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US-20260128492-A1 - Dielectric Waveguide Cable For High Data Rate Communications

US20260128492A1US 20260128492 A1US20260128492 A1US 20260128492A1US-20260128492-A1

Abstract

Techniques pertaining to designs of a dielectric waveguide (DWG) cable for high data rate communications are described. A DWG cable is configured to carry multiple data streams to support a high data rate communication. The DWG cable includes a cladding material and a plurality of cores with each core of the plurality of cores surrounded by the cladding material.

Inventors

  • Sang-June Park
  • Gurkaranjot Singh Kalra
  • Saeed Farsi
  • Hsin-Hung Chen

Assignees

  • MEDIATEK INC.

Dates

Publication Date
20260507
Application Date
20250423

Claims (20)

  1. 1 . A device, comprising: a dielectric waveguide (DWG) cable configured to carry multiple data streams to support a high data rate communication, the DWG cable comprising a cladding material and a plurality of cores with each core of the plurality of cores surrounded by the cladding material.
  2. 2 . The device of claim 1 , wherein each core of the plurality of cores is next to one or more adjacent cores of the plurality of cores, and wherein a cross section of each core of the plurality of cores is oriented at 90° relative to, or perpendicular to, a respective cross section of each of the one or more adjacent cores.
  3. 3 . The device of claim 2 , wherein each core of the plurality of cores is surrounded by one or more diagonal cores of the plurality of cores, and wherein the cross section of each core of the plurality of cores is oriented at 0° relative to, or parallel to, a respective cross section of each of the one or more diagonal cores.
  4. 4 . The device of claim 1 , wherein each core of the plurality of cores is surrounded by one or more diagonal cores of the plurality of cores, and wherein a cross section of each core of the plurality of cores is oriented at 0° relative to, or parallel to, a respective cross section of each of the one or more diagonal cores.
  5. 5 . The device of claim 4 , wherein each core of the plurality of cores is next to one or more adjacent cores of the plurality of cores, and wherein the cross section of each core of the plurality of cores is oriented at 90° relative to, or perpendicular to, a respective cross section of each of the one or more adjacent cores.
  6. 6 . The device of claim 1 , wherein at least one core of the plurality of cores is next to one or more adjacent cores of the plurality of cores, and wherein a cross section of the at least one core is oriented at 45° relative to a respective cross section of each of the one or more adjacent cores.
  7. 7 . The device of claim 1 , wherein a cross section of the DWG cable is generally round or circular in shape.
  8. 8 . The device of claim 1 , wherein a cross section of the DWG cable is generally square, rectangular or circular in shape.
  9. 9 . The device of claim 1 , wherein the cladding material comprises a cladding dielectric surrounding the plurality of cores and filled everywhere else in the DWG cable.
  10. 10 . The device of claim 1 , wherein each core of the plurality of cores is individually surrounded by a respective portion of the cladding material.
  11. 11 . An apparatus, comprising: two integrated circuit (IC) chips; and a dielectric waveguide (DWG) cable configured to carry multiple data streams to support a high data rate communication between the two IC chips, the DWG cable comprising a cladding material and a plurality of cores with each core of the plurality of cores surrounded by the cladding material.
  12. 12 . The apparatus of claim 11 , wherein each core of the plurality of cores is next to one or more adjacent cores of the plurality of cores, and wherein a cross section of each core of the plurality of cores is oriented at 90° relative to, or perpendicular to, a respective cross section of each of the one or more adjacent cores.
  13. 13 . The apparatus of claim 12 , wherein each core of the plurality of cores is surrounded by one or more diagonal cores of the plurality of cores, and wherein the cross section of each core of the plurality of cores is oriented at 0° relative to, or parallel to, a respective cross section of each of the one or more diagonal cores.
  14. 14 . The apparatus of claim 11 , wherein each core of the plurality of cores is surrounded by one or more diagonal cores of the plurality of cores, and wherein a cross section of each core of the plurality of cores is oriented at 0° relative to, or parallel to, a respective cross section of each of the one or more diagonal cores.
  15. 15 . The apparatus of claim 14 , wherein each core of the plurality of cores is next to one or more adjacent cores of the plurality of cores, and wherein the cross section of each core of the plurality of cores is oriented at 90° relative to, or perpendicular to, a respective cross section of each of the one or more adjacent cores.
  16. 16 . The apparatus of claim 11 , wherein at least one core of the plurality of cores is next to one or more adjacent cores of the plurality of cores, and wherein a cross section of the at least one core is oriented at 45° relative to a respective cross section of each of the one or more adjacent cores.
  17. 17 . The apparatus of claim 11 , wherein a cross section of the DWG cable is generally round or circular in shape.
  18. 18 . The apparatus of claim 11 , wherein a cross section of the DWG cable is generally square, rectangular or circular in shape.
  19. 19 . The apparatus of claim 11 , wherein the cladding material comprises a cladding dielectric surrounding the plurality of cores and filled everywhere else in the DWG cable.
  20. 20 . The apparatus of claim 11 , wherein each core of the plurality of cores is individually surrounded by a respective portion of the cladding material.

