US-20260126360-A1 - SEMICONDUCTOR PACKAGE WORKPRESS MODULE HAVING MULTIPLE PRESSING BLOCKS AND SEMICONDUCTOR PACKAGE TESTING APPARATUS

US20260126360A1US 20260126360 A1US20260126360 A1US 20260126360A1US-20260126360-A1

Abstract

A semiconductor package workpress module having pressing blocks is provided. The semiconductor package workpress module includes a base and a plurality of movable pressing blocks. The base includes an internal chamber and a plurality of open slots. The open slots are in communication with the internal chamber. The movable pressing blocks are accommodated in the open slots of the base. The movable pressing blocks correspond to different regions on the semiconductor package. In response to that the internal chamber is filled with high-pressure fluid, the movable pressing blocks generate a pressing force toward the regions. A semiconductor package testing apparatus is also provided. A controller is configured to control the fluid supply unit to supply the high-pressure fluid for the internal chamber of the base and configured to perform a test on the semiconductor package through a testing stage.

Inventors

Meng-Kung Lu
Chien-Ming Chen

Assignees

CHROMA ATE INC.

Dates

Publication Date: 20260507
Application Date: 20250624
Priority Date: 20241106

Claims (20)

1 . A semiconductor package workpress module having pressing blocks, wherein the semiconductor package workpress module having pressing blocks is adapted to test a semiconductor package, a surface of the semiconductor package includes a plurality of regions, and the semiconductor package workpress module having pressing blocks includes: a base having at least one internal chamber and a plurality of open slots, wherein the open slots are in communication with the at least one internal chamber; and a plurality of movable pressing blocks respectively accommodated in the open slots of the base; wherein the movable pressing blocks respectively correspond to the regions on the semiconductor package; in response to that the at least one internal chamber is filled with at least one high pressure fluid, the movable pressing blocks respectively generate a pressing force toward the regions.
2 . The semiconductor package workpress module having pressing blocks according to claim 1 , wherein the base further includes a fixed pressing block corresponding to a die among a plurality of dies on the semiconductor package.
3 . The semiconductor package workpress module having pressing blocks according to claim 1 , wherein the at least one internal chamber includes a first chamber and a second chamber, the open slots include a first open slot and a second open slot, the at least one high pressure fluid includes a first high pressure fluid and a second high pressure fluid; the first open slot is in communication with the first chamber, the second open slot is in communication with the second chamber; and in response to that the first chamber and the second chamber are respectively filled with the first high pressure fluid and the second high pressure fluid, the movable pressing blocks generate a plurality of pressing forces toward the regions.
4 . The semiconductor package workpress module having pressing blocks according to claim 3 , wherein pressures of the first high pressure fluid and the second high pressure fluid are different.
5 . The semiconductor package workpress module having pressing blocks according to claim 3 , wherein temperatures of the first high pressure fluid and the second high pressure fluid are different.
6 . The semiconductor package workpress module having pressing blocks according to claim 1 , wherein the base includes an upper housing, a lower housing, and a sealing member, the at least one internal chamber is at the upper housing, the open slots are at the lower housing; the lower housing is provided with an annular slot surrounding the at least one internal chamber, and the sealing member is accommodated in the annular slot.
7 . The semiconductor package workpress module having pressing blocks according to claim 1 , wherein the base includes an upper housing, a lower housing, and a diaphragm, the at least one internal chamber is at the upper housing, the open slots are at the lower housing; and the diaphragm is between the upper housing and the lower housing.
8 . The semiconductor package workpress module having pressing blocks according to claim 1 , further including at least one sack accommodated in the at least one internal chamber; wherein, in response to that the at least one sack in the at least one internal chamber is filled with the at least one high pressure fluid, the movable pressing blocks respectively generate the pressing force toward the regions.
9 . The semiconductor package workpress module having pressing blocks according to claim 1 , wherein each of the open slots includes a radial extension portion and an axial penetration portion, each of the movable pressing blocks includes a radial flange and an axial body; the axial body penetrates through the axial penetration portion, and the radial extension portion is configured to stop the radial flange.
