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US-20260126838-A1 - COOLING MODULE

US20260126838A1US 20260126838 A1US20260126838 A1US 20260126838A1US-20260126838-A1

Abstract

A cooling module comprising a casing that defines a first internal volume. The casing comprises a first internal major surface and a second internal major surface, wherein the first internal volume is defined between the first internal major surface and the second internal major surface. The cooling module further comprises a chamber that defines a second internal volume in fluid communication with the first internal volume. At least one of the first internal major surface and the second internal major surface comprises a first cavity, and at least one of the first internal major surface and the second internal major surface further comprises a first channel connecting the first cavity to the second internal volume. The chamber extends from a region in a corner of the casing.

Inventors

  • Neil Edmunds
  • John Charlesworth

Assignees

  • Iceotope Group Limited

Dates

Publication Date
20260507
Application Date
20251229
Priority Date
20191224

Claims (20)

  1. 1 . A cooling module comprising: a casing defining a first internal volume, the casing comprising: a first internal major surface, and a second internal major surface, wherein the first internal volume is defined between the first internal major surface and the second internal major surface; and a chamber defining a second internal volume in fluid communication with the first internal volume; wherein: at least one of the first internal major surface and the second internal major surface comprises a first cavity; and at least one of the first internal major surface and the second internal major surface further comprises a first channel connecting the first cavity to the second internal volume; the chamber extends from a region in a corner of the casing.
  2. 2 . The cooling module according to claim 1 , further comprising a printed circuit board mounted in the first internal volume.
  3. 3 . The cooling module according to claim 1 , wherein the cooling module comprises a liquid coolant and ullage air, and wherein the second internal volume accommodates the ullage air.
  4. 4 . The cooling module according to claim 1 , wherein at least one of the first internal major surface and the second internal major surface further comprises a second cavity and a second channel connecting the second cavity to the first cavity.
  5. 5 . The cooling module according to claim 4 , wherein the at least one of the first internal major surface and the second internal major surface further comprises one or more additional cavities and one or more additional channels connecting each of the one or more additional cavities to at least one other cavity or to the second internal volume.
  6. 6 . The cooling module according to claim 1 , wherein: the casing comprises a first external major surface; and the chamber extends from a corner of the first external major surface.
  7. 7 . The cooling module according to claim 6 , wherein the chamber extends generally perpendicularly from the first external major surface.
  8. 8 . The cooling module according to claim 1 , wherein the chamber comprises a substantially triangular cross-section.
  9. 9 . The cooling module according to claim 1 , further comprising one or more projections extending from an external surface of the casing.
  10. 10 . The cooling module according to claim 9 , wherein: the casing comprises a first external major surface; the chamber extends from a corner of the first external major surface; and the one or more projections extend from the first external major surface.
  11. 11 . The cooling module according to claim 1 , wherein the printed circuit board is a computer motherboard.
  12. 12 . The cooling module according to claim 1 , further comprising: a lid having the first internal major surface; and a base having the second internal major surface, wherein the second internal major surface opposes the first internal major surface.
  13. 13 . The cooling module according to claim 12 , wherein the lid and the base are joined to form a fluid-tight seal.
  14. 14 . The cooling module according to claim 13 , wherein: the lid and the base further comprise one or more sealing gaskets facilitating the fluid-tight seal when the lid and the base are joined.
  15. 15 . The cooling module according to claim 13 , further comprising: one or more electronic components mounted upon a printed circuit board.
  16. 16 . The cooling module according to claim 15 , wherein the one or more electronic components are immersed in a liquid coolant.
  17. 17 . The cooling module according to claim 15 , wherein the one or more electronic components comprise at least: a first electronic component that extends into the first cavity.
  18. 18 . The cooling module according to claim 17 , wherein a liquid coolant travels from the second internal volume to the first cavity, via the first channel, to cool the first electronic component.
  19. 19 . The cooling module according to claim 17 , wherein the first electronic component is thermally coupled to a thermal interface material.
  20. 20 . The cooling module according to claim 19 , wherein the thermal interface material is disposed within the first cavity and the first electronic component extends into the first cavity.

Description

TECHNICAL FIELD The disclosure concerns a cooling module, in particular a cooling module for a printed circuit board having one or more heat generating components. BACKGROUND Many types of electrical/electronic component generate heat during operation. In particular, electrical computer components such as motherboards, central processing units (CPUs), graphical processing units (GPUs), memory modules, hard disks, and power supply units (PSUs) may dissipate substantial amounts of heat when in use. Heating of the electrical components to high temperatures can cause damage, affect performance, or cause a safety hazard. Accordingly, substantial efforts have been undertaken to find efficient, high performance systems for cooling electrical components effectively and safely. One type of cooling system uses liquid cooling. Although different liquid cooling assemblies have been demonstrated, in general the electrical components are immersed in a coolant liquid so as to provide a large surface area for heat exchange between the heat generating electrical components and the coolant. International patent publication number WO-A-2010/130993 and US-A-2010/0290190(commonly assigned with this invention) describe a cooling device that uses a sealable module for containing one or more heat generating electronic components, together with a liquid coolant in which the electronic components are immersed. Immersion of the electronic components in a fluid (liquid and/or gas) that carries heat away from the electronic components can be thermodynamically-efficient. The coolant may be thermally conductive whilst being electrically non-conductive and may further have advantageous convective properties. Moreover, the coolant can be selected and used so as not to cause damage to the electronic components in normal operation. Nevertheless, the coolant could cause damage elsewhere, for example due to toxicity, corrosion or other reactive, physical, or chemical properties. For these reasons, and since the coolant may be costly, it is desirably contained and typically sealed within a casing (a tank or container). This is done so that the electronic components are immersed in the coolant, but without the coolant being lost or otherwise exposed outside the tank. Furthermore, when filling the casing with the coolant, there may additionally be a volume of ullage air. The ullage air may be advantageous to the system. Both the liquid coolant and the ullage air may expand through being heated by the electronic components; however, the ullage air may be more compressible than the liquid coolant, and therefore the ullage air may act to mitigate pressure increases in the system. It is desirable to distance the ullage air from the electronic components, so that the electronic components are immersed in the coolant to ensure they may be cooled effectively. SUMMARY Against this background, there is provided a cooling module for a printed circuit board having one or more heat generating components in accordance with claim 1. Further features of the invention are detailed in the dependent claims and herein. Features of a method corresponding with those of the cooling module may additionally be provided. According to the present disclosure, there is provided a cooling module for a printed circuit board having one or more heat generating components, the cooling module comprising: a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface; and a chamber defining a second internal volume in fluid communication with the first internal volume; wherein the first and/or second internal major surface comprises a first cavity; and the first and/or second internal major surface further comprises a first channel connecting the first cavity to the second internal volume. Optionally, the cooling module further comprises a printed circuit board mounted in the first internal volume. Optionally, the cooling module comprises a liquid coolant and ullage air, wherein the second internal volume accommodates the ullage air. Optionally, the first and/or second internal major surface further comprises a second cavity and a second channel connecting the second cavity to the first cavity. Optionally, the first and/or second internal major surface further comprises one or more additional cavities and one or more additional channels connecting each of the one or more additional cavities to at least one other cavity or to the second internal volume. Optionally, the chamber extends from the casing. Optionally, the chamber extends from a region in a corner of the casing. Optionally, the casing comprises a first external major surface, and the chamber extends from a corner of the first external major surface. Optionally, the chamber extends generally perpendicularly from the first external major surface. Optionally, the chamber comprises a substantially triangu