US-20260128217-A1 - MULTILAYER ELECTRONIC COMPONENT

US20260128217A1US 20260128217 A1US20260128217 A1US 20260128217A1US-20260128217-A1

Abstract

A multilayer electronic component includes a body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other. The body includes an overlap region with a dielectric layer and internal electrodes alternately disposed in the first direction, a first margin region between the overlap region and the third surface, and a second margin region between the overlap region and the fourth surface. First and second external electrodes are disposed on the third and fourth surfaces, respectively. First and second through-hole electrodes penetrate the first and second margin regions, respectively. 3%≤R1≤7% and/or 3%≤R2≤7% is satisfied, where R1 and R2 represent ratios of areas of the first and second through-hole electrodes to areas of the first and second margin regions, respectively, in a cross-section of the body.

Inventors

Ji Hun Lee
Sang Yeop Kim
Tae Yong Kim

Assignees

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20250624
Priority Date: 20241106

Claims (12)

1 . A multilayer electronic component comprising: a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, the body including an overlap region including a dielectric layer and first and second internal electrodes alternately disposed in the first direction with the dielectric layer interposed therebetween, a first margin region disposed between the overlap region and the third surface, where the second internal electrode does not exist, and a second margin region disposed between the overlap region and the fourth surface, where the first internal electrode does not exist; first and second external electrodes respectively disposed on the third and fourth surfaces and connected to the first and second internal electrodes, respectively; and first and second through-hole electrodes penetrating the first and second margin regions respectively and connected to the first and second internal electrodes respectively; at least one of 3%≤R 1 ≤7% and 3%≤R 2 ≤7% is satisfied, where R 1 is a ratio of an area of the first through-hole electrode to an area of the first margin region, and R 2 is a ratio of an area of the second through-hole electrode to an area of the second margin region in a cross section of the body in the second and third directions.
2 . The multilayer electronic component of claim 1 , wherein the first and second through-hole electrodes comprises a plurality of through-hole electrodes, wherein the area of the first through-hole electrode is a total area of a plurality of the first through-hole electrodes, wherein the area of the second through-hole electrode is a total area of a plurality of the second through-hole electrodes.
3 . The multilayer electronic component of claim 2 , wherein the plurality of the first through-hole electrodes are arranged in the third direction, wherein the plurality of second through-hole electrodes are arranged in the third direction.
4 . The multilayer electronic component of claim 1 , wherein a ratio of L 1 a to L 1 (L 1 a /L 1 ) is 5% or more, where L 1 is a length of the first margin region in the second direction, and L 1 a is a distance between the third surface and the first through-hole electrode in the second direction.
5 . The multilayer electronic component of claim 1 , wherein a ratio of L 1 b to L 1 (L 1 b /L 1 ) is 5% or more, where L 1 is a length of the first margin region in the second direction, and L 1 b is a distance between the overlap region and the first through-hole electrode in the second direction.
6 . The multilayer electronic component of claim 1 , wherein D 1 is 5 μm or more, where D 1 is a diameter of the first through-hole electrode.
7 . The multilayer electronic component of claim 3 , wherein a ratio of D 2 to D 1 (D 2 /D 1 ) is 1.2 or more, wherein D 1 is a diameter of the first through-hole electrode and D 2 is a distance between the plurality of the first through-electrodes.
8 . The multilayer electronic component of claim 7 , wherein a ratio of D 2 to D 1 (D 2 /D 1 ) is 2.5 or less.
9 . The multilayer electronic component of claim 1 , wherein the first external electrode is disposed to extend from the third surface onto the first and second surfaces, wherein the second external electrode is disposed to extend from the fourth surface onto the first and second surfaces, wherein the first through-hole electrode is exposed to the first and second surfaces and connected to the first external electrode, wherein the second through-hole electrode is exposed to the first and second surfaces and connected to the second external electrode.
10 . The multilayer electronic component of claim 1 , wherein the first internal electrode includes a first main portion disposed in the overlap region and overlapping the second internal electrode, and a first lead portion disposed in the first margin region and extending from the first main portion and exposed to the third surface, wherein the second internal electrode includes a second main portion disposed in the overlap region and overlapping the first internal electrode, and a second lead portion disposed in the second margin region and extending from the second main portion and exposed to the fourth surface.