Description

CROSS REFERENCE TO RELATED PATENT APPLICATION(S) The present disclosure is part of a non-provisional application claiming the priority benefit of U.S. patent application Ser. No. 63/716,758, filed 6 Nov. 2024, the content of which herein being incorporated by reference in its entirety. TECHNICAL FIELD The present disclosure is generally related to wireline communications and, more particularly, to designs of a dielectric waveguide (DWG) cable for high data rate communications. BACKGROUND Unless otherwise indicated herein, approaches described in this section are not prior art to the claims listed below and are not admitted as prior art by inclusion in this section. The server system performance in data centers play a key role in the rapid advancement of artificial intelligence. The network within the data centers connects a large number of servers through high-speed links and switches. Conventional chip-to-chip communication in data centers, applications typically use electrical and optical channels/links. The electrical channel or link in general has a large roll-off in the insertion loss over bandwidth, thereby requiring power-hungry equalization. The optical channel or link, on the other hand, typically has very small roll-off, but tends to be expensive solution since it requires electrical to optical conversion. In contrast, the dielectric waveguide (DWG) cables offer performance advantage over electrical links and cost advantage over optical links for a medium range of 1-10 meters of distance. Compared to copper, the DWG losses are lower and the bandwidth achievable is higher. Compared to optical links, DWGs tend to be cheaper and more mechanically robust. One use-case of DWG cable is to connect a graphics processing unit (GPU) (e.g., inside a server) to a switch-integrated circuit (IC) (e.g., inside an ethernet switch). Therefore, there is a need for a solution of designs of a DWG cable for high data rate communications. SUMMARY The following summary is illustrative only and is not intended to be limiting in any way. That is, the following summary is provided to introduce concepts, highlights, benefits and advantages of the novel and non-obvious techniques described herein. Select implementations are further described below in the detailed description. Thus, the following summary is not intended to identify essential features of the claimed subject matter, nor is it intended for use in determining the scope of the claimed subject matter. An objective of the present disclosure is to propose solutions or schemes that address the issue(s) described herein. More specifically, various schemes proposed in the present disclosure pertain to designs of a DWG cable for high data rate communications. It is believed that implementations of the various proposed schemes may address or otherwise alleviate the aforementioned issue(s). In one aspect, a device may include a DWG cable configured to carry multiple data streams to support a high data rate communication. The DWG cable may include a cladding material and a plurality of cores with each core of the plurality of cores surrounded by the cladding material. In another aspect, an apparatus may include two IC chips (e.g., a GPU and a switch-IC) and a DWG cable. The DWG cable may be configured to carry multiple data streams to support a high data rate communication. The DWG cable may include a cladding material and a plurality of cores with each core of the plurality of cores surrounded by the cladding material. It is noteworthy that, although description provided herein may be in the context of certain radio access technologies, networks, and network topologies for wireless communication, such as 5th Generation (5G)/New Radio (NR) mobile communications, 6th Generation (6G) mobile communications and beyond, the proposed concepts, schemes and any variation(s)/derivative(s) thereof may be implemented in, for and by other types of radio access technologies, networks and network topologies such as, for example and without limitation, Evolved Packet System (EPS), Long-Term Evolution (LTE), LTE-Advanced, LTE-Advanced Pro, Internet-of-Things (IoT), Narrow Band Internet of Things (NB-IoT), Industrial Internet of Things (IIoT), vehicle-to-everything (V2X), and non-terrestrial network (NTN) communications. Thus, the scope of the present disclosure is not limited to the examples described herein. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of the present disclosure. The drawings illustrate implementations of the disclosure and, together with the description, serve to explain the principles of the disclosure. It is appreciable that the drawings are not necessarily in scale as some components may be shown to be out of proportion than the size in actual implementation in order to clearly illustrate the concept of the present disclosure. FIG. 1 is a diagr