US-20260126586-A1 - PACKAGE DEVICES AND METHODS OF MANUFACTURE

Abstract

A device is provided that includes: a photonic integrated circuit; a laser die comprising a welding pad; and a first optical fiber including: a first end of the first optical fiber fused to a surface of the photonic integrated circuit, wherein a first fusion bond exists between the first end of the first optical fiber and the surface of the photonic integrated circuit; and a second end of the first optical fiber fused to the welding pad, wherein a second fusion bond exists between the second end of the first optical cable and the welding pad.

Inventors

• Tung-Liang Shao
• Yu-Sheng Huang
• Chen-Hua Yu

Assignees

• TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Dates

Publication Date

20260507

Application Date

20251229

Claims (20)

1. 1 . A device comprising: a first optical fiber welded to a first integrated circuit device; and a second integrated circuit device comprising a first welding pad, the first optical fiber welded to the first welding pad.
2. 2 . The device of claim 1 , wherein the second integrated circuit device is a laser die.
3. 3 . The device of claim 1 , wherein the first welding pad comprises silicon oxide.
4. 4 . The device of claim 1 , wherein the first welding pad comprises aluminum oxide.
5. 5 . The device of claim 1 , wherein the first welding pad has a first width of between about 10 μm and about 300 μm.
6. 6 . The device of claim 5 , wherein the first welding pad has a first length of between about 10 μm and about 12,000 μm.
7. 7 . The device of claim 6 , wherein the first welding pad has a first thickness of between about 10 μm and about 1,000 μm.
8. 8 . A device comprising: a photonic integrated circuit bonded to a circuit board; a laser die bonded to the circuit board adjacent to the photonic integrated circuit, the laser die comprising a welding pad; and a first optical fiber welded to the photonic integrated circuit and welded to the welding pad.
9. 9 . The device of claim 8 , further comprising a groove structure bonded to the circuit board.
10. 10 . The device of claim 9 , further comprising a second optical fiber lying within a first groove of the groove structure.
11. 11 . The device of claim 10 , wherein the second optical fiber is aligned with an edge coupler of the photonic integrated circuit.
12. 12 . The device of claim 11 , wherein the first optical fiber is aligned with a grating coupler located within the photonic integrated circuit.
13. 13 . The device of claim 11 , wherein the second optical fiber is welded to the photonic integrated circuit.
14. 14 . The device of claim 13 , wherein there is no welding pad between the second optical fiber and the photonic integrated circuit.
15. 15 . A device comprising: a laser die comprising a welding pad; and a first optical fiber comprising a first end of the first optical fiber fused to the welding pad, wherein a first fusion bond exists between the first end of the first optical fiber and the welding pad.
16. 16 . The device of claim 15 , further comprising a first integrated circuit device adjacent to the laser die, the first integrated circuit device being welded to the first optical fiber.
17. 17 . The device of claim 16 , further comprising a circuit board wire bonded to the first integrated circuit device.
18. 18 . The device of claim 15 , further comprising a second optical fiber welded to the first integrated circuit device without a welding structure.
19. 19 . The device of claim 15 , further comprising an encapsulant fully encapsulating the first optical fiber.
20. 20 . The device of claim 15 , wherein the first optical fiber has a cladding layer with a thickness of between about 40 μm and about 190 μm.

Description

PRIORITY AND CROSS-REFERENCE This application is a continuation U.S. patent application Ser. No. 18/323,523, filed on May 25, 2023, which application is hereby incorporated by reference. BACKGROUND Electrical signaling and processing are one technique for signal transmission and processing. Optical signaling and processing have been used in increasingly more applications in recent years, particularly due to the use of optical fiber-related applications for signal transmission. Optical signaling and processing are typically combined with electrical signaling and processing to provide full-fledged applications. For example, optical fibers may be used for long-range signal transmission, and electrical signals may be used for short-range signal transmission as well as processing and controlling. Accordingly, devices integrating long-range optical components and short-range electrical components are formed for the conversion between optical signals and electrical signals, as well as the processing of optical signals and electrical signals. Packages thus may include both optical (photonic) dies including optical devices and electronic dies including electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. FIG. 1 illustrates a formation an photonic integrated circuit (PIC) package, in accordance with some embodiments. FIG. 2 illustrates attaching the PIC package to a substrate, in accordance with some embodiments. FIG. 3 illustrates attaching various semiconductor and optical components to the substrate and the formation of an optical welding pad, in accordance with some embodiments. FIG. 4 illustrates laser welding processes utilized in attaching a first optical cable to the PIC package and an adjacent optical component, in accordance with some embodiments. FIG. 5 illustrates an attachment of a tapered optical cable to the PIC package and a disposing of the tapered optical cable over a support structure, in accordance with some embodiments. FIG. 6 illustrates that attachment of a conductive wire to the PIC package and to the substrate, in accordance with some embodiments. FIG. 7 illustrates the encapsulation of the various semiconductor and optical components on the substrate in a molding compound, in accordance with some embodiments. DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. Embodiments will now be discussed with respect to certain embodiments in which various optical fibers (e.g., optical cables) may be attached to various optical components utilizing a laser welding process. The laser welding process may be utilized to fuse the various optical fibers to the various optical components without the use of glue or other adhesives. However, the embodiments presented herein are intended to be illustrative and are not intended to limit the embodiments to the precise descriptions as discussed. Rather, the embodiments discussed may be incorporated into a wide variety of implementations, and all such implementations are fully intended to be included within the scope of the embodiments. With reference now to FIG. 1, there is illustrate