US-20260128476-A1 - PRINTED CIRCUIT BOARD AND BATTERY MODULE INCLUDING SAME

US20260128476A1US 20260128476 A1US20260128476 A1US 20260128476A1US-20260128476-A1

Abstract

The present disclosure provides a printed circuit board and a battery module including the same. A printed circuit board may include a first signal wiring layer, a second signal wiring layer disposed spaced apart from the first signal wiring layer along a first direction, a first insulating layer disposed between the first signal wiring layer and the second signal wiring layer; and a first insertion groove which is formed on a first side surface of the first insulating layer and into which a terminal of a first cable can be inserted, wherein at least one of the first signal wiring layer or the second signal wiring layer includes a connection pattern disposed on one side thereof in contact with the first insertion groove and configured to be electrically connectable to the terminal of the first cable.

Inventors

Min-jin Kim

Assignees

SAMSUNG SDI CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20250718
Priority Date: 20241107

Claims (20)

1 . A printed circuit board comprising: a first signal wiring layer; a second signal wiring layer disposed spaced apart from the first signal wiring layer along a first direction; a first insulating layer disposed between the first signal wiring layer and the second signal wiring layer; and a first insertion groove formed on a first side surface of the first insulating layer and configured such that a terminal of a first cable can be inserted therein, wherein at least one of the first signal wiring layer or the second signal wiring layer includes a connection pattern which is disposed on one side thereof in contact with the first insertion groove and configured to be electrically connected to the terminal of the first cable.
2 . The printed circuit board according to claim 1 , wherein: the first signal wiring layer includes a first connection pattern disposed on the one side thereof in contact with the first insertion groove, the second signal wiring layer includes a second connection pattern disposed on the one side thereof in contact with the first insertion groove, and the first connection pattern and the second connection pattern are configured to be electrically connected to the terminal of the first cable, respectively.
3 . The printed circuit board according to claim 1 , wherein the first insulating layer includes a core layer or a prepreg layer.
4 . The printed circuit board according to claim 1 , further comprising: a third signal wiring layer disposed on the second signal wiring layer; and a second insulating layer disposed between the second signal wiring layer and the third signal wiring layer, wherein at least a portion of the first insertion groove is formed on one side surface of the second insulating layer.
5 . The printed circuit board according to claim 4 , wherein a length of the second signal wiring layer in a second direction intersecting the first direction is shorter than a length of the first signal wiring layer or the third signal wiring layer in the second direction.
6 . The printed circuit board according to claim 4 , wherein: the first insulating layer includes one of a core layer and a prepreg layer, and the second insulating layer includes the other of the core layer or the prepreg layer.
7 . The printed circuit board according to claim 4 , further comprising: a fourth signal wiring layer disposed on the third signal wiring layer; and a third insulating layer disposed between the third signal wiring layer and the fourth signal wiring layer, wherein at least a portion of the first insertion groove is formed on one side surface of the third insulating layer.
8 . The printed circuit board according to claim 1 , further comprising: a third signal wiring layer disposed on the second signal wiring layer; a second insulating layer disposed between the second signal wiring layer and the third signal wiring layer; a fourth signal wiring layer disposed on the third signal wiring layer; a third insulating layer disposed between the third signal wiring layer and the fourth signal wiring layer; and a second insertion groove which is formed on a second side surface of at least one of the first to third insulating layers and configured such that a terminal of a second cable can be inserted therein, wherein at least one of two signal wiring layers respectively contacting both sides of the second insertion groove located opposite to one another in the first direction includes a connection pattern that is disposed on one side thereof in contact with the second insertion groove and configured to be electrically connected to a terminal of the second cable.
9 . The printed circuit board according to claim 8 , wherein: one of the two signal wiring layers includes a third connection pattern disposed on one side thereof in contact with the second insertion groove, the other of the two signal wiring layers includes a fourth connection pattern disposed on one side thereof in contact with the second insertion groove, and the third connection pattern and the fourth connection pattern are configured to be electrically connected to the terminal of the second cable, respectively.
10 . The printed circuit board according to claim 8 , wherein at least one of the two signal wiring layers is different from at least one of the two signal wiring layers that are in contact with opposite sides along the first direction of the first insertion groove.
11 . The printed circuit board according to claim 8 , wherein the second side surface is a surface parallel to the first side surface.
12 . The printed circuit board according to claim 8 , wherein a plane including the second side surface intersects a plane including the first side surface.
13 . The printed circuit board according to claim 1 , wherein a thickness of the first insertion groove in the first direction is smaller than a thickness of the terminal of the first cable in the first direction.
14 . The printed circuit board according to claim 13 , further comprising: a cable holder that is disposed on at least one of the first signal wiring layer or the second signal wiring layer and configured to engage with the terminal of the first cable.
15 . The printed circuit board according to claim 1 , wherein a planar shape of an opening of the first insertion groove is rectangular.
16 . A battery module comprising: a plurality of battery cells; a printed circuit board including a first insulating layer, and a first signal wiring layer and a second signal wiring layer spaced apart from one another in a first direction with the first insulating layer interposed therebetween; and a bus bar that electrically connects the plurality of battery cells and the printed circuit board, wherein the printed circuit board further includes a first insertion groove which is formed on a first side surface of the first insulating layer and into which a terminal of a first cable can be inserted, and wherein at least one of the first signal wiring layer or the second signal wiring layer includes a connection pattern which is disposed on one side thereof in contact with the first insertion groove and configured to be electrically connected to the terminal of the first cable.
