US-20260128523-A1 - ELECTRONIC DEVICE

US20260128523A1US 20260128523 A1US20260128523 A1US 20260128523A1US-20260128523-A1

Abstract

The present disclosure provides an electronic device. The electronic device includes a first transceiving element, a second transceiving element disposed over the first transceiving element, and a radiating structure configured to radiate a first EM wave having a lower frequency and a second EM wave having a higher frequency. The first transceiving element and the second transceiving element are collectively configured to provide a higher gain or bandwidth for the first EM wave than for the second EM wave.

Inventors

Po-An Lin
Guan-Wei Chen
Shih-Wen Lu

Assignees

ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Dates

Publication Date: 20260507
Application Date: 20251231

Claims (20)

1 . An electronic device, comprising: a first antenna structure; and a second antenna structure connecting to the first antenna structure by a soldering material and including a first stack of antenna layers.
2 . The electronic device of claim 1 , wherein the first antenna structure includes a second stack of antenna layers.
3 . The electronic device of claim 1 , further comprising: a connection layer covering the soldering material and connecting between the first antenna structure and the second antenna structure.
4 . The electronic device of claim 1 , wherein the first antenna structure and the second antenna structure are overlapped in a direction substantially perpendicular to a surface of the first antenna structure facing the second antenna structure.
5 . The electronic device of claim 1 , wherein at least one antenna layer of the first stack of antenna layers includes a first antenna array.
6 . The electronic device of claim 5 , wherein the second antenna structure includes a second antenna array.
7 . The electronic device of claim 1 , further comprising: a circuit structure supporting the first antenna structure.
8 . The electronic device of claim 7 , wherein a dielectric constant (Dk) of a dielectric material of the circuit structure is different from a Dk of a dielectric material of the first antenna structure.
9 . The electronic device of claim 1 , wherein the second antenna structure includes a protective layer covering a first antenna layer of the first stack of antenna layers.
10 . The electronic device of claim 9 , wherein the second antenna structure includes a dielectric layer over a second antenna layer of the first stack of antenna layers, wherein a Dk of the protective layer is lower than a Dk of the dielectric layer.
11 . The electronic device of claim 7 , further comprising: an electronic component supported by the circuit structure, wherein the electronic component and the first antenna structure are disposed over opposite sides of the circuit structure.
12 . The electronic device of claim 11 , further comprising: an encapsulant disposed over the circuit structure to cover the electronic component.
13 . The electronic device of claim 12 , further comprising: a shielding layer disposed over outer surfaces of the encapsulant.
14 . The electronic device of claim 13 , wherein the shielding layer extends from a lateral surface of the encapsulant to a lateral surface of the circuit structure.
15 . The electronic device of claim 7 , wherein a dimension of the second antenna structure measured along a direction substantially perpendicular to a surface of the first antenna structure facing the second antenna structure is less than a sum of a dimension of the first antenna structure measured along the direction and a dimension of the circuit structure measured along the direction.
16 . The electronic device of claim 2 , wherein in a cross-sectional view, a dimension of at least one antenna layer of the first stack of antenna layers of the second antenna structure measured along a direction substantially parallel to a surface of the first antenna structure facing the second antenna structure is different from a dimension of at least one antenna layer of the second stack of antenna layers of the first antenna structure measured along the direction.
17 . An electronic device, comprising: a plurality of antenna layers at least partially overlapped in a stacking direction; a first dielectric layer disposed over the plurality of antenna layers and including a first thickness and a first width; and a second dielectric layer disposed over the first dielectric layer and including a second thickness different from the first thickness and a second width different from the first width.
18 . The electronic device of claim 17 , wherein a first antenna layer and a second antenna layer of the plurality of antenna layers are configured to operate at different frequencies.
19 . The electronic device of claim 18 , wherein the first antenna layer is closer to the first dielectric layer than the second antenna layer and is configured to operate at a first frequency, and the second antenna layer is configured to operate at a second frequency lower than the first frequency.
20 . The electronic device of claim 17 , wherein a Dk of the first dielectric layer is different from a Dk of the second dielectric layer.

Description

CROSS REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser. No. 17/985,117, filed Nov. 10, 2022, now U.S. Pat. No. 12,519,235, the content of which is incorporated herein by reference in its entirety. BACKGROUND 1. Field of the Disclosure The present disclosure generally relates to an electronic device. 2. Description of the Related Art As radio access networks become increasingly ubiquitous, antenna in package (AiP) and antenna on package (AoP) in turn require higher bandwidth capability and better antenna gain in order to support the industry's demand for, e.g., higher data rates, increased functionality, and more users. However, the size and/or form factor of the packages will inevitably be increased. SUMMARY In some arrangements, an electronic device includes a first transceiving element, a second transceiving element disposed over the first transceiving element, and a radiating structure configured to radiate a first EM wave having a lower frequency and a second EM wave having a higher frequency. The first transceiving element and the second transceiving element are collectively configured to provide a higher gain or bandwidth for the first EM wave than for the second EM wave. In some arrangements, an electronic device includes a radiating structure configured to operate at a first frequency and a second frequency different from the first frequency. The electronic device also includes a first transceiving element disposed over the radiating structure and having a first dielectric constant (Dk) and a second transceiving element disposed over the first transceiving element and having a second Dk different from the first Dk. A lateral surface of first transceiving element is substantially aligned with a lateral surface of the radiating structure. In some arrangements, an electronic device includes an antenna structure including a lateral surface, a first conductive element, and a second conductive element. The second conductive element is electrically coupled to the first conductive element and extends to the lateral surface of the antenna structure. The electronic device also includes a third conductive element disposed at the lateral surface of the antenna structure and configured for connecting the second conductive element to a ground potential. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of some arrangements of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that various structures may not be drawn to scale, and dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion. FIG. 1A is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 1B is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 1C is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 2A is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 2B is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 2C is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 2C′ is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 2D is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 2E is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 2F is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 2G is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 3A is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 3B is an enlarged view of region R1 shown in FIG. 3A, in accordance with an embodiment of the present disclosure. FIG. 3C is an enlarged view of region R1 shown in FIG. 3A, in accordance with an embodiment of the present disclosure. FIG. 3D is an enlarged view of region R1 shown in FIG. 3A, in accordance with an embodiment of the present disclosure. FIG. 4A is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 4B is an enlarged view of region R1 shown in FIG. 4A, in accordance with an embodiment of the present disclosure. FIG. 4C is an enlarged view of region R1 shown in FIG. 4A, in accordance with an embodiment of the present disclosure. FIG. 4D is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 5A is a cross-sectional view of an