US-20260128208-A1 - ELECTRONIC DEVICE

US20260128208A1US 20260128208 A1US20260128208 A1US 20260128208A1US-20260128208-A1

Abstract

An electronic device includes a blank body provided with an insulating material, a conductive coil located within the blank body, and a first terminal and a second terminal exposed out of a surface of the blank body. The blank body has a top surface, a bottom surface, a first side surface, a second side surface, a front surface, and a back surface. The top surface is parallel to the bottom surface, the first side surface is parallel to the second side surface, and the front surface is parallel to the back surface. A plane parallel to the top surface and the bottom surface, a plane parallel to the first side surface and the second side surface, and a plane parallel to the front surface and the back surface are perpendicular to each other.

Inventors

Zhongdong WU
Jieyong QIN
Lirui WANG

Assignees

SHENZHEN SUNLORD ELECTRONICS CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20251229

Claims (20)

1 . An electronic device, comprising a blank with an insulating material, a conductive coil within the blank, and a first terminal and a second terminal exposed to a surface of the blank, wherein the blank has a top surface, a bottom surface, a first lateral surface, a second lateral surface, a front surface and a back surface, the top surface is parallel to the bottom surface, the first lateral surface is parallel to the second lateral surface, the front surface is parallel to the back surface, and a plane parallel to the top surface and the bottom surface, a plane parallel to the first lateral surface and the second lateral surface, and a plane parallel to the front surface and the back surface are mutually perpendicular; a distance between the first lateral surface and the second lateral surface is 0.42 mm or less, a distance between the front surface and back surface is 0.22 mm or less, and a distance between the top surface and the bottom surface is 0.22 mm or less; and a thickness-to-width ratio of at least one electrode layer of the conductive coil is 0.5 or more, and a cross section of the at least one electrode layer has a width of at least 15 μm and at most 30 μm, and a thickness of at least 15 μm and at most 40 μm.
2 . The electronic device according to claim 1 , wherein the conductive coil has a plurality of electrode layers, an electrode layer of the conductive coil correspondingly connected to the first terminal is a lead-in layer electrode, an electrode layer of the conductive coil correspondingly connected to the second terminal is a lead-out layer electrode, an electrode layer of the conductive coil located between the lead-in layer electrode and the lead-out layer electrode is an intermediate layer electrode, and respective electrode layers are connected through conductive paths between layers.
3 . The electronic device according to claim 2 , wherein the thickness-to-width ratio of the at least one electrode layer is 0.6 or more.
4 . The electronic device according to claim 3 , wherein the thickness-to-width ratio of the at least one electrode layer is 2.0 or less.
5 . The electronic device according to claim 4 , wherein the thickness-to-width ratio of the at least one electrode layer is 1.0 or less.
6 . The electronic device according to claim 5 , wherein the cross section of the electrode layer of the conductive coil has a rectangular, trapezoidal, parallelogram or elliptical shape, and the thickness-to-width ratio of the electrode layer is a ratio of a maximum thickness of the cross section of the electrode layer to a maximum width of the cross section of the electrode layer.
7 . The electronic device according to claim 6 , wherein the electronic device is a laminated chip composite inductor device.
8 . The electronic device according to claim 7 , wherein the conductive coil is formed in a stack provided with a plurality of electrode layers, and the plurality of electrode layers form a spiral conductive coil by forming connections in a state of overlapping with each other when viewed from a stacking direction.
9 . The electronic device according to claim 8 , wherein the stacking direction is a direction perpendicular to the front surface and the back surface of the electronic device.
10 . The electronic device according to claim 9 , wherein a respective electrode layer of the plurality of electrode layers is provided perpendicular to the stacking direction.
11 . The electronic device according to claim 10 , wherein the first terminal comprises two portions perpendicular to each other, and the two portions of the first terminal are located on the first lateral surface and the bottom surface, respectively; and the second terminal comprises two portions perpendicular to each other, and the two portions of the second terminal are located on the second lateral surface and the bottom surface, respectively.
12 . The electronic device according to claim 2 , wherein the at least one electrode layer is an intermediate layer electrode.
13 . The electronic device according to claim 3 , wherein the at least one electrode layer is an intermediate layer electrode.
14 . The electronic device according to claim 4 , wherein the at least one electrode layer is an intermediate layer electrode.
15 . The electronic device according to claim 5 , wherein the at least one electrode layer is an intermediate layer electrode.
