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US-20260125545-A1 - RESIN COMPOSITION, ARTICLE MADE THEREFROM, AND USE THEREOF

US20260125545A1US 20260125545 A1US20260125545 A1US 20260125545A1US-20260125545-A1

Abstract

The present disclosure provides a resin composition, including: a component (A): 100 parts by weight of an unhydrogenated maleic anhydride-modified first polyolefin; a component (B): 20 to 100 parts by weight of an acrylate monomer, its oligomer or combination thereof, the acrylate monomer has at least two unsaturated carbon-carbon double bonds; and a component (C): 5 to 160 parts by weight of a benzocyclobutene-modified second polyolefin. In addition, the present disclosure also provides an article made from the resin composition. The resin composition and the product have improvements in one or more properties including solder floating crack rate, copper foil peeling strength, percent of thermal expansion at Z-axis, water absorption ratio, and dissipation factor. The present disclosure also provides a use of the resin composition in the resin filling process of printed circuit boards.

Inventors

  • Yan Zhang
  • Rongtao WANG
  • Zheng Jia
  • Xueyan Jiang

Assignees

  • ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.

Dates

Publication Date
20260507
Application Date
20241227
Priority Date
20241105

Claims (20)

  1. 1 . A resin composition, comprising: a component (A): 100 parts by weight of an unhydrogenated maleic anhydride-modified first polyolefin; a component (B): 20 to 100 parts by weight of an acrylate monomer, its oligomer or a combination thereof, wherein the acrylate monomer has at least two unsaturated carbon-carbon double bonds; and a component (C): 5 to 160 parts by weight of a benzocyclobutene-modified second polyolefin.
  2. 2 . The resin composition of claim 1 , wherein the unhydrogenated maleic anhydride-modified first polyolefin comprises any one of a maleic anhydride-adducted polybutadiene, a maleic anhydride-adducted polyisoprene, a maleic anhydride-adducted styrene-butadiene copolymer, a maleic anhydride-adducted styrene-isoprene copolymer, a maleic anhydride-styrene copolymer or a combination thereof.
  3. 3 . The resin composition of claim 1 , wherein the resin composition comprises 20 to 120 parts by weight of the benzocyclobutene-modified second polyolefin.
  4. 4 . The resin composition of claim 1 , wherein the benzocyclobutene-modified second polyolefin comprises any one of a benzocyclobutene-modified heteroatom-containing polyolefin, a benzocyclobutene-modified non-heteroatom-containing polyolefin or a combination thereof.
  5. 5 . The resin composition of claim 4 , wherein the benzocyclobutene-modified second polyolefin comprises a benzocyclobutene-modified heteroatom-containing polyolefin and a benzocyclobutene-modified non-heteroatom-containing polyolefin, and a mass ratio of the benzocyclobutene-modified non-heteroatom-containing polyolefin to the benzocyclobutene-modified heteroatom-containing polyolefin is 1:3 to 7:1.
  6. 6 . The resin composition of claim 4 , wherein the heteroatom-containing polyolefin comprises any one of a maleic anhydride-adducted polybutadiene, a maleic anhydride-adducted polyisoprene, a maleic anhydride-adducted styrene-butadiene copolymer, a maleic anhydride-adducted styrene-isoprene copolymer, a vinyl-polybutadiene-urethane polymer, a silane-modified styrene-butadiene copolymer, an acryloyl group-terminated polybutadiene, an epoxy group-containing polybutadiene or a combination thereof.
  7. 7 . The resin composition of claim 4 , wherein the non-heteroatom-containing polyolefin comprises any one of a polybutadiene, a polyisoprene, a styrene-butadiene copolymer, a styrene-isoprene copolymer, a styrene-butadiene-divinylbenzene polymer, a styrene-ethylene-divinylbenzene polymer, a styrene-ethylvinylbenzene-divinylbenzene polymer or a combination thereof.
  8. 8 . The resin composition of claim 1 , wherein the acrylate monomer comprises any one of a tricyclodecane dimethanol di(meth)acrylate, a dioxane glycol di(meth)acrylate, a di(propylene glycol) di(meth)acrylate, a tris(2-hydroxyethyl) isocyanurate tri(meth)acrylate, a pentaerythritol tri(meth)acrylate, a pentaerythritol tetra(meth)acrylate, a di(trimethylolpropane) tetra(meth)acrylate, a dipentaerythritol penta(meth)acrylate, a dipentaerythritol hexa(meth)acrylate or a combination thereof.
  9. 9 . The resin composition of claim 1 , wherein the acrylate monomer has two acrylate groups or three acrylate groups.
  10. 10 . The resin composition of claim 1 , wherein the acrylate monomer or its oligomer has a glass transition temperature greater than or equal to 90° C. after cured.
  11. 11 . The resin composition of claim 1 , wherein the acrylate monomer or its oligomer has a glass transition temperature greater than or equal to 150° C. after cured.
  12. 12 . The resin composition of claim 1 , wherein the resin composition does not comprise an organic solvent.
  13. 13 . The resin composition of claim 1 , wherein the resin composition further comprises any one of a polyolefin different from the unhydrogenated maleic anhydride-modified first polyolefin and the benzocyclobutene-modified second polyolefin, an unsaturated carbon-carbon double bond-containing crosslinking agent, a benzoxazine resin, an epoxy resin, an active ester, a phenol resin, an amine curing agent, a polyamide, a polyimide, a cyanate ester resin or a combination thereof.
  14. 14 . The resin composition of claim 1 , wherein the resin composition further comprises any one of an inorganic filler, a flame retardant, a curing accelerator, a polymerization inhibitor, a coloring agent, a silane coupling agent, a surfactant, a toughening agent or a combination thereof.
  15. 15 . An article made from the resin composition of claim 1 , wherein the article comprises a prepreg, a resin film, a laminate or a printed circuit board.
  16. 16 . An article made from the resin composition of claim 1 , wherein the article comprises a resin cured product obtained by curing the resin composition.
