US-20260125818-A1 - HORIZONTAL ELECTROPLATING PRODUCTION LINE

US20260125818A1US 20260125818 A1US20260125818 A1US 20260125818A1US-20260125818-A1

Abstract

A horizontal electroplating production line includes a horizontal electroplating apparatus and a circuit board feeding device. The horizontal electroplating apparatus includes a first frame, an electroplating tank and a horizontal electroplating conveying device arranged at the first frame, the electroplating tank extends along a first direction, the horizontal electroplating conveying device is configured to clamp a circuit board and move the circuit board in the electroplating tank for electroplating, the circuit board feeding device includes a second frame and a feeding conveying mechanism arranged at the second frame, the feeding conveying mechanism is a conveying line with a certain length, and the feeding conveying mechanism is configured to place the circuit board horizontally and convey the circuit board to the horizontal electroplating conveying device of the electroplating apparatus.

Inventors

Takwo CHAN

Assignees

UNIVERSAL CIRCUIT BOARD EQUIPMENT CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20250218
Priority Date: 20241104

Claims (20)

1 . A horizontal electroplating production line, comprising: a horizontal electroplating apparatus comprising a first frame, an electroplating tank and a horizontal electroplating conveying device arranged at the first frame, wherein two ends of the electroplating tank are respectively provided with an inlet and an outlet, and the horizontal electroplating conveying device is configured to drive a circuit board to move from the inlet into the electroplating tank towards the outlet; and a circuit board feeding device arranged at one end of the electroplating tank close to the inlet, wherein the circuit board feeding device comprises a second frame and a feeding conveying mechanism arranged at the second frame, the feeding conveying mechanism is configured to place the circuit board horizontally and convey the circuit board along a first direction, so that the circuit board entering the electroplating tank remains horizontal and moves to the horizontal electroplating conveying device.
2 . The horizontal electroplating production line according to claim 1 , wherein the circuit board feeding device further comprises a first positioning mechanism and a first material pushing mechanism, the first positioning mechanism is configured to position the circuit board on the feeding conveying mechanism to a preset position, the first material pushing mechanism is configured to drive the circuit board on the feeding conveying mechanism to move in the first direction, so that adjusting a spacing between two adjacent circuit boards that are positioned by the first positioning mechanism and are arranged along the first direction.
3 . The horizontal electroplating production line according to claim 2 , wherein the first material pushing mechanism is configured to push the circuit board positioned by the first positioning mechanism to move in the first direction, so that a spacing between the pushed circuit board and the previous circuit board positioned by the first positioning mechanism is a preset value L, and an actual spacing between the two circuit boards is D, where L−1.5 mm≤D≤L+1.5 mm.
4 . The horizontal electroplating production line according to claim 1 , wherein the horizontal electroplating production line comprises a flipping device and two horizontal electroplating apparatuses, the flipping device is arranged between the two horizontal electroplating apparatuses to flip and convey the circuit board that has been electroplated in one of the horizontal electroplating apparatuses to the other horizontal electroplating apparatus, so that the horizontal electroplating conveying device of the two horizontal electroplating apparatus respectively grip opposite sides of the circuit board.
5 . The horizontal electroplating production line according to claim 4 , wherein the flipping device comprises a third frame, a feeding mechanism and a flipping mechanism arranged at the third frame, the feeding mechanism is configured to place the circuit board horizontally, and the flipping mechanism is configured to flip the circuit board on the feeding mechanism.
6 . The horizontal electroplating production line according to claim 5 , wherein the flipping mechanism comprises a driving assembly, a rotating shaft and a clamping assembly, the clamping assembly is arranged at the rotating shaft, the rotating shaft is drivingly connected to the driving assembly, the clamping assembly is provided with a slot for inserting the circuit board, and the driving assembly is configured to drive the rotating shaft to rotate, so that the clamping assembly drives the circuit board to flip.
