US-20260128222-A1 - MULTILAYER ELECTRONIC COMPONENT

US20260128222A1US 20260128222 A1US20260128222 A1US 20260128222A1US-20260128222-A1

Abstract

A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on both end surfaces of the capacitance forming portion in the first direction; and an external electrode disposed on the body, wherein the cover portion includes titanium (Ti), gallium (Ga) and magnesium (Mg), and when the number of moles of gallium (Ga) relative to 100 moles of titanium (Ti) of the cover portion is CG and the number of moles of magnesium (Mg) relative to 100 moles of titanium (Ti) of the cover portion is CM, 0.2≤CG/CM<1.0 is satisfied.

Inventors

Dae Jin SHIM
Jae Won Kim
Jung Jin Park
Jung Jin Park
Jong Ho Lee

Assignees

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20250707
Priority Date: 20241101

Claims (14)

1 . A multilayer electronic component, comprising: a body including a capacitance forming portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on both end surfaces of the capacitance forming portion in the first direction; and an external electrode disposed on the body, wherein the cover portion includes titanium (Ti), gallium (Ga), and magnesium (Mg), and when a number of moles of gallium (Ga) relative to 100 moles of titanium (Ti) of the cover portion is CG and a number of moles of magnesium (Mg) relative to 100 moles of titanium (Ti) of the cover portion is CM, 0.2≤CG/CM<1.0 is satisfied.
2 . The multilayer electronic component of claim 1 , wherein the CG satisfies 0.3 mol≤CG≤1.0 mol.
3 . The multilayer electronic component of claim 1 , wherein the CM satisfies 1.0 mol≤CM≤2.0 mol.
4 . The multilayer electronic component of claim 1 , wherein the cover portion has a composition different from a composition of the dielectric layer.
5 . The multilayer electronic component of claim 1 , wherein the dielectric layer comprises titanium (Ti), and when the number of moles of gallium (Ga) relative to 100 moles of titanium (Ti) of the dielectric layer is DG, DG<CG is satisfied.
6 . The multilayer electronic component of claim 5 , wherein the DG satisfies 0 mol≤DG<0.1 mol.
7 . The multilayer electronic component of claim 1 , wherein the cover portion comprises a plurality of dielectric grains, and an average size of the plurality of dielectric grains included in the cover portion is 150 nm or more and 250 nm or less.
8 . The multilayer electronic component of claim 1 , wherein the cover portion comprises a plurality of dielectric grains, and a size deviation of the plurality of dielectric grains included in the cover portion is 80 nm or less.
9 . The multilayer electronic component of claim 1 , wherein the cover portion comprises a plurality of dielectric grains, grain boundaries disposed between adjacent dielectric grains among the plurality of dielectric grains, and n-centers disposed at a point at which three or more of the grain boundaries contact each other, and at least one of the grain boundaries, at least one of the n-centers, or at least one of the grain boundaries and at least one of the n-centers include a secondary phase including at least one selected from gallium (Ga), magnesium (Mg), and titanium (Ti).
10 . The multilayer electronic component of claim 9 , wherein the secondary phase has an atomic percentage of gallium (Ga) of 2 at % or more and 5 at % or less relative to 100 at % of titanium (Ti).
11 . The multilayer electronic component of claim 9 , wherein the secondary phase has an atomic percentage of magnesium (Mg) of 5 at % or more and 15 at % or less relative to 100 at % of titanium (Ti).
12 . The multilayer electronic component of claim 9 , wherein at least one of the grain boundaries includes the secondary phase.
13 . The multilayer electronic component of claim 9 , wherein at least one of the n-centers includes the secondary phase.
14 . The multilayer electronic component of claim 9 , wherein at least one of the grain boundaries and at least one of the n-centers include the secondary phase.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) This application claims benefit of priority to Korean Patent Application No. 10-2024-0153643 filed on Nov. 1, 2024, the disclosure of which is incorporated herein by reference in their entireties. TECHNICAL FIELD The present disclosure relates to a multilayer electronic component. A multilayer ceramic capacitor (MLCC), one of multilayer electronic components, may be a chip-type condenser mounted on printed circuit boards of various electronic products, such as an imaging device, including a liquid crystal display (LCD) or a plasma display panel (PDP), a computer, a smartphone, or a mobile phone, serving to charge or discharge electricity therein or therefrom. Such a multilayer ceramic capacitor has a small size, implements high capacitance, and is easily mounted on a circuit board, and may thus be used as a component of various electronic devices. There has been increasing demand for a multilayer ceramic capacitor to have a reduced size and higher capacitance as each of various electronic devices such as a computer and a mobile device have a reduced size and higher output. As miniaturization and high capacitance progresses, the need to protect a region for forming capacitance is increasing, which is being improved by adding a margin region surrounding the region for forming capacitance. However, as a structural design is continuously changed to achieve miniaturization and high capacitance, as the size of the region for forming capacitance increases and the size of the margin region protecting the region for forming capacitance decreases, there may be a concern that moisture resistance reliability and strength of the multilayer ceramic capacitor may be decreased. To improve the problems described above, a grain size of a cover portion may be designed to be small and uniform, but when the grain size is reduced, breakdown voltage characteristics may be improved, but there may be a problem in that a side effect of reduced reliability may be caused by an increase in pores due to reduced density. SUMMARY An aspect of the present disclosure is to provide a multilayer electronic component having improved moisture resistance reliability by improving density of a cover portion to suppress the formation of pores. An aspect of the present disclosure is to provide a multilayer electronic component having improved breakdown voltage characteristics. However, various problems to be solved by the present disclosure are not limited to the above-described contents, and can be more easily understood in the process of explaining specific embodiments of the present disclosure. According to an aspect of the present disclosure, a multilayer electronic component may include a body including a capacitance forming portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on both end surfaces of the capacitance forming portion in the first direction; and an external electrode disposed on the body, wherein the cover portion may include titanium (Ti), gallium (Ga) and magnesium (Mg), and when a number of moles of gallium (Ga) relative to 100 moles of titanium (Ti) of the cover portion is CG and a number of moles of magnesium (Mg) relative to 100 moles of titanium (Ti) of the cover portion is CM, 0.2≤CG/CM<1.0 may be satisfied. BRIEF DESCRIPTION OF DRAWINGS The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings, in which: FIG. 1 schematically illustrates a perspective view of a multilayer electronic component according to an embodiment of the present disclosure; FIG. 2 schematically illustrates an exploded perspective view illustrating a stack structure of internal electrodes; FIG. 3 schematically illustrates a cross-sectional view of FIG. 1, taken along line I-I′; FIG. 4 schematically illustrates a cross-sectional view of FIG. 1, taken along line II-II′; FIG. 5 schematically illustrates a cross-sectional view of FIG. 1, taken along line II-II′ according to another embodiment of the present disclosure; FIG. 6A is an image of a cross-section of a cover portion taken using a transmission electron microscope (TEM), FIG. 6B is an image of the same cross-section of a cover portion obtained by mapping magnesium (Mg) in a TEM-EDS mode, and FIG. 6C is an image of the same cross-section of a cover portion obtained by mapping gallium (Ga) in a TEM-EDS mode; FIG. 7A is an image of pores observed in a cross-section of a cover portion of Comparative Example, and FIG. 7B is an image of pores observed in a cross-section of a cover portion of Example; FIG. 8A is a graph illustrating the number of pores (ea) observed in cross-sections of cover portions of Comparative Example and Example, and FIG. 8B is a graph illustrating porosity (%) observed in cross-sections of