US-20260128206-A1 - MULTILAYER DEVICE AND SUBSTRATE MODULE

US20260128206A1US 20260128206 A1US20260128206 A1US 20260128206A1US-20260128206-A1

Abstract

A multilayer device includes a dielectric body, a signal line disposed inside the dielectric body, planar electrodes disposed inside the dielectric body and along a direction, lead-out electrodes disposed either inside the dielectric body or on an outer surface of the dielectric body, connecting electrodes disposed inside the dielectric body and connecting the planar electrodes to the lead-out electrodes, signal terminals connected to the signal line, and ground terminals connected to the lead-out electrodes and configured to have a ground potential. Plural structures each including one of the planar electrodes, one of the connecting electrodes, one of the lead-out electrodes, and one of the ground terminals are disconnected from one other and separated from one another inside the dielectric body and on the outer surface of the dielectric body.

Inventors

Tomohide Kamiyama
Yoshiyuki Saito

Assignees

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20231106
Priority Date: 20221110

Claims (13)

1 . A multilayer device, comprising: a dielectric body; a signal line disposed inside the dielectric body such that a part of the signal line is exposed from an outer surface of the dielectric body; a plurality of planar electrodes disposed inside the dielectric body and along a first direction; a plurality of lead-out electrodes disposed either inside the dielectric body or on the outer surface of the dielectric body, at least a part of the plurality of lead-out electrodes being exposed from the outer surface of the dielectric body; a plurality of connecting electrodes disposed inside the dielectric body and connecting the plurality of planar electrodes to the plurality of lead-out electrodes; a plurality of signal terminals disposed on the outer surface of the dielectric body and connected to the signal line; and a plurality of ground terminals disposed on the outer surface of the dielectric body and connected to the plurality of lead-out electrodes, the plurality of ground terminals being configured to have a ground potential, wherein the plurality of planar electrodes, the plurality of connecting electrodes, the plurality of lead-out electrodes, and the plurality of ground terminals constitute a plurality of structures, each of the plurality of structures includes a corresponding one planar electrode out of the plurality of planar electrodes, a corresponding one connecting electrode out of the plurality of connecting electrodes, a corresponding one lead-out electrode out of the plurality of lead-out electrodes, and a corresponding one ground terminal out of the plurality of ground terminals, and the plurality of structures are disconnected from one another and separated from one another both inside the dielectric body and on the outer surface of the dielectric body.
2 . The multilayer device according to claim 1 , wherein the plurality of planar electrodes are connected in one-to-one correspondence to the plurality of connecting electrodes, such that each of the plurality of planar electrodes is connected to a corresponding one of the plurality of connecting electrodes, the plurality of connecting electrodes are connected in one-to-one correspondence to the plurality of lead-out electrodes, such that each of the plurality of connecting electrodes is a corresponding one of the plurality of lead-out electrodes, and the plurality of lead-out electrodes are connected in one-to-one correspondence to the plurality of ground terminals, such that each of the plurality of lead-out electrodes is connected a corresponding one of the plurality of ground terminals.
3 . The multilayer device according to claim 1 , wherein the plurality of lead-out electrodes are disposed inside the dielectric body such that a part of the plurality of lead-out electrodes is exposed from the outer surface of the dielectric body, and each of the plurality of ground terminals is connected to the part of the each of the plurality of lead-out electrodes, the part being exposed from the outer surface of the dielectric body.
4 . The multilayer device according to claim 1 , wherein the dielectric body has a bottom surface parallel to the plurality of planar electrodes, a top surface facing away from the bottom surface, and four side surfaces connected to the bottom surface and the top surface, and the plurality of ground terminals are disposed on two side surfaces out of the four side surfaces.
5 . The multilayer device according to claim 4 , wherein the two side surfaces face away from each other.
6 . The multilayer device according to claim 5 , wherein the plurality of lead-out electrodes extend from positions close to one side surface out of the two side surfaces toward another side surface out of the two side surfaces, and are connected to the plurality of ground terminals at the another side surface.
7 . The multilayer device according to claim 5 , wherein the two side surfaces are different from a side surface out of the four side surfaces which has the plurality of signal terminals is disposed thereon.
8 . The multilayer device according to claim 1 , wherein each of the plurality of connecting electrodes is a via conductor penetrating a portion of the dielectric body located between a corresponding one of the plurality of planar electrodes and a corresponding one of the plurality of lead-out electrodes.
9 . The multilayer device according to claim 8 , wherein the plurality of connecting electrodes do not overlap the signal line when viewed in a direction perpendicular to the plurality of planar electrodes, and each of the plurality of connecting electrodes overlaps an outer peripheral end portion of a corresponding one of the plurality of planar electrodes when viewed in the direction perpendicular to the plurality of planar electrodes.
10 . The multilayer device according to claim 1 , wherein the signal line includes two parallel lines disposed in the dielectric body.
11 . The multilayer device according to claim 10 , wherein the two parallel lines are differential lines configured to transmit differential signals.
12 . A multilayer device comprising: a dielectric body; a signal line disposed inside the dielectric body such that a part of the signal line is exposed from an outer surface of the dielectric body; a plurality of planar electrodes disposed inside the dielectric body and along a direction; a plurality of lead-out electrodes disposed either inside the dielectric body or on the outer surface of the dielectric body, at least a part of each of the plurality of lead-out electrodes being exposed from the outer surface of the dielectric body; a plurality of connecting electrodes disposed inside the dielectric body; a plurality of signal terminals disposed on the outer surface of the dielectric body and connected to the signal line; and a plurality of ground terminals disposed on the outer surface of the dielectric body and configured to have a ground potential, wherein the plurality of planar electrodes are connected in one-to-one correspondence to the plurality of connecting electrodes, the plurality of connecting electrodes are connected in one-to-one correspondence to the plurality of lead-out electrodes, and the plurality of lead-out electrodes are connected in one-to-one correspondence to the plurality of ground terminals.
13 . A substrate module comprising the multilayer device according to claim 1 .