7 . The horizontal electroplating production line according to claim 6 , wherein the feeding mechanism comprises a first conveying line, a second conveying line, a third conveying line and a fourth conveying line, the first conveying line and the second conveying line transport the circuit board in the first direction, the flipping mechanism is arranged between the first conveying line and the second conveying line to flip the circuit board on the first conveying line to the second conveying line, the fourth conveying line extends along a conveying direction of the first conveying line, the third conveying line is arranged along the second direction to transport the circuit board on the second conveying line to the fourth conveying line, and the first direction and the second direction forms an angle.
8 . The horizontal electroplating production line according to claim 7 , wherein the flipping device further comprises a second material pushing mechanism and a second positioning mechanism, the second positioning mechanism is arranged at the fourth conveying line to position the circuit board to a preset position, the second material pushing mechanism is configured to push the circuit board along the first conveying line, the second conveying line, the third conveying line and the fourth conveying line in sequence, push the circuit board positioned by the second positioning mechanism to the horizontal electroplating apparatus, and adjust the spacing between two adjacent circuit boards positioned by the second positioning mechanism and arranged along the first direction.
9 . The horizontal electroplating production line according to claim 1 , wherein the horizontal electroplating conveying device further comprises a clamping mechanism and an electroplating conveying mechanism, a rail is arranged at the first frame in a horizontal direction, the clamping mechanism comprises a sliding member and a clamping member connected to each other, the clamping member is arranged at the electroplating conveying mechanism to clamp the circuit board, the sliding member is slidably connected to the rail, and the electroplating conveying mechanism is configured to drive the clamping mechanism to move along the rail to convey the circuit board.
10 . The horizontal electroplating production line according to claim 9 , wherein the clamping member comprises: a fixing clamp; a movable clamp movably mounted at the fixing clamp through a connecting assembly, wherein the movable clamp is configured to cooperate with the fixing clamp to clamp the circuit board; and a lifting support wheel arranged at a side of the movable clamp away from the fixing clamp, wherein, when the clamping mechanism moves through the electroplating conveying mechanism, the lifting support wheel ascends or descends to open or close the movable clamp and the fixing clamp.
11 . The horizontal electroplating production line according to claim 10 , wherein: the horizontal electroplating conveying device further comprises a guide assembly arranged at the first frame, the guide assembly comprises a first guide member and a second guide member, the first guide member is located at a path of the clamping mechanism for loading, the second guide member is located at a path of the clamping mechanism for unloading, and both the first guide member and the second guide member have a guide slope; on the path of the clamping mechanism for loading, when the guide slope is configured to guide the movement of the clamping mechanism and abut against the lifting support wheel, a spacing between the fixing clamp and the movable clamp is increased, in order to allow the circuit board to be clamped; and on the path of the clamping mechanism for unloading, when the guide slope is configured to guide the movement of the clamping mechanism and abut against the lifting support wheel, the spacing between the fixing clamp and the movable clamp is increased, in order to allow the circuit board to be released.
12 . The horizontal electroplating production line according to claim 9 , wherein the electroplating conveying mechanism comprises: a conveying steel belt slidably arranged at the first frame, wherein the clamping mechanism is arranged at the conveying steel belt; a driving mechanism comprising a conveying driving wheel and a conveying driven wheel, wherein the conveying driving wheel and the conveying driven wheel are respectively arranged at two ends of the first frame, and the conveying driving wheel and the conveying driven wheel are connected through the conveying steel belt to form a closed-loop transmission to achieve continuous conveying; and a tensioning mechanism elastically connected to the conveying steel belt and the first frame, wherein, when the conveying steel belt slides on the first frame, the tensioning mechanism undergoes elastic deformation to change a horizontal spacing between the first frame and the conveying steel belt to tension the conveying steel belt.
13 . The horizontal electroplating production line according to claim 12 , wherein the horizontal electroplating apparatus further comprises a cathode conductive clamp reverse stripping device comprising a deplating tank and a stripping assembly, the deplating tank is arranged at the first frame, the conveying steel belt is configured to convey the clamping mechanism into the deplating tank, so that the clamping mechanism and the stripping assembly form a conductive loop to strip an electroplating material on the clamping mechanism.
