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US-20260126564-A1 - CORE-SHELL COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE SAME, PHOTOSENSITIVE RESIN LAYER, COLOR FILTER AND CMOS IMAGE SENSOR

US20260126564A1US 20260126564 A1US20260126564 A1US 20260126564A1US-20260126564-A1

Abstract

A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a core represented by Chemical Formula 1 and a shell surrounding the core, the shell being represented by Chemical Formula 2:

Inventors

  • Heejo Moon
  • Baek Soung Park
  • Kwangwon SEO
  • Ickjin KIM
  • Subin Park

Assignees

  • SAMSUNG SDI CO., LTD.

Dates

Publication Date
20260507
Application Date
20250606
Priority Date
20241101

Claims (15)

  1. 1 . A core-shell compound, comprising a core represented by Chemical Formula 1 and a shell surrounding the core, the shell being represented by Chemical Formula 2: wherein, in Chemical Formula 1 and Chemical Formula 2, R 1 is a thermosetting group, R 2 and R 3 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group, L 1 and L 6 are each independently a substituted or unsubstituted C1 to C10 alkylene group or a group represented by Chemical Formula L, provided that at least one of L 1 and L 6 is a group represented by Chemical Formula L, L 2 , L 4 , L a , and L b are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group, L 3 is a single bond or an ester group represented by *—C(═O)O—* or *—OC(═O)—*, L 5 is a single bond or a substituted or unsubstituted C1 to C10 alkylene group, and n is an integer greater than or equal to 2, wherein, in Chemical Formula L, L 7 is a substituted or unsubstituted C1 to C10 alkylene group, and m is an integer of 2 to 10.
  2. 2 . The core-shell compound as claimed in claim 1 , wherein the thermosetting group includes a substituted or unsubstituted epoxy group, a substituted or unsubstituted oxetane group, or a combination thereof.
  3. 3 . The core-shell compound as claimed in claim 1 , wherein: R 1 is a thermosetting group, R 2 and R 3 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L 1 and L 5 are each independently a substituted or unsubstituted C1 to C10 alkylene group, L 2 to L 4 are each independently a single bond, and L 6 is a group represented by Chemical Formula L.
  4. 4 . The core-shell compound as claimed in claim 1 , wherein: R 1 is a thermosetting group, R 2 and R 3 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L 1 is a group represented by Chemical Formula L, L 2 , L 4 , and L 6 are each independently a substituted or unsubstituted C1 to C10 alkylene group, L 3 is an ester group represented by *—C(═O)O—* or *—OC(═O)—*, and L 5 is a single bond or a substituted or unsubstituted C1 to C10 alkylene group.
  5. 5 . The core-shell compound as claimed in claim 1 , wherein: R 1 is a thermosetting group, R 2 and R 3 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L 1 and L 6 are each independently a group represented by Chemical Formula L, L 2 and L 4 are each independently a substituted or unsubstituted C1 to C10 alkylene group, L 3 is an ester group represented by *—C(═O)O—* or *—OC(═O)—*, and L 5 is a substituted or unsubstituted C1 to C10 alkylene group.
  6. 6 . The core-shell compound as claimed in claim 1 , wherein the core represented by Chemical Formula 1 has a maximum absorption wavelength at about 610 nm to about 640 nm.
  7. 7 . The core-shell compound as claimed in claim 1 , wherein the shell represented by Chemical Formula 2 is represented by Chemical Formula 2-1:
  8. 8 . The core-shell compound as claimed in claim 1 , wherein the core-shell compound is represented by one of Chemical Formula A to Chemical Formula C:
  9. 9 . The core-shell compound as claimed in claim 1 , wherein the core-shell compound is a green dye.
  10. 10 . A photosensitive resin composition comprising the core-shell compound as claimed in claim 1 .
  11. 11 . The photosensitive resin composition as claimed in claim 10 , further including a binder resin, a photopolymerizable monomer, a photopolymerization initiator, a pigment, or a solvent.
  12. 12 . The photosensitive resin composition as claimed in claim 10 , wherein the photosensitive resin composition is used for a CMOS image sensor.
  13. 13 . A photosensitive resin layer manufactured using the photosensitive resin composition as claimed in claim 10 .
  14. 14 . A color filter comprising the photosensitive resin layer as claimed in claim 13 .
  15. 15 . A CMOS image sensor comprising the color filter as claimed in claim 14 .