Description

TECHNICAL FIELD The present disclosure relates to a multilayer device and a substrate module including the multilayer device. BACKGROUND ART Functional substrates configured to control passing characteristics of high-speed digital signals and high-frequency signals (hereinafter referred to as high-speed, high-frequency signals) have been know. As an example of these functional substrates, PTL 1 discloses a functional substrate including a conductor configured to function as a ground (ground electrode) and mushroom structures each including a conductive element (a planar electrode) and a through-via (a connecting electrode). The functional substrate has a structure in which the mushroom structures are periodically arranged, and can inhibit passing of signals of specific frequencies out of high-speed, high-frequency signals. CITATION LIST Patent Literature PTL 1: International Publication WO2011/111311 SUMMARY OF INVENTION However, although being capable of blocking passing of signals of particular frequencies out of high-speed, high-frequency signals, the conventional functional substrate does not provide a stopband that blocks passing of high-speed, high-frequency signals in accordance with requirements for a multilayer device. A multilayer device according to an aspect of the present disclosure includes a dielectric body, a signal line disposed inside the dielectric body such that a part of the signal line is exposed from an outer surface of the dielectric body, planar electrodes disposed inside the dielectric body and along a first direction, lead-out electrodes disposed either inside the dielectric body or on the outer surface of the dielectric body such that at least a part of the lead-out electrodes is exposed from the outer surface of the dielectric body, connecting electrodes disposed inside the dielectric body and connecting the planar electrodes to the lead-out electrodes, signal terminals disposed on the outer surface of the dielectric body and connected to the signal line, and ground terminals disposed on the outer surface of the dielectric body and connected to the lead-out electrodes such that the ground terminals are configured to have a ground potential. The planar electrodes, the connecting electrodes, the lead-out electrodes, and the ground terminals constitute structures. Each of the structures includes a corresponding one planar electrode out of the planar electrodes, a corresponding one connecting electrode out of the connecting electrodes, a corresponding one lead-out electrode out of the lead-out electrodes, and a corresponding one ground terminal out of the ground terminals. The structures are disconnected and separated from one another both inside the dielectric body and on the outer surface of the dielectric body. A multilayer device according to an aspect of the present disclosure includes a dielectric body, a signal line disposed inside the dielectric body such that a part of the signal line is exposed from an outer surface of the dielectric body, planar electrodes disposed inside the dielectric body and along a direction, lead-out electrodes disposed either inside the dielectric body or on the outer surface of the dielectric body such that at least a part of each of the lead-out electrodes is exposed from the outer surface of the dielectric body, connecting electrodes disposed inside the dielectric body, signal terminals disposed on the outer surface of the dielectric body and connected to the signal line, and ground terminals disposed on the outer surface of the dielectric body and configured to have a ground potential. The planar electrodes are connected in one-to-one correspondence to the connecting electrodes. The connecting electrodes are connected in one-to-one correspondence to the lead-out electrodes. The lead-out electrodes are connected in one-to-one correspondence to the ground terminals. A substrate module according to an aspect of the present disclosure includes the multilayer device described above. The multilayer devices according to the present disclosure provides a stopband in accordance with a requirement. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a perspective view of a multilayer device. FIG. 2 illustrates an equivalent circuit of the multilayer device shown in FIG. 1. FIG. 3 is a perspective view of a multilayer device according to Exemplary Embodiment 1. FIG. 4A illustrates a signal line, planar electrodes, connecting electrodes, and lead-out electrodes of the multilayer device according to Embodiment 1. FIG. 4B illustrates the signal line, the planar electrodes, the connecting electrodes, and the lead-out electrodes visually extracted from the multilayer device according to Embodiment 1. FIG. 5A is a plan view of the signal line and other parts of the multilayer device according to Embodiment 1 when viewed from above. FIG. 5B is a cross-sectional view of the multilayer device according to Embodiment 1 along line VB-VB shown in FIG. 5A. FIG. 5C is a bottom vie