Assignees

  • CORNING INCORPORATED

Dates

Publication Date
20260507
Application Date
20251024

Claims (20)

  1. 1 . A microelectronic article comprising: a glass-based substrate comprising a first surface and a second surface; a first polymer layer disposed on the first surface; a second polymer layer disposed on the second surface; at least one redistribution layer disposed on the first polymer layer, the second polymer layer, or both; a metallized through glass via extending from the first surface to the second surface, wherein: the first polymer layer and the second polymer layer comprise pores and have a porosity of from 5% to 70% and a Young's modulus of greater than 1 GPa; and the at least one redistribution layer comprises a metal material and a dielectric material.
  2. 2 . The microelectronic article of claim 1 , wherein the first polymer layer and the second polymer layer comprise hollow polyethylene, polystyrene, poly(methyl methacrylate), hydrogen silsesquioxane, methyl silsesquioxane, hollow silica beads, or combinations thereof.
  3. 3 . The microelectronic article of claim 1 , wherein one or more of the first polymer layer, the second polymer layer, and the dielectric material has a coefficient of thermal expansion of greater than or equal to 3×10 −6 /° C. over a temperature range of from −100° C. to 450° C.
  4. 4 . The microelectronic article of claim 1 , wherein the pores have an average pore size of from 0.1 μm to 10 μm.
  5. 5 . The microelectronic article of claim 1 , wherein the first polymer layer and the second polymer layer have a decomposition temperature of greater than or equal to 200° C. and a coefficient of thermal expansion of greater than or equal to 3×10 −6 /° C.
  6. 6 . The microelectronic article of claim 1 , wherein the dielectric material comprises photo-patternable polyimide, polybenzoxazoles, polyolefin, polystyrene, benzocyclobutene, ring-opened norbornen type polymers, or combinations thereof.
  7. 7 . The microelectronic article of claim 1 , further comprising an electric connection extending through the microelectronic article, wherein the electric connection comprises the metallized through glass via.
  8. 8 . The microelectronic article of claim 1 , wherein one or more of the first polymer layer, the second polymer layer, and the dielectric material comprises an adhesion promoter.
  9. 9 . The microelectronic article of claim 1 , wherein the metal material comprises copper, aluminum, silver, tin, aluminum-copper, gold, titanium, titanium-tungsten, tantalum, tantalum-nitrogen, chromium, nickel, or combinations thereof.
  10. 10 . The microelectronic article of claim 1 , wherein the glass-based substrate has a coefficient of thermal expansion of from 0.5×10 −6 /° C. to 13×10 −6 /° C.
  11. 11 . The microelectronic article of claim 1 , wherein the glass-based substrate has a Young's modulus of from 50 GPa to 200 GPa.
  12. 12 . A microelectronic article comprising: a glass-based substrate comprising a first surface and a second surface; a first polymer layer disposed on the first surface; a second polymer layer disposed on the second surface; at least one redistribution layer disposed on the first polymer layer, the second polymer layer, or both; a metallized through glass via extending from the first surface to the second surface, wherein: the first polymer layer and the second polymer layer have a Young's modulus of from 1 GPa to 10 GPa; and the at least one redistribution layer comprises a metal material and a dielectric material.
  13. 13 . The microelectronic article of claim 12 , wherein the first polymer layer, the second polymer layer, or both comprise pores.
  14. 14 . The microelectronic article of claim 12 , wherein the dielectric material comprises photo-patternable polyimide, polybenzoxazoles, polyolefin, polystyrene, benzocyclobutene, ring-opened norbornen type polymers, or combinations thereof.
  15. 15 . The microelectronic article of claim 12 , wherein one or more of the first polymer layer, the second polymer layer, and the dielectric material comprises an adhesion promoter.
  16. 16 . The microelectronic article of claim 12 , wherein the first polymer layer and the second polymer layer have a decomposition temperature of greater than or equal to 200° C. and a coefficient of thermal expansion of greater than or equal to 3×10 −6 /° C.
  17. 17 . A microelectronic article pre-structure comprising: a glass-based substrate comprising a first surface and a second surface; at least one polymer layer disposed on the first surface, the second surface, or both; wherein: the at least one polymer layer comprise pores and has a porosity of from 5% to 70% and a Young's modulus of from 1 GPa to 10 GPa.
  18. 18 . The microelectronic article pre-structure of claim 17 , further comprising at least one redistribution layer disposed on the at least one polymer layer, wherein the at least one redistribution layer comprises a metal material and a dielectric material.
  19. 19 . The microelectronic article pre-structure of claim 17 , wherein a first polymer layer is disposed on the first surface and a second polymer layer is disposed on the second surface.
  20. 20 . The microelectronic article pre-structure of claim 17 , wherein the pores have an average pore size of from 0.1 μm to 10 μm.