17 . The battery module according to claim 16 , wherein: the first signal wiring layer includes a first connection pattern on the one side in contact with the first insertion groove, the second signal wiring layer includes a second connection pattern on the one side in contact with the first insertion groove, and the first connection pattern and the second connection pattern are configured to be electrically connected to the terminal of the first cable, respectively.
18 . The battery module according to claim 16 , further comprising: a third signal wiring layer disposed on the second signal wiring layer; a second insulating layer disposed between the second signal wiring layer and the third signal wiring layer; a fourth signal wiring layer disposed on the third signal wiring layer; and a third insulating layer disposed between the third signal wiring layer and the fourth signal wiring layer, wherein at least a portion of the first insertion groove is formed on one side of at least one of the second insulating layer or the third insulating layer.
19 . The battery module according to claim 16 , further comprising: a third signal wiring layer disposed on the second signal wiring layer; a second insulating layer disposed between the second signal wiring layer and the third signal wiring layer; a fourth signal wiring layer disposed on the third signal wiring layer; a third insulating layer disposed between the third signal wiring layer and the fourth signal wiring layer; and a second insertion groove which is formed on a second side surface of at least one of the first to third insulating layers and into which a terminal of a second cable can be inserted, wherein at least one of two signal wiring layers respectively contacting both sides of the second insertion groove located opposite to one another in the first direction includes a connection pattern disposed on one side thereof in contact with the second insertion groove and configured to be electrically connected to a terminal of the second cable.
20 . The battery module according to claim 19 , wherein: one of the two signal wiring layers includes a third connection pattern on one side thereof in contact with the second insertion groove, the other of the two signal wiring layers includes a fourth connection pattern on one side thereof in contact with the second insertion groove, the third connection pattern and the fourth connection pattern are configured to be electrically connected to the terminal of the second cable, respectively, and at least one of the two signal wiring layers is different from at least one of the two signal wiring layers that are in contact with opposite sides along the first direction of the first insertion groove.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This present application claims priority to and the benefit under 35 U.S.C. §119(a)-(d) of Korean Patent Application No. 10-2024-0156959, filed on Nov. 7, 2024, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. FIELD The present disclosure relates to a printed circuit board and a battery module including the same. BACKGROUND Unlike primary batteries that are not designed to be (re)charged, secondary (or rechargeable) batteries are batteries that are designed to be discharged and recharged. Low-capacity secondary batteries are used in portable, small electronic devices, such as smart phones, feature phones, notebook computers, digital cameras, and camcorders, while large-capacity secondary batteries are widely used as power sources for driving motors in hybrid vehicles and electric vehicles and for storing power (e.g., home and/or utility scale power storage). A secondary battery generally includes an electrode assembly composed of a positive electrode and a negative electrode, a case accommodating the same, and electrode terminals connected to the electrode assembly. A battery module including a plurality of battery cells may include a printed circuit board. A printed circuit board may electrically connect a plurality of electronic circuit components. The printed circuit board may include a plurality of layers. At least one of the plurality of layers may include a pattern formed of a conductive metal, such as copper. An insulating layer may be placed between the layers having a metal pattern formed therein, and the layers having a pattern formed therein may be connected through vias. For example, the via may include a through hole, a blind via, and/or a buried via. The printed circuit board may be connected to battery cells, etc., and may be used for a protection circuit module (PCM) and a battery management system (BMS) to prevent accidents caused by batteries, etc. The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure, and therefore, it may contain information that does not constitute related (or prior) art. SUMMARY The present disclosure provides a printed circuit board and a battery module including the same for solving one or more problems described herein. These and other aspects and features of the present disclosure will be described in or will be apparent from the following description of embodiments of the present disclosure. To solve the one or more technical problems described herein, a printed circuit board may include a first signal wiring layer, a second signal wiring layer disposed spaced apart from the first signal wiring layer along a first direction, a first insulating layer disposed between the first signal wiring layer and the second signal wiring layer and a first insertion groove that is formed on a first side surface of the first insulating layer and configured such that a terminal of a first cable can be inserted therein, wherein at least one of the first signal wiring layer or the second signal wiring layer includes a connection pattern which is disposed on one side thereof in contact with the first insertion groove and configured to be electrically connected to the terminal of the first cable. According to one or more embodiments, the first signal wiring layer may include a first connection pattern disposed on the one side thereof in contact with the first insertion groove, the second signal wiring layer may include a second connection pattern disposed on the one side thereof in contact with the first insertion groove, and the first connection pattern and the second connection pattern may be configured to be electrically connected to the terminal of the first cable, respectively. According to one or more embodiments, the first insulating layer may include a core layer or a prepreg layer. According to one or more embodiments, the printed circuit board may further include a third signal wiring layer disposed on the second signal wiring layer; and a second insulating layer disposed between the second signal wiring layer and the third signal wiring layer, wherein at least a portion of the first insertion groove may be formed on one side surface of the second insulating layer. According to one or more embodiments, a length of the second signal wiring layer in a second direction intersecting the first direction may be shorter than a length of the first signal wiring layer or the third signal wiring layer in the second direction. According to one or more embodiments, the first insulating layer may include one of a core layer and a prepreg layer, and the second insulating layer may include the other of the core layer or the prepreg layer. According to one or more embodiments, the printed circuit board may further include a fourth signal wiring layer disposed on the third signal wiring layer and a third in