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0153668 filed at the Korean Intellectual Property Office on Nov. 1, 2024, the entire contents of which are incorporated herein by reference. BACKGROUND 1. Field Embodiments relate to a core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter. 2. Description of the Related Art With the recent rapid development of advanced information and communication processing technology and overall electronics industry, a next generation detector rapidly transmitting and receiving a large amount of information and the development of a new concept device and system have been considered. With the rise of video processing and the like in mobile devices, technology development of an ultra-down-sized and ultra-power-saving image sensor is rapidly accelerated, centering on existing CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor). An image sensor, which is a semiconductor that converts photons into electrons and displays them on a display or stores them in a storage device, may include a light receiving element that converts light signals into electrical signals, a pixel circuit portion that amplifies and compresses the converted electrical signals, and an ASIC portion that converts these pre-treated analog signals into digital signals to treat image signals and for example, includes CCD, CMOS, CIS (Contact Image Sensor), and the like. The CCD and CMOS image sensors use the same light-receiving element, but in the CCD image sensor, charges generated in the light-receiving element sequentially move through MOS capacitors connected in series and are converted into voltages in a source follower connected at the final end. In the CMOS image sensor, the charges are converted into voltages in a source follower built into each pixel and output to the outside. The CCD image sensor moves electrons generated by light as they are to an output unit by using a gate pulse, and the CMOS image sensor convert the electrons generated by light into voltages in each pixel and then output them through several CMOS switches. These image sensors are very widely applied from household products such as a digital camera and a mobile phone to an endoscope used in hospitals and a telescope used in a satellite orbiting the earth. SUMMARY The embodiments may be realized by providing a core-shell compound, including a core represented by Chemical Formula 1 and a shell surrounding the core, the shell being represented by Chemical Formula 2: wherein, in Chemical Formula 1 and Chemical Formula 2, R1 is a thermosetting group, R2 and R3 are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group, L1 and L6 are each independently a substituted or unsubstituted C1 to C10 alkylene group or a group represented by Chemical Formula L, provided that at least one of L1 and L6 is a group represented by Chemical Formula L, L2, L4, La, and Lb are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group, L3 is a single bond or an ester group represented by *—C(═O)O—* or *—OC(═O)—*, L5 is a single bond or a substituted or unsubstituted C1 to C10 alkylene group, and n is an integer greater than or equal to 2, wherein, in Chemical Formula L, L7 is a substituted or unsubstituted C1 to C10 alkylene group, and m is an integer of 2 to 10. The thermosetting group may include a substituted or unsubstituted epoxy group, a substituted or unsubstituted oxetane group, or a combination thereof. R1 may be a thermosetting group, R2 and R3 may each independently be a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L1 and L5 may each independently be a substituted or unsubstituted C1 to C10 alkylene group, L2 to L4 may each independently be a single bond, and L6 may be a group represented by Chemical Formula L. R1 may be a thermosetting group, R2 and R3 may each independently be a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L1 may be a group represented by Chemical Formula L, L2, L4, and L6 may each independently be a substituted or unsubstituted C1 to C10 alkylene group, L3 may be an ester group represented by *—C(═O)O—* or *—OC(═O)—*, and L5 may be a single bond or a substituted or unsubstituted C1 to C10 alkylene group. R1 may be a thermosetting group, R2 and R3 may each independently be a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L1 and L6 may each independently be a group represented by Chemical Formula L, L2 and L4 may each independently be a substituted or unsubstituted C1 to C10 alkylene group, L3 may be an ester gr