US-20260126416-A1 - ULTRASONIC PROBE, POSITIONING ASSISTANCE JIG, AND PREPARATION METHOD FOR ULTRASONIC PROBE

US20260126416A1US 20260126416 A1US20260126416 A1US 20260126416A1US-20260126416-A1

Abstract

In an ultrasonic probe, a first cutting groove and a second cutting groove of a matching layer are correspondingly arranged and communicated to form piezoelectric spacers, enabling a piezoelectric layer to form multiple piezoelectric units spaced apart from each other, namely the piezoelectric units are formed by means of secondary cutting. In the matching layer of the ultrasonic probe prepared by the preparation method, the piezoelectric spacer between two adjacent piezoelectric units is formed by performing secondary cutting in opposite directions. The ratio between the width of such formed piezoelectric units and the thickness of the piezoelectric layer can reach 1/60 to 1/4.

Inventors

Zhiqi LIU
Ailun Li

Assignees

KRINWAVE TECHNOLOGY (ZHUHAI) CO.,LTD.

Dates

Publication Date: 20260507
Application Date: 20251229
Priority Date: 20231108

Claims (17)

1 . An ultrasonic probe, comprising: a backing layer, a piezoelectric layer, a matching layer, and an acoustic lens bonded sequentially from bottom to top, two opposite side surfaces of the piezoelectric layer respectively being a first surface and a second surface, wherein a plurality of first cutting grooves are formed in the first surface, a cutting direction of the plurality of first cutting grooves facing the second surface from the first surface along a thickness direction of the piezoelectric layer; wherein a plurality of second cutting grooves are formed in the second surface, a cutting direction of the plurality of second cutting grooves facing the first surface from the second surface along the thickness direction of the piezoelectric layer; wherein a cutting width of the plurality of first cutting grooves is the same as a cutting width of the plurality of second cutting grooves, the plurality of first cutting grooves and the plurality of second cutting grooves being formed in a one-to-one correspondence manner; wherein each of the plurality of first cutting grooves and each of the plurality of second cutting grooves are communicated to form a piezoelectric spacing, such that a plurality of spaced piezoelectric subunits are formed in the piezoelectric layer, and a space between two adjacent piezoelectric subunits is the piezoelectric spacing; and wherein a ratio of a width of each piezoelectric subunit to a thickness of the piezoelectric layer is 1/60-1/4.
2 . The ultrasonic probe according to claim 1 , wherein a center frequency of the ultrasonic probe is 0.5 MHz-2 MHz.
3 . The ultrasonic probe according to claim 1 , wherein a wavelength of an acoustic wave of the ultrasonic probe propagated in the piezoelectric layer is M, and the width of each piezoelectric subunit is 1/60λ 1 -½λ 1 .
4 . The ultrasonic probe according to claim 1 , wherein a wavelength of an acoustic wave of the ultrasonic probe propagated in the piezoelectric layer is λ 1 , and a width of the piezoelectric layer is ¼λ 1 -30λ 1 .
5 . The ultrasonic probe according to claim 1 , wherein a wavelength of an acoustic wave of the ultrasonic probe propagated in the piezoelectric layer is λ 1 , and the thickness of the piezoelectric layer is ⅛λ 1 -1λ 1 .
6 . The ultrasonic probe according to claim 1 , wherein the matching layer is formed by one or more layers arranged in a stacked manner in respective thickness directions thereof.
7 . The ultrasonic probe according to claim 1 , wherein a wavelength of an acoustic wave of the ultrasonic probe propagated in the matching layer is λ 2 , and a thickness of the matching layer is ⅛λ 2 -½λ 2 .
8 . The ultrasonic probe according to claim 1 , wherein a thickness of the matching layer is ⅙λ 2 -½λ 2 .
9 . The ultrasonic probe according to claim 1 , wherein the piezoelectric layer is made of one of a lead zirconate titanate (PZT) piezoelectric ceramic or a piezoelectric single crystal, or made of the PZT piezoelectric ceramic and the piezoelectric single crystal, as bases, and a polymer material.
10 . The ultrasonic probe according to claim 1 , wherein one or more the backing layer is formed by one or more layers arranged in a stacked manner in respective thickness directions thereof.