16 . The electronic device according to claim 6 , wherein the at least one electrode layer is an intermediate layer electrode.
17 . The electronic device according to claim 8 , wherein the at least one electrode layer is an intermediate layer electrode.
18 . The electronic device according to claim 9 , wherein the at least one electrode layer is an intermediate layer electrode.
19 . The electronic device according to claim 10 , wherein the at least one electrode layer is an intermediate layer electrode.
20 . The electronic device according to claim 11 , wherein the at least one electrode layer is an intermediate layer electrode.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Application No. PCT/CN2023/105107, filed on Jun. 30, 2023, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD The present application relates to the field of electronic component technology, and particularly, to an inductor component. BACKGROUND Inductors are common electronic components whose main function is to store and release magnetic energy. In modern electronic technology, inductors are widely used in various fields, such as communications, computers, automotive electronics, etc. However, in actual production, due to the limitations of manufacturing processes and materials, there are certain problems with the performance and stability of inductor products. Traditionally, in order to improve the magnetic conductivity and to reduce the DC resistance value in inductors, manufacturers usually choose to make breakthroughs in materials and use materials with high conductivity. However, this approach may lead to issues such as long development cycles and high costs for inductor products. The existing inductor coil has a thickness-to-width ratio (the ratio of the thickness to the width in the cross section) that ranges below 0.5, which may lead to poor performance of inductor products at high frequencies, and issues such as magnetic leakage, large fluctuations an instability in inductance and so on being prone to occur. It should be noted that the information disclosed in the above technical background section is only used for understanding the background of the present application, and therefore may include information that does not constitute prior art known to those ordinary skills in the art. SUMMARY Therefore, the object of the present application is to provide an electronic device capable of increasing the Q value and improving the stability of inductance value. To achieve the above object, the present application adopts the following technical solutions. An electronic device includes a blank with an insulating material, a conductive coil within the blank, and a first terminal and a second terminal exposed to a surface of the blank, wherein the blank has a top surface, a bottom surface, a first lateral surface, a second lateral surface, a front surface and a back surface, wherein the top surface is parallel to the bottom surface, the first lateral surface is parallel to the second lateral surface, the front surface is parallel to the back surface, and a plane parallel to the top surface and the bottom surface, a plane parallel to the first lateral surface and the second lateral surface, and a plane parallel to the front surface and the back surface are mutually perpendicular, wherein external dimensions of the top surface, the bottom surface, the first lateral surface, the second lateral surface, the front surface and the back surface are of 0402 or below; wherein a thickness-to-width ratio of at least one electrode layer of the conductive coil is 0.5 or more, and a cross section of the at least one electrode layer has a width of at least 15 μm and at most 30 μm, and a thickness of at least 15 μm and at most 40 μm. Further, the conductive coil has a plurality of electrode layers, an electrode layer of the conductive coil correspondingly connected to the first terminal is a lead-in layer electrode, an electrode layer of the conductive coil correspondingly connected to the second terminal is a lead-out layer electrode, an electrode layer of the conductive coil located between the lead-in layer electrode and the lead-out layer electrode is an intermediate layer electrode, and respective electrode layers are connected through conductive paths between layers. Further, the thickness-to-width ratio of the at least one electrode layer is 0.6 or more. Further, the thickness-to-width ratio of the at least one electrode layer is 2.0 or less. Further, the thickness-to-width ratio of the at least one electrode layer is 1.0 or less. Further, the cross section of the electrode layer of the conductive coil has a rectangular, trapezoidal, parallelogram or elliptical shape, and the thickness-to-width ratio of the electrode layer is a ratio of a maximum thickness of the cross section of the electrode layer to a maximum width of the cross section of the electrode layer. Further, the electronic device is a laminated chip composite inductor device. Further, the at least one electrode layer is an intermediate layer electrode layer. Further, the conductive coil is formed in a stack provided with a plurality of electrode layers, and the plurality of electrode layers form a spiral conductive coil by forming connections in a state of overlapping with each other when viewed from a stacking direction. The present application has the following beneficial effects. In the present application, the thickness-to-width ratios of the laminated electrode layers of the inductor coil are set to be 0.5 or more, wh