Description

This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Ser. No. 63/716,350 filed on Nov. 5, 2024, the content of which is relied upon and incorporated herein by reference in its entirety. TECHNICAL FIELD Embodiments of the present disclosure generally relate to microelectronic articles and, more specifically, to microelectronic articles including glass-based substrates and polymer layers. BACKGROUND Glass-based substrates are widely used in microelectronic articles due to attributes such as low dielectric constant, high rigidity, and panel size capability. Conventionally, using glass-based substrates in microelectronics requires an overlay of multiple layers of metal and dielectric materials, often referred to as redistribution layers or RDLs. The buildup of the redistribution layers and the different coefficients of thermal expansion and/or Young's modulus between the glass-based substrate and the redistribution layers may induce stresses that are transferred to the glass-based substrate, resulting in lateral fractures. As such, microelectronic articles that minimize glass fractures are desired by the industry. SUMMARY Accordingly, described herein are microelectronic articles that include a glass-based substrate comprising a first surface and a second surface, a first polymer layer disposed on the first surface, a second polymer layer disposed on the second surface, and at least one redistribution layer disposed on the first polymer layer, the second polymer layer, or both. It has presently been discovered that microelectronic articles with glass-based substrates that utilize polymer layers described herein have reduced stress transfer to the glass-based substrate than conventional microelectronic articles with glass-based substrates and that do not include such polymer layers. The polymer layers may comprise pores, additives, or the polymer layers may comprise certain properties each of which allow the polymer layers to serve as an adhesive-buffer layer between the glass-based substrate and the one or more redistribution layers. According to embodiments described herein, a microelectronic article may comprise a glass-based substrate comprising a first surface and a second surface, a first polymer layer disposed on the first surface, a second polymer layer disposed on the second surface, at least one redistribution layer disposed on the first polymer layer, the second polymer layer, or both, and a metallized through glass via extending from the first surface to the second surface. The first polymer layer and the second polymer layer may comprise pores and have a porosity of from 5% to 70% and a Young's modulus of greater than 1 GPa. The at least one redistribution layer may comprise a metal material and a dielectric material. According to additional embodiments described herein, a microelectronic article may comprise a glass-based substrate comprising a first surface and a second surface, at least one redistribution layer disposed on the first surface, the second surface, or both, and a metallized through glass via extending from the first surface to the second surface. The at least one redistribution layer may comprise a dielectric material and a metal material. The dielectric material may comprise pores and have a porosity of from 5% to 70% and a Young's modulus of greater than 1 GPa. According to additional embodiments described herein, a microelectronic article may comprise a glass-based substrate comprising a first surface and a second surface, a first polymer layer disposed on the first surface, a second polymer layer disposed on the second surface, at least one redistribution layer disposed on the first polymer layer, the second polymer layer, or both, and a metallized through glass via extending from the first surface to the second surface. The first polymer layer and the second polymer layer may have a Young's modulus of from 1 GPa to 10 GPa. The at least one redistribution layer may comprise a metal material and a dielectric material. According to additional embodiments described herein, a microelectronic article pre-structure may comprise a glass-based substrate comprising a first surface and a second surface and at least one polymer layer disposed on the first surface, the second surface, or both. The at least one polymer layer may comprise pores and have a porosity of from 5% to 70% and a Young's modulus of from 1 GPa to 10 GPa. These and other embodiments are described in more detail in the Detailed Description. It is to be understood that both the foregoing general description and the following detailed description present embodiments of the subject technology, and are intended to provide an overview or framework for understanding the nature and character of the described technology as it is claimed. The accompanying drawings are included to provide a further understanding of the presently disclosed technology and are incorporated into and cons