11 . A positioning assistance jig, used for preparing an ultrasonic probe, wherein the positioning assistance jig comprises a positioning plate and at least two positioning posts disposed on the positioning plate, the at least two positioning posts being fixed in position on the positioning plate, wherein the ultrasonic probe comprises a backing layer, a piezoelectric layer, a matching layer, and an acoustic lens bonded sequentially from bottom to top, two opposite side surfaces of the piezoelectric layer respectively being a first surface and a second surface; wherein a plurality of first cutting grooves are formed in the first surface, a cutting direction of the plurality of first cutting grooves facing the second surface from the first surface along a thickness direction of the piezoelectric layer; wherein a plurality of second cutting grooves are formed in the second surface, a cutting direction of the plurality of second cutting grooves facing the first surface from the second surface along the thickness direction of the piezoelectric layer; wherein a cutting width of the plurality of first cutting grooves is the same as a cutting width of the plurality of second cutting grooves, the plurality of first cutting grooves and the plurality of second cutting grooves being formed in a one-to-one correspondence manner; wherein each of the plurality of first cutting grooves and each of the plurality of second cutting grooves are communicated to form a piezoelectric spacing, such that a plurality of spaced piezoelectric subunits are formed in the piezoelectric layer, and a space between two adjacent piezoelectric subunits is the piezoelectric spacing; and wherein a ratio of a width of each piezoelectric subunit to a thickness of the piezoelectric layer is 1/60-1/4.
12 . A preparation method for an ultrasonic probe, configured to prepare the ultrasonic probe, wherein the method comprises the following steps: piezoelectric plate positioning: providing a piezoelectric plate and a positioning assistance jig, wherein the positioning assistance jig comprises a positioning plate and at least two positioning posts disposed on the positioning plate, the at least two positioning posts being fixed in position on the positioning plate, and wherein positioning holes are formed in the piezoelectric plate; sleeving the piezoelectric plate on the at least two positioning posts through the positioning holes, causing the piezoelectric plate to be positioned on the positioning plate; first cutting: positioning the piezoelectric plate and the positioning assistance jig on a cutting platform, selecting, by a cutting equipment, a set cutting position relative to the positioning plate to cut a first surface of the piezoelectric plate to form a plurality of first cutting grooves, and then connecting backing layers to the first surface of the piezoelectric plate; and second cutting: selecting, by the cutting equipment, the set cutting position relative to the positioning plate to cut a second surface of the piezoelectric plate, the second surface and the first surface of the piezoelectric plate being disposed opposite to each other to form a plurality of second cutting grooves on the second surface, wherein a cutting position in the first cutting and a cutting position in the second cutting are both set positions relative to the positioning plate, causing each of cutting marks of the plurality of second cutting grooves to be aligned with and communicate with a corresponding cutting mark of the plurality of first cutting grooves to form an integral cutting groove, so as to prepare a piezoelectric layer.
13 . The method according to claim 12 , wherein in the step of first cutting, a depth cut by the cutting equipment on the first surface of the piezoelectric plate is not less than a half of a thickness of the piezoelectric plate.
14 . The method according to claim 12 , wherein in the step of piezoelectric plate positioning, a flexible film is provided, and the flexible film is bonded to the second surface of the piezoelectric plate.
15 . The method according to claim 14 , wherein a wavelength of an acoustic wave of the ultrasonic probe propagated in the piezoelectric layer is λ 1 , and a thickness of the flexible film is less than or equal to 1/20λ 1 .
16 . The method according to claim 12 , wherein after the second cutting is completed, a matching layer is then connected to the second surface of the piezoelectric layer, and then an acoustic lens is connected to a surface of the matching layer, such that the ultrasonic probe is prepared.
17 . The method according to claim 12 , wherein after the first cutting is completed, a matching sheet is connected to the second surface of the piezoelectric layer; wherein in the step of second cutting, the cutting equipment selects the set cutting position relative to the positioning plate to cut the second surface of the piezoelectric plate and the matching sheet to form the plurality of second cutting grooves in the second surface, and the matching sheet forms a plurality of spaced matching subunits, such that a matching layer is prepared; and wherein an acoustic lens is connected to a surface of the matching sheet, such that the ultrasonic probe is prepared.