10 . A semiconductor package testing apparatus including: the semiconductor package workpress module having pressing blocks according to claim 1 ; a fluid supply unit in communication with the at least one internal chamber; a testing stage corresponding to the semiconductor package workpress module having pressing blocks and configured to accommodate a semiconductor package; and a controller electrically connected to the fluid supply unit and the testing stage; wherein the controller is configured to control the fluid supply unit to supply the at least one high pressure fluid to the at least one internal chamber of the semiconductor package workpress module having pressing blocks and configured to perform a test on the semiconductor package through the testing stage.
11 . The semiconductor package testing apparatus according to claim 10 , further including a displacement generation device electrically connected to the controller; wherein the base of the semiconductor package workpress module having pressing blocks is connected to the displacement generation device; and the controller is configured to control the displacement generation device so that the semiconductor package workpress module having pressing blocks moves toward or moves away from the testing stage.
12 . The semiconductor package testing apparatus according to claim 10 , wherein the fluid supply unit includes a valve and a high pressure fluid source; the high pressure fluid source is in communication with the at least one internal chamber, the valve is disposed between the high pressure fluid source and the at least one internal chamber and electrically connected to the controller; and the controller turns the valve on or off to control whether the high pressure fluid source supplies the at least one high pressure fluid to the at least one internal chamber.
13 . The semiconductor package testing apparatus according to claim 10 , further including a fluid temperature control unit; wherein the fluid temperature control unit is disposed between the high pressure fluid source and the at least one internal chamber and electrically connected to the controller; and the controller controls the fluid temperature control unit to adjust a temperature of the at least one high pressure fluid supplied to the at least one internal chamber.
14 . The semiconductor package testing apparatus according to claim 10 , further including a workpress module temperature control unit; wherein the workpress module temperature control unit is disposed in the base and in at least one of the movable pressing blocks and electrically connected to the controller; and the controller controls the workpress module temperature control unit to adjust temperatures of the base and the at least one of the movable pressing blocks.
15 . The semiconductor package testing apparatus according to claim 10 , further including a testing stage temperature control unit; wherein the testing stage temperature control unit is electrically connected to the controller; and the controller controls the testing stage temperature control unit to adjust a temperature of the testing stage.
16 . A semiconductor package workpress module having pressing blocks, where in the semiconductor package workpress module is configured to test a semiconductor package, a surface of the semiconductor package includes a plurality of regions, and the semiconductor package workpress module having pressing blocks includes: a base having at least one internal chamber and a plurality of open slots, wherein the open slots are in communication with the at least one internal chamber; a plurality of movable pressing blocks respectively accommodated in the open slots of the base; and at least one elastic member accommodated in the at least one internal chamber and corresponding to the open slots; wherein the movable pressing blocks respectively correspond to the regions on the semiconductor package; and in response to that at least one of the movable pressing blocks receives an external force and abuts the at least one elastic member, the at least one elastic member drives at least one of the movable pressing blocks toward at least one of the regions generate a pressing force.
17 . The semiconductor package workpress module having pressing blocks according to claim 16 , wherein the at least one internal chamber includes a plurality of internal chambers; the at least one elastic member includes a plurality of elastic members; and the elastic members are respectively accommodated in the internal chambers and respectively correspond to the open slots.
18 . The semiconductor package workpress module having pressing blocks according to claim 16 , wherein the at least one elastic member is at least one selected from the group consisting of a spring, a rubber and a shape-memory alloy.
19 . The semiconductor package workpress module having pressing blocks according to claim 16 , wherein the at least one elastic member includes a sack, and the sack is filled with a high-pressure fluid.
20 . The semiconductor package workpress module having pressing blocks according to claim 19 , wherein a material of the sack is at least one selected from the group consisting of nylon, polyurethane, polyvinyl chloride, thermoplastic polyurethane, rubber, polyethylene, and silicone.