11 . The multilayer electronic component of claim 1 , wherein cross sections of the first and second through-hole electrodes are circular, in the cross section of the body in the second and third directions.
12 . The multilayer electronic component of claim 1 , wherein the first through-hole electrode is connected to a plurality of first lead portions and is spaced apart from the second internal electrode, and wherein the second through-hole electrode is connected to a plurality of second lead portions and is spaced apart from the first internal electrode.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) This application claims the benefit of priority to Korean Patent Application No. 10-2024-0156140 filed on Nov. 6, 2024 with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. TECHNICAL FIELD The present disclosure relates to a multilayer electronic component. A multilayer ceramic capacitor (MLCC), a multilayer electronic component, is a chip-type condenser, mounted on the printed circuit boards of various types of electronic products, such as image display devices including a liquid crystal display LCD and a plasma display panel PDP, computers, smartphones and mobile phones, and serves to charge or discharge electricity therein or therefrom. Such multilayer ceramic capacitors may be used as a component in various electronic devices due to having a small size, ensuring high capacitance and being easily mounted. Recently, as the performance of electronic products mounted with MLCCs has improved, higher capacitance and uniform capacitance implementation of MLCCs are required. However, capacitance distribution and ESR distribution may occur due to poor contact between the internal and external electrodes of the MLCC. To solve these problems, there is a method of making holes in the body and disposing via electrodes connecting internal electrodes of the same polarity. (Patent document 1) Japanese Patent No. 2004-281957 SUMMARY An aspect of the present disclosure is to provide a multilayer electronic component having excellent electrical characteristics. However, problems to be solved by the present disclosure are not limited to the above, and will be more easily understood in the process of describing specific embodiments of the present disclosure. A multilayer electronic component according to an embodiment of the present disclosure may comprise: a body including a first surface and a second surface opposing each other in a first direction, and connected to the first and second surfaces, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, the body including an overlap region including a dielectric layer and a first internal electrode and a second internal electrode alternately disposed in the first direction with the dielectric layer therebetween, a first margin region disposed between the overlap region and the third surface, wherein the second internal electrode does not exist, and a second margin region disposed between the overlap region and the fourth surface, wherein the first internal electrode does not exist, first and second external electrodes disposed on the third and fourth surfaces respectively and connected to the first and second internal electrodes respectively, and first and second through-hole electrodes penetrating the first and second margin regions respectively and connected to the first and second internal electrodes respectively, wherein the multilayer electronic component satisfies at least one of 3%≤R1≤7% and 3%≤R2≤7%, where R1 is a ratio of an area of the first through-hole electrode to an area of the first margin region, and R2 is a ratio of an area of the second through-hole electrode to an area of the second margin region in a cross section of the body in the second and third directions. BRIEF DESCRIPTION OF DRAWINGS The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings, in which: FIG. 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present disclosure. FIG. 2 schematically illustrates a cross-sectional view taken along line I-I′ of FIG. 1. FIG. 3 schematically illustrates a cross-sectional view taken along line II-II′ of FIG. 1. FIG. 4 schematically illustrates a cross-sectional view taken along line III-III′ of FIG. 2. FIG. 5 is a cross-sectional view of FIG. 4 with an internal electrode and a penetrating electrode removed, schematically illustrating the area of a margin region. FIG. 6 is a cross-sectional view of FIG. 4 with an internal electrode removed, schematically illustrating the area of a through-hole electrode. DETAILED DESCRIPTION Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, embodiments of the present disclosure may be modified into various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Further, embodiments of the present disclosure may be provided for a more complete description of the present disclosure to the ordinary artisan. Therefore, shapes and sizes of the elements in the drawings may be