  17. 17 . The article of claim 16 , wherein the article has at least one of following properties: a solder floating crack rate as measured by reference to IPC-TM-650 2.4.13.1 of 0%; a copper foil peeling strength as measured by reference to IPC-TM-650 2.4.8 of greater than or equal to 3.5 lb/in; a Z-axis percent of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 1.72%; a water absorption ratio as measured by reference to IPC-TM-650 2.6.2.1 and IPC-TM-650 2.6.16.1 of less than or equal to 0.39%; and a dissipation factor as measured at 10 GHz by reference to JIS C2565 of less than or equal to 0.0048.
  18. 18 . A use of the resin composition of claim 1 in a resin filling process for printed circuit boards.
  19. 19 . The use of claim 18 , wherein the resin filling process for printed circuit boards comprises a hole plugging process for printed circuit boards, a groove filling process for printed circuit boards, or a circuit filling process for printed circuit boards.
  20. 20 . The use of claim 19 , wherein in the hole plugging process for printed circuit boards, at least one hole of the printed circuit boards is filled with a resin cured product of the resin composition, in the groove filling process for printed circuit boards, at least one groove of the printed circuit boards is filled with the resin cured product of the resin composition, and in the circuit filling process for printed circuit boards, at least one circuit open area of the printed circuit boards is covered with the resin cured product of the resin composition.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 202411565299.5 filed in China on Nov. 5, 2024, the entire contents of which are hereby incorporated by reference. BACKGROUND 1. Technical Field The present disclosure relates to a resin composition, an article made therefrom and a use thereof, particularly to a resin composition that can be applied to a resin filling process for printed circuit boards (PCB). 2. Related Art With the development of miniaturization in assembling components, PCBs are also becoming increasingly miniaturized and thinner, resulting in a continuous reduction of PCB wiring area. This trend requires higher wiring density for PCBs. The resin filling process is an innovative technology developed to reduce PCB design dimensions to accommodate the assembling components, effectively improving the reliability and manufacturing capability of High Density Interconnect (HDI) technology. At the same time, the resin filling technique addresses issues that cannot be resolved using green oil hole-plugging process or lamination filling. For instance, filling blind/buried/through holes structure in the inner layers with resin or filling open areas in thick copper circuits with resin before lamination balances the conflict between controlling the thickness of the dielectric layer during lamination and the application design of the inner layer resin. For instance, resin filling of through-holes improves reliability issues caused by green oil hole-plugging process. However, in existing technologies, the resin compositions used in the resin filling process are primarily prepared from traditional epoxy resin combined with calcium carbonate, which exhibit poor performance characteristics, including one or more of high water absorption ratio, high dissipation factor, high Z-axis percent of thermal expansion, high percent of curing shrinkage, low copper foil peeling strength, and high solder floating crack rate. Therefore, these resin compositions cannot meet the requirements of printed circuit boards for high-frequency and high-speed information transmission. SUMMARY In view of the above problems in the prior arts, specifically, the current material is unable to meet one or more of the technical demands, the main purpose of the present disclosure is to provide a resin composition, an article made from the resin composition, and a use of the resin composition including a hole plugging process for printed circuit boards, a groove filling process for printed circuit boards, or a circuit filling process for printed circuit boards to solve one or more of the above problems. In one aspect, the present disclosure provides a resin composition, including: a component (A): 100 parts by weight of an unhydrogenated maleic anhydride-modified first polyolefin;a component (B): 20 to 100 parts by weight of an acrylate monomer, its oligomer or a combination thereof, wherein the acrylate monomer has at least two unsaturated carbon-carbon double bonds; anda component (C): 5 to 160 parts by weight of a benzocyclobutene-modified second polyolefin. In another aspect, the present disclosure also provides an article made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board. In still another aspect, the present disclosure also provides an article made from the resin composition, comprising a resin cured product obtained by curing the resin composition. The resin composition and the article made therefrom have at least one of following properties: a solder floating crack rate as measured by reference to IPC-TM-650 2.4.13.1 of 0%;a copper foil peeling strength as measured by reference to IPC-TM-650 2.4.8 of greater than or equal to 3.5 lb/in;a Z-axis percent of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 1.72%;a water absorption ratio as measured by reference to IPC-TM-650 2.6.2.1 and IPC-TM-650 2.6.16.1 of less than or equal to 0.39%; anda dissipation factor as measured at 10 GHz by reference to JIS C2565 of less than or equal to 0.0048. In further still another aspect, the present disclosure provides a use of the resin composition in a resin filling process for printed circuit boards. The resin filling process for printed circuit boards includes a hole plugging process for printed circuit boards, a groove filling process for printed circuit boards or a circuit filling process for printed circuit boards. In the hole plugging process for printed circuit boards, at least one hole of the printed circuit board is filled with a resin cured product of the resin composition. In the groove filling process for printed circuit boards, at least one groove of the printed circuit board is filled with a resin cured product of the resin composition. In the circuit filling process for printed circuit boards, at least one circuit open area of the printed circuit b