Description

CROSS-REFERENCE TO RELATED APPLICATION This non-provisional application claims priority under 35 U.S.C. § 119(a) to Patent Application No. 113142618 filed in Taiwan, R.O.C. on Nov. 6, 2024, the entire contents of which are hereby incorporated by reference. BACKGROUND Technical Field The instant disclosure relates to a semiconductor package testing apparatus and in particular to a semiconductor package workpress module having pressing blocks. Related Art In a semiconductor packaging element testing technology known to the inventor, a single workpress is usually adopted to perform testing. The main purpose of the workpress is to apply a pressing force to the semiconductor package to ensure proper electrical connection between a packaging element and a test probe, thereby maintaining validity of the test. However, as the semiconductor packaging technology rapidly develops, the single-workpress manner has become insufficient to meet the demands of next-generation technologies, in particular in the 3D packaging application field. Such advanced packaging can arrange a plurality of dies (such as a CPU, a GPU, a SOC, a logic die, or a high bandwidth memory) on an upper surface of the package, resulting in more complex packaging structure. Moreover, due to different conditions regarding areas, thicknesses and required forces for these dies, testing accuracy and apparatus are required to meet higher standards. Therefore, a testing apparatus known to the inventor that relies on a single workpress has become unsuitable for such advanced semiconductor packaging. Since the single workpress known to the inventor may not be able to contact each of the dies sufficiently and may struggle to apply appropriate pressing forces to all of the dies, an issue of inconsistent distribution of pressure may occur during a pressing test, and issues of regional overpressure or underpressure can occur easily, resulting in regional poor contact, or warpage or deformation can even occur on the entire semiconductor package. Ultimately, stability of packaging and accuracy of test results may be influenced. SUMMARY In view of the above, an embodiment of the instant disclosure provides a semiconductor package workpress module having pressing blocks and a semiconductor package testing apparatus. Pressing forces can be applied to a plurality of regions on the semiconductor package at the same time, to ensure full electrical contact between the dies and probes of a testing stage and prevent deformation from occurring to the dies. In some embodiments, a semiconductor package workpress module having pressing blocks is disclosed. The semiconductor package workpress module having pressing blocks includes a base and a plurality of movable pressing blocks. The base includes at least one internal chamber and a plurality of open slots. The open slots are in communication with the at least one internal chamber. The movable pressing blocks are respectively accommodated in the open slots of the base. The movable pressing blocks respectively correspond to different regions on the semiconductor package. In response to that the at least one internal chamber is filled with at least one high-pressure fluid, the movable pressing blocks respectively generate pressing forces toward the regions. The regions may include certain regions on a substrate of the semiconductor package, dies on the substrate, and certain regions on the dies. In some embodiments, the semiconductor package testing apparatus includes the aforementioned semiconductor package workpress module having pressing blocks, a fluid supply unit, a testing stage, and a controller. The fluid supply unit is in communication with the at least one internal chamber. The testing stage corresponds to the semiconductor package workpress module having pressing blocks and is configured to accommodate the semiconductor package. The controller is electrically connected to the fluid supply unit and the testing stage. The controller is configured to control the fluid supply unit to supply the high-pressure fluid for the at least one internal chamber of the semiconductor package workpress module having pressing blocks and is configured to perform testing on the semiconductor package through the testing stage. In some embodiments, the semiconductor package workpress module having pressing blocks is configured to test a semiconductor package. The surface of the semiconductor package includes a plurality of regions. The semiconductor package workpress module having pressing blocks includes a base, a plurality of movable pressing blocks, and at least one elastic member. The base includes at least one internal chamber and a plurality of open slots. The open slots are in communication with the at least one internal chamber. The movable pressing blocks are respectively accommodated in the open slots of the base. The at least one elastic member is accommodated in the at least one internal chamber and corresponds to the open slot