US-20260126162-A1 - LED LIGHTING DEVICE

US20260126162A1US 20260126162 A1US20260126162 A1US 20260126162A1US-20260126162-A1

Abstract

An LED lighting device includes a power supplier, a flexible board and a plurality of light sources. The flexible board is electrically connected to the power supplier, and includes a substrate and a laminated structure. The laminated structure is disposed on the first surface of the substrate and includes a transparent ink layer and a first protective layer. The transparent ink layer is disposed on the first protective layer. The light sources are disposed on the laminated structure and electrically connected to the flexible board.

Inventors

FUXING LU
RONGTU LIU
Huibao Luo
Zehu Dai
Liangliang Cao
Chunming Liu
Dejia Li

Assignees

XIAMEN PVTECH CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20260107
Priority Date: 20250107

Claims (19)

1 . A light-emitting diode (LED) lighting device, comprising: a power supplier; a flexible board electrically connected to the power supplier, and comprising a substrate and a laminated structure, wherein the laminated structure is disposed on a first surface of the substrate and comprising a transparent ink layer and a first protective layer, and the transparent ink layer is disposed on the first protective layer; and a plurality of light sources disposed on the laminated structure and electrically connected to the flexible board.
2 . The LED lighting device as claimed in claim 1 , wherein the first protective layer is an ink layer.
3 . The LED lighting device as claimed in claim 1 , wherein the first protective layer is a cover film, and the cover film comprises a bottom plate, a first adhesive layer, and an ink layer, wherein the first adhesive layer is disposed on the bottom plate, and the ink layer is disposed on the first adhesive layer.
4 . The LED lighting device as claimed in claim 1 , further comprising a reinforcing structure disposed on a second surface of the substrate.
5 . The LED lighting device as claimed in claim 4 , wherein the reinforcing structure partially covers the second surface of the substrate.
6 . The LED lighting device as claimed in claim 4 , wherein the reinforcing structure includes a backing adhesive disposed on the second surface of the substrate.
7 . The LED lighting device as claimed in claim 4 , wherein the reinforcing structure comprises a backing adhesive, a second protective layer, and a second adhesive layer, wherein the backing adhesive is disposed on the second protective layer, the second protective layer is disposed on the second adhesive layer, and the second adhesive layer is disposed on the second surface of the substrate.
8 . The LED lighting device as claimed in claim 7 , wherein the second protective layer is an ink layer.
9 . The LED lighting device as claimed in claim 1 , wherein the first protective layer comprises an opening and two sub protection layers, and the sub protective layer are disposed on two sides of the opening respectively.
10 . The LED lighting device as claimed in claim 9 , wherein the opening comprises a front section, a rear section and a connecting section, and the front section is connected to the rear section via the connecting section, and the sub protective layers are disposed on two sides of the connecting section respectively.
11 . The LED lighting device as claimed in claim 10 , wherein a projection of any one of the light sources on the first protective layer is located within the connecting section.
12 . The LED lighting device as claimed in claim 10 , further comprising two end caps and a light cover, wherein the flexible board is disposed in the light cover, and the two end caps are disposed at two ends of the light cover respectively, and the power supplier is disposed in one of the end caps.
13 . The LED lighting device as claimed in claim 10 , wherein a surface of the light cover is enclosed by an optical film comprising a transparent portion and a non-transparent portion, and the non-transparent portion is adjacent to the circuit board, whereby a rear surface of the flexible board is covered by the non-transparent portion.
14 . The LED lighting device as claimed in claim 12 , wherein the flexible board comprises a front soldering section, a rear soldering section and a circuit section, wherein the front soldering section is electrically connected to the rear soldering section via the circuit section, and the front soldering section and the rear soldering section are electrically connected to the power supplier, wherein the light sources are electrically connected to the circuit section, and projections of the light sources on the flexible board are located within the connecting section.
15 . The LED lighting device as claimed in claim 14 , wherein the light sources are within the connecting section to serve as a light-emitting zone, and the light-emitting zone makes an inner space of the light cover forms an optical zone, whereby the optical zone simultaneously covers the light-emitting zone, the front soldering section and the rear soldering section.
16 . The LED lighting device as claimed in claim 10 , wherein the front section is connected to the rear section via the connecting section, whereby the opening is H-shaped.
17 . The LED lighting device as claimed in claim 10 , wherein the connecting section comprises a plurality of bending portions and a plurality of connecting portions connected to each other, and the bending portions and the connecting portions are arranged in an alternating order.
18 . The LED lighting device as claimed in claim 17 , wherein a shape of the bending portion is U-shaped or inverted U-shaped.
19 . The LED lighting device as claimed in claim 17 , wherein each of the bending portions comprises at least one vertical portion and a horizontal portion connected to each other and perpendicular to each other, and a width of the horizontal portion is greater than a width of the connecting portion.

