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US-20260126645-A1 - OPTICAL PACKAGE

US20260126645A1US 20260126645 A1US20260126645 A1US 20260126645A1US-20260126645-A1

Abstract

An optical package is provided. The optical package includes a first optical device and an optical guiding structure. The first optical device is disposed over a carrier. The optical guiding structure is disposed over the carrier and configured to adjust a first optical transmission path of the first optical device.

Inventors

  • Mei-Ju Lu
  • Chi-han Chen
  • JR-Wei LIN
  • Pei-Jung Yang

Assignees

  • ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Dates

Publication Date
20260507
Application Date
20251231

Claims (20)

  1. 1 . An optical package, comprising: a photonic component including a waveguide; a first optical device supported by the photonic component and configured to receive a first optical signal from the photonic component; and a second optical device supported by the photonic component and configured to optically couple to the waveguide.
  2. 2 . The optical package of claim 1 , wherein the first optical device is optically coupled to the waveguide.
  3. 3 . The optical package of claim 2 , wherein the first optical device comprises an optical phased array configured to emit a second optical signal.
  4. 4 . The optical package of claim 1 , further comprising a cover disposed over the photonic component.
  5. 5 . The optical package of claim 4 , further comprising a carrier supporting the photonic component and the cover.
  6. 6 . The optical package of claim 5 , further comprising an electronic component supported by the carrier and electrically connected to the photonic component.
  7. 7 . The optical package of claim 1 , further comprising a carrier supporting the photonic component, wherein the carrier has an opening penetrating the carrier.
  8. 8 . The optical package of claim 7 , wherein the opening is configured to allow a third optical signal to transmit therethrough.
  9. 9 . The optical package of claim 2 , further comprising an optical element, wherein the optical element overlaps with an opening in a vertical direction, and wherein the optical element is disposed over the first optical device.
  10. 10 . The optical package of claim 9 , wherein the optical element is spaced apart from the first optical device.
  11. 11 . The optical package of claim 1 , wherein the second optical device comprises a laser diode.
  12. 12 . The optical package of claim 3 , further comprising a cover disposed over the photonic component and a carrier supporting the photonic component and the cover, wherein the cover and the carrier collectively define an air space between the cover and the photonic component.
  13. 13 . The optical package of claim 12 , wherein the optical phased array is configured to emit the second optical signal, and the second optical signal is configured to be transmitted through the air space to reach a reflective surface.
  14. 14 . An optical package, comprising: a first optical device configured to transmit an optical signal; a second optical device configured to receive an optical signal reflected by a reflective surface; wherein, in a cross-sectional view, the reflective surface is located at a different horizontal level from a surface of the first optical device and a surface of the second optical device.
  15. 15 . The optical package of claim 14 , further comprising a carrier supporting the first optical device and the second optical device.
  16. 16 . The optical package of claim 14 , further comprising an electronic component supporting the second optical device, wherein the electronic component includes a conductive via electrically connected to the second optical device.
  17. 17 . The optical package of claim 14 , further comprising at least one conductive structure under the second optical device.
  18. 18 . An optical package, comprising: a plurality of optical devices each having a surface, wherein the plurality of optical devices are configured to receive an optical signal reflected by a reflective surface; wherein, in a cross-sectional view, the reflective surface is located at a different horizontal level from the surfaces of the plurality of optical devices.
  19. 19 . The optical package of claim 18 , further comprising a carrier supporting the plurality of optical devices, and further comprising a cover disposed over the plurality of optical devices, wherein the cover and the carrier collectively define an air space.
  20. 20 . The optical package of claim 19 , wherein the air space is connected to an external environment through one or more openings of the cover.

Description

CROSS REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser. No. 18/127,622, filed Mar. 28, 2023, the content of which is incorporated herein by reference in its entirety. BACKGROUND 1. Technical Field The present disclosure relates generally to an optical package. 2. Description of the Related Art Silicon photonics and optical engines with integration of at least an electronic IC (EIC) and a photonic IC (PIC) have advantages of high transmission speed and low power loss and thus are applied in various areas. Such integrated device or package requires transmission of optical signals between PICs. SUMMARY In one or more arrangements, an optical package includes a first optical device and an optical guiding structure. The first optical device is disposed over a carrier. The optical guiding structure is disposed over the carrier and configured to adjust a first optical transmission path of the first optical device. In one or more arrangements, an optical package includes a first optical device, a second optical device, and an optical reflective surface. The optical reflective surface is configured to transmit a first optical signal to the first optical device and a second optical signal to the second optical device. In one or more arrangements, an optical package includes a first optical device and an optical guiding structure. The first optical device is exposed to an air space. The optical guiding structure is configured to adjust at least one optical path starting from the first optical device and passing through the air space. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawings. It is noted that various features may not be drawn to scale, and the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. FIG. 1 is a cross-section of an optical package in accordance with some arrangements of the present disclosure. FIG. 1A is a perspective view of an optical package in accordance with some arrangements of the present disclosure. FIG. 1B is a perspective view of an optical package in accordance with some arrangements of the present disclosure. FIG. 2A is a cross-section of an optical package in accordance with some arrangements of the present disclosure. FIG. 2B is a perspective view of an optical package in accordance with some arrangements of the present disclosure. FIG. 3A is a cross-section of an optical device of an optical package in accordance with some arrangements of the present disclosure. FIG. 3B is a cross-section of an optical device of an optical package in accordance with some arrangements of the present disclosure. FIG. 3C is a top view of an optical device of an optical package in accordance with some arrangements of the present disclosure. FIG. 4A is a cross-section of an optical device of an optical package in accordance with some arrangements of the present disclosure. FIG. 4B is a cross-section of an optical device of an optical package in accordance with some arrangements of the present disclosure. FIG. 5A is a cross-section of an optical device of an optical package in accordance with some arrangements of the present disclosure. FIG. 5B is a cross-section of an optical device of an optical package in accordance with some arrangements of the present disclosure. FIG. 5C is a cross-section of an optical device of an optical package in accordance with some arrangements of the present disclosure. FIG. 6A is a cross-section of an optical device of an optical package in accordance with some arrangements of the present disclosure. FIG. 6B is a cross-section of an optical device of an optical package in accordance with some arrangements of the present disclosure. Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar elements. The present disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings. DETAILED DESCRIPTION FIG. 1 is a cross-section of an optical package 1 in accordance with some arrangements of the present disclosure. The optical package 1 may include a carrier 100, two or more optical devices (e.g., optical devices 11, 12, 13, and 14), and an optical guiding structure 20. The carrier 100 may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass-fiber-based copper foil laminate. The carrier 100 may include an interconnection structure, which may include such as a plurality of conductive traces and/or a plurality of conductive vias. The interconnection structure may include a redistribution layer (RDL) and/or a grounding element. In some arrangements, the carrier 100 includes a ceramic material or a metal plate. In some arrangements, the carrier 100 may