14 . The horizontal electroplating production line according to claim 9 , wherein: the horizontal electroplating apparatus further comprises a conductive device comprising: a conductive oil groove assembly provided with a conductive oil; a cathode assembly connected with an anode of a power supply to generate a current; a conductive slider assembly configured in the clamping mechanism, wherein the conductive slider assembly is arranged in the conductive oil groove assembly and submerged in the conductive oil, the conductive slider assembly is electrically connected to the cathode assembly to transmit the current to the horizontal electroplating fixture, so that the circuit board on the horizontal electroplating fixture is charged; and a re-circulating mechanism comprising an oil collecting groove and a re-circulating assembly, wherein the oil collecting groove is configured to store the conductive oil, the conductive oil groove assembly is connected to the oil collecting groove through the re-circulating assembly to form a circulation path, allowing the conductive oil in the oil collecting groove to circulate with the conductive oil in the conductive oil groove assembly.
15 . The horizontal electroplating production line according to claim 14 , wherein the conductive device further comprises an oil supply mechanism, the re-circulating mechanism further comprises an overflow assembly, the oil supply mechanism is connected to the conductive oil groove assembly to provide the conductive oil to the conductive oil groove assembly, the overflow assembly has an overflow port, the overflow assembly is connected to the conductive oil groove assembly through the overflow port, the conductive oil groove assembly is connected to the oil collecting groove through the overflow assembly, the conductive oil groove assembly has a preset volume, when an liquid volume in the conductive oil groove assembly exceeds the preset volume, the conductive oil in the conductive oil groove assembly flows into the oil collecting groove through the overflow assembly.
16 . The horizontal electroplating production line according to claim 1 , wherein the horizontal electroplating apparatus further comprises an anode spray device arranged in the electroplating tank, the anode spray device comprises: an anode mesh well plate; an anode mesh detachably mounted at the anode mesh well plate; a spray assembly mounted at a side of the anode mesh away from the anode mesh well plate; and a conductive assembly, wherein the anode mesh is connected to a rectifier through the conductive assembly.
17 . The horizontal electroplating production line according to claim 16 , wherein at least two sets of the anode spray devices are mounted at intervals in the electroplating tank, spray sides of the two sets of the anode spray devices are arranged oppositely, and an electroplating cavity for accommodating the circuit board for electroplating is formed between any two sets of the anode spray devices arranged oppositely.
18 . The horizontal electroplating production line according to claim 17 , wherein the anode mesh well plate comprises: a well plate body provided with a plurality of meshes and a plurality of first spray holes, wherein each of the meshes is arranged in a hexagonal shape, the meshes are arranged in a honeycomb array at the well plate body, a plurality of first spray holes are arranged at intervals at the well plate body, and the well plate body has a spray side facing the circuit board and spraying the circuit board; and a guide wheel mounted at the spray side of the well plate body and configured to abut against the circuit board.
19 . The horizontal electroplating production line according to claim 1 , further comprising: a copper dissolving device comprising: a copper dissolving tank provided with a divider plate, wherein the divider plate divides the copper dissolving tank into a first tank body and a second tank body, the first tank body has a liquid inlet for a reaction solution to enter, and a copper particle basket for placing a pure copper; an upper portion of the divider plate has an overflow portion that connects the first tank body with the second tank body; the second tank body is provided with an overflow port for an outflow of the electroplating solution; a conveying pipeline connecting the second tank body with the first tank body, so that the first tank body, the overflow portion, the second tank body and the conveying pipeline are connected to form an internal circulation loop; and an overflow mechanism mounted at the overflow port and configured to convey the liquid in the second tank body to the electroplating tank.