Description

TECHNICAL FIELD The disclosure relates to a lighting device, in particular to an LED lighting device. BACKGROUND LED (light-emitting diode) light tubes have many advantages, such as high efficiency, low power consumption, long service life, etc., so LED light tubes have been comprehensively applied to various buildings. However, currently available LED light tubes still have many shortcomings to be overcome. For example, the circuit board (printed circuit) of a currently available LED light tube has a protective layer (ink) for providing the insulating function and protecting the traces on the circuit board. However, the protective layer usually has a lot of openings and a plurality of LEDs are disposed in these openings respectively (for instance, U.S. Pat. No. 10,670,197 adopts the protective layer having the above design). Therefore, the coating process of the protective layer is very complicated and the halogen elements of the protective layer tend to move to the soldering sections of the circuit board. Accordingly, the soldering sections are prone to be oxidized, and the conductivity and the soldering effect thereof may be influenced during the manufacturing process. The currently available LED light tubes do not have a proper optical structure design, so the overall light-emitting areas of these lighting devices are limited can be significantly increased. Therefore, the light efficiency of these LED lighting devices is low. Further, the circuit board of a currently available LED light tube are typically adhered to the inner surfaces of the light cover thereof via an adhesive material. However, this method tends to generate stress that may damage the circuit board, potentially causing the light tube to malfunction. As a result, the service life of the light tube is also reduced. Moreover, the traces of the adhesive material can affect the appearance of the light tube, compromising its overall aesthetics and negatively impacting the user experience. Moreover, the adhesive material may also affect the light efficacy of the light tube, resulting in a reduction in the overall performance of the light tube. Furthermore, currently available flexible printed circuit boards (FPCBs) have poor arc resistance, which significantly limits their applications and prevents them from meeting actual requirements. On the other hand, during the design of lighting devices (such as light tubes) that are compatible with electronic ballasts currently available on the market, it is necessary to place particular emphasis on evaluating safety under abnormal conditions occurring during operation of the electronic ballasts. Since most conventional lighting devices employ rigid printed circuit boards or flexible printed circuit boards as light source boards, and alternating current signals flow through the light source boards, the conductors (copper-clad traces) on these two types of circuit boards are prone to open circuits for various reasons or to spark generation due to scratching, which may ultimately lead to fire hazards. Accordingly, the safety of currently available circuit boards still requires improvement. In order to address the above issues, some lighting devices adopt metal printed circuit boards with flame-retardant properties or double-sided metal flexible printed circuit boards. Although such circuit boards can mitigate the above problems to a certain extent, they also significantly increase the cost of the lighting devices. SUMMARY One embodiment of the disclosure provides an LED lighting device, which includes a power supplier, a flexible board and a plurality of light sources. The flexible board is electrically connected to the power supplier, and includes a substrate and a laminated structure. The laminated structure is disposed on the first surface of the substrate and includes a transparent ink layer and a first protective layer. The transparent ink layer is disposed on the first protective layer. The light sources are disposed on the laminated structure and electrically connected to the flexible board. In one embodiment, the first protective layer is an ink layer. In one embodiment, the first protective layer is a cover film, and the cover film includes a bottom plate, a first adhesive layer, and an ink layer. The first adhesive layer is disposed on the bottom plate, and the ink layer is disposed on the first adhesive layer. As set forth above, the flexible board has a multifunctional laminated structure. The transparent ink layer of the laminated structure can effectively enhance the arc resistance of the flexible board and can further improve the appearance of the flexible board. In addition, the first protective layer of the laminated structure can effectively increase reflectivity and can further enhance insulation performance and solder resist performance. Accordingly, by virtue of the laminated structure described above, the performance of the flexible board can be significantly improved so as to meet a