US-20260128577-A1 - RAISED FLOOR TILE ELECTRONIC EQUIPMENT TRAY

US20260128577A1US 20260128577 A1US20260128577 A1US 20260128577A1US-20260128577-A1

Abstract

A raised floor tile enclosure system that includes a pedestal, a bracket connected to the pedestal, and an equipment tray assembly supported by the bracket. The equipment tray assembly includes a bottom wall, at least one side wall