20 . The horizontal electroplating production line according to claim 1 , further comprising: a board washing device arranged at an entrance of the electroplating tank and located between the circuit board feeding device and the electroplating tank, and/or the board washing device arranged at an exit of the electroplating tank; and a board drying device arranged at the exit of the electroplating tank and located at a side of the board washing device away from the electroplating tank, so as to remove water from the circuit board after electroplating and cleaning by the board washing device.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to Chinese Patent Application No. 202411560895.4, filed on Nov. 4, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD The present application relates to the technical field of circuit board electroplating, and in particular to a horizontal electroplating production line. BACKGROUND Conventional circuit board electroplating, whether using a gantry line or a vertical continuous electroplating (VCP), employs a vertical electroplating method. In this process, the circuit board is clamped vertically by a fixture and submerged in a chemical. A device with a vibrating function is used to agitate the circuit board, allowing the chemical to flow through the interconnection holes of the circuit board, and electroplating is formed under the conductive effect of the chemical. Electroplating equipment of this type requires a large footprint, with loading and unloading operations performed by robotic arms. The manufacturing cost is high, and the precision of the electroplating is relatively low, which cannot meet the requirements for high-precision electroplating. SUMMARY The main objective of the present application is to provide a horizontal electroplating production line, which aims to solve the problems of high manufacturing cost and poor electroplating accuracy in conventional electroplating apparatus. In order to achieve the above objective, the present application provides a horizontal electroplating production line, including: a horizontal electroplating apparatus including a first frame, an electroplating tank and a horizontal electroplating conveying device arranged at the first frame, wherein two ends of the electroplating tank are respectively provided with an inlet and an outlet, and the horizontal electroplating conveying device is configured to drive a circuit board to move from the inlet into the electroplating tank towards the outlet; anda circuit board feeding device arranged at one end of the electroplating tank close to the inlet, wherein the circuit board feeding device includes a second frame and a feeding conveying mechanism arranged at the second frame, the feeding conveying mechanism is configured to place the circuit board horizontally and convey the circuit board along a first direction, so that the circuit board entering the electroplating tank remains horizontal and moves to the horizontal electroplating conveying device. In an embodiment, the circuit board feeding device further includes a first positioning mechanism and a first material pushing mechanism, the first positioning mechanism is configured to position the circuit board on the feeding conveying mechanism to a preset position, the first material pushing mechanism is configured to drive the circuit board on the feeding conveying mechanism to move in the first direction, so that adjusting a spacing between two adjacent circuit boards that are positioned by the first positioning mechanism and are arranged along the first direction. In an embodiment, the first material pushing mechanism is configured to push the circuit board positioned by the first positioning mechanism to move in the first direction, so that a spacing between the pushed circuit board and the previous circuit board positioned by the first positioning mechanism is a preset value L, and an actual spacing between the two circuit boards is D, where L−1.5 mm≤D≤L+1.5 mm. In an embodiment, the horizontal electroplating production line includes a flipping device and two horizontal electroplating apparatuses, the flipping device is arranged between the two horizontal electroplating apparatuses to flip and convey the circuit board that has been electroplated in one of the horizontal electroplating apparatuses to the other horizontal electroplating apparatus, so that the horizontal electroplating conveying device of the two horizontal electroplating apparatus respectively grip opposite sides of the circuit board. In an embodiment, the flipping device includes a third frame, a feeding mechanism and a flipping mechanism arranged at the third frame, the feeding mechanism is configured to place the circuit board horizontally, and the flipping mechanism is configured to flip the circuit board on the feeding mechanism. In an embodiment, the flipping mechanism includes a driving assembly, a rotating shaft and a clamping assembly, the clamping assembly is arranged at the rotating shaft, the rotating shaft is drivingly connected to the driving assembly, the clamping assembly is provided with a slot for inserting the circuit board, and the driving assembly is configured to drive the rotating shaft to rotate, so that the clamping assembly drives the circuit board to flip. In an embodiment, the feeding mechanism includes a first conveying line, a second conveying line, a third conveying line and a fourth conveying line, the first conveying line and the second conveying line transpo