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS The present application is a continuation of International Application of PCT/CN2024/130503, filed Nov. 7, 2024, which claims priority to Chinese Patent Application 202311482847.3, filed Nov. 8, 2023, the entire disclosures of which are hereby incorporated herein by reference. TECHNICAL FIELD The present application relates to the technical field of medical devices, and in particular to, an ultrasonic probe, a positioning assistance jig, and a preparation method for the ultrasonic probe. BACKGROUND An ultrasonic probe, as a core component of an ultrasonic diagnostic device, is a device that emits ultrasonic waves into an interior of a detected object and receives ultrasonic echo signals reflected from corresponding parts. The ultrasonic diagnostic device converts the echo signals into images through a series of signal processing, and displays the images on the display device of the diagnostic device. The core part of the ultrasonic probe is an ultrasonic transducer. A piezoelectric element in the ultrasonic transducer can convert electrical pulse excitation into ultrasonic waves and can convert the corresponding reflected echo waves in the detected object into electrical signals. The ultrasonic transducer usually further includes one or more matching layers disposed at a front end of the piezoelectric element layer, and configured to match acoustic impedance between the detected object and the piezoelectric element. The ultrasonic transducer further includes an acoustic lens disposed between the matching layers and the detected object, and configured to form acoustic beam focusing in a short axis direction. The ultrasonic transducer further includes a backing layer disposed at a rear end of the piezoelectric element layer, and configured to absorb reverse acoustic waves. The ultrasonic transducer further includes structures such as an electrode and a circuit configured to transfer signals. For the ultrasonic probe, the center frequency is a basic acoustic parameter. The ultrasonic probe is usually used on the ultrasonic diagnostic device, and the center frequency of the ultrasonic probe is 2 MHz-20 MHz. When the ultrasonic probe is used for diagnosis in blood vessels, the frequency of the ultrasonic probe may reach 50 MHz-100 MHz. SUMMARY There are an ultrasonic probe, a positioning assistance jig, and a preparation method for the ultrasonic probe according to embodiments of the present application. The technical solution is as below: According to a first aspect of embodiments of the present application, there is provided an ultrasonic probe, including a backing layer, a piezoelectric layer, a matching layer, and an acoustic lens bonded sequentially from bottom to top, two opposite side surfaces of the piezoelectric layer respectively being a first surface and a second surface, wherein a plurality of first cutting grooves are formed in the first surface, a cutting direction of the first cutting grooves facing the second surface from the first surface along a thickness direction of the piezoelectric layer; a plurality of second cutting grooves are formed in the second surface, a cutting direction of the second cutting grooves facing the first surface from the second surface along the thickness direction of the piezoelectric layer;a cutting width of the first cutting grooves is the same as a cutting width of the second cutting grooves, the plurality of first cutting grooves and the plurality of second cutting grooves being formed in a one-to-one correspondence manner; the corresponding first cutting grooves and second cutting grooves are connected to form piezoelectric spacings, such that a plurality of spaced piezoelectric subunits are formed in the piezoelectric layer, and a space between two adjacent piezoelectric subunits is the piezoelectric spacing;where a ratio of a width of the piezoelectric subunits to a thickness of the piezoelectric layer is 1/60-1/4. According to a second aspect of embodiments of the present application, there is provided a positioning assistance jig, used for preparing the ultrasonic probe, where the positioning assistance jig includes a positioning plate and at least two positioning posts disposed on the positioning plate, the positioning posts being fixed in position on the positioning plate. According to a third aspect of embodiments of the present application, there is provided a preparation method for an ultrasonic probe, used for preparing the ultrasonic probe, where the method includes the following steps: piezoelectric plate positioning: providing a piezoelectric plate and a positioning assistance jig, where the positioning assistance jig includes a positioning plate and at least two positioning posts disposed on the positioning plate, the positioning posts being fixed in position on the positioning plate; positioning holes being formed in the piezoelectric plate; sleeving the piezoelectric plate on the positioning posts through the