US-20260126332-A1 - INTEGRATED TEMPERATURE AND PRESSURE SENSOR

US20260126332A1US 20260126332 A1US20260126332 A1US 20260126332A1US-20260126332-A1

Abstract

An integrated temperature and pressure sensor includes: a connector; a metal port with a cavity, wherein the open end of the cavity of the metal port is connected to the connector, and another end of the metal port is provided with a first channel and a second channel; a carrier part with an accommodation cavity, wherein the carrier part is provided in the cavity, and the bottom of the carrier part is provided with a third channel communicating with the second channel; a metal tube, wherein one end of the metal tube is located in the first channel, and anther end of the metal tube extends out of the first channel; a temperature sensing element arranged in the metal tube; and a pressure sensing element arranged in the accommodation cavity, wherein the pressure sensing element is located on the third channel; and a circuit board.

Inventors

Jiangtao SUN
Wenhui HONG

Assignees

CHUROD SENSING TECHNOLOGIES (SUZHOU) CO., LTD

Dates

Publication Date: 20260507
Application Date: 20251219
Priority Date: 20240105

Claims (11)

1 . An integrated temperature and pressure sensor, comprising: a connector; a metal port with a cavity; a carrier part with an accommodation cavity; a metal tube; a temperature sensing element provided in the metal tube; a pressure sensing element provided in the accommodation cavity; and a circuit board provided in the cavity, wherein an open end of the cavity of the metal port is connected to the connector, and an opposite end of the metal port is provided with a first channel and a second channel, the first channel and the second channel are in communication with the cavity and independent of each other; the carrier part is provided in the cavity, a bottom of the carrier part is provided with a third channel communicating with the second channel, and the third channel is in communication with the accommodation cavity; one end of the metal tube is located in the first channel, and the other end of the metal tube extends out of the first channel; the pressure sensing element is located on the third channel; one end of the circuit board is electrically connected to the connector, the other end of the circuit board is electrically connected to the temperature sensing element and the pressure sensing element, and an electrical connection route between the temperature sensing element and the circuit board passes through the first channel and then penetrates the carrier part; and an end surface of the carrier part that cooperates with a bottom of the cavity is provided with a first groove and a second groove, the second groove is located on a periphery of the first groove, the first groove and the second groove are provided on a bottom wall of the carrier part or the bottom of the cavity, a first sealing ring and a second sealing ring are respectively provided in the first groove and the second groove, and the second channel is located between the first groove and the second groove.
2 . The integrated temperature and pressure sensor according to claim 1 , wherein a gap is reserved on the end surface of the carrier part that interfaces with a bottom of the metal port cavity, the gap is located between the first groove and the second groove, and the gap is in communication with the second channel and the third channel.
3 . The integrated temperature and pressure sensor according to claim 1 , wherein a positioning post extends from the bottom wall of the carrier part, and the positioning post is at least partially located in the first channel.
4 . The integrated temperature and pressure sensor according to claim 3 , wherein the first sealing ring is positioned adjacent to or spaced apart from the positioning post on the side close to the first channel.
5 . The integrated temperature and pressure sensor according to claim 1 , wherein the accommodation cavity groove is provided with a third groove and a fourth groove, the fourth groove is located on the periphery of the third groove, a third sealing ring is provided in the fourth groove, and the third groove is in communication with the third channel.
6 . The integrated temperature and pressure sensor according to claim 5 , wherein the pressure sensing element is located on the third sealing ring, and the circuit board is located on the pressure sensing element.
7 . The integrated temperature and pressure sensor according to claim 1 , wherein a flange is provided on an outer wall of the metal tube, a stepped notch is provided at one end of the first channel away from the cavity, and the stepped notch and the flange form a sealing surface.
8 . The integrated temperature and pressure sensor according to claim 1 , wherein the temperature sensing element is connected to the circuit board through a first conductor, one end of the first conductor is located in the first channel, and another end of the first conductor penetrates the carrier part and passes through a side wall of the accommodation cavity to be connected to the circuit board.
9 . The integrated temperature and pressure sensor according to claim 1 , wherein the connector is snap-connected to the carrier part, a clamping part is provided on an outer wall of the carrier part, a fastener is provided at the connector, and the fastener is clamped into the clamping part to form a snap connection.
10 . The integrated temperature and pressure sensor according to claim 9 , wherein the clamping part comprises a clamping groove and a clamping point provided on the outer side wall of the carrier part, the clamping point is located on an inner wall of the clamping groove, the fastener comprises a fastener rod and a fastener hook, the fastener rod extends into the clamping groove, and the fastener hook hooks the clamping point to form a snap connection.
11 . The integrated temperature and pressure sensor according to claim 1 , wherein the first channel is provided at a central position of the opposite end of the metal port, and the temperature sensing element is provided centrally relative to the metal port.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation application of International Application No. PCT/CN2024/096768, filed on May 31, 2024, which claims priority to Chinese Patent Application No. 202410020702.X, filed on January 5, 2024. The disclosures of the above-mentioned applications are incorporated herein by reference in their entireties. TECHNICAL FIELD The present application relates to the technical field of sensors, and in particular to an integrated temperature and pressure sensor. BACKGROUND With the popularization of new energy vehicles and the continuously rising expectations for driving range, and the power consumption of thermal management systems has become particularly important. In the thermal management system of new energy vehicles, accurate control of the opening degree of an electromagnetic expansion valve requires timely measurement of the medium pressure and temperature before and after the valve. In the related art, the thermistor of a temperature-pressure sensor is exposed to the medium. The thermistor directly contacting the medium can significantly improve the temperature response time. However, this design reduces the sensor’s reliability. At the same time, since the detected pipeline inevitably contains conductive fibers (such as residual fibers of metal parts, iron filings, etc.), their circulation in the medium is likely to cause a short circuit in the temperature signal. For existing products where the thermistor is wrapped, they generally face the problem of how to transmit the temperature signal through the pressure-sensing unit to the electrical processing unit. Currently, one approach is integral injection-molding of the thermistor and its carrier. This increases system costs, and the plastic casing hinders heat transfer between the medium and the sensitive head of the thermistor, leading to lower accuracy and longer response time of the temperature-pressure integrated sensor. Alternatively, the thermistor may be connected to a flexible circuit board that bypasses the pressure-sensing component via the side wall to reach the electrical processing unit. This approach complicates the process, increases production costs, but also reduces product reliability. In addition, most of the sensing channels of the integrated pressure and temperature sensors in the related art adopt an eccentric design, resulting in high manufacturing costs. The purpose of the present application is to overcome the defects of the related art and provide an integrated temperature and pressure sensor to solve the problems of high cost and low reliability of the integrated pressure and temperature sensors in the related art. To achieve the above and other objectives, the present application is implemented through the following technical solutions. The present application provides an integrated temperature and pressure sensor, including: a connector; a metal port with a cavity; a carrier part with an accommodation cavity; a metal tube; a temperature sensing element provided in the metal tube; a pressure sensing element provided in the accommodation cavity; and a circuit board provided in the cavity, wherein an open end of the cavity of the metal port is connected to the connector, and an opposite end of the metal port is provided with a first channel and a second channel, the first channel and the second channel are in communication with the cavity and independent of each other; the carrier part is provided in the cavity, a bottom of the carrier part is provided with a third channel communicating with the second channel, and the third channel is in communication with the accommodation cavity; one end of the metal tube is located in the first channel, and the other end of the metal tube extends out of the first channel; the pressure sensing element is located on the third channel; one end of the circuit board is electrically connected to the connector, the other end of the circuit board is electrically connected to the temperature sensing element and the pressure sensing element, and an electrical connection route between the temperature sensing element and the circuit board passes through the first channel and then penetrates the carrier part; and an end surface of the carrier part that cooperates with a bottom of the cavity is provided with a first groove and a second groove, the second groove is located on a periphery of the first groove, the first groove and the second groove are provided on a bottom wall of the carrier part or the bottom of the cavity, a first sealing ring and a second sealing ring are respectively provided in the first groove and the second groove, and the second channel is located between the first groove and the second groove. In an embodiment, a gap is reserved on the end surface of the carrier part that interfaces with a bottom of the metal port cavity, the gap is located between the first groove and the second groove, and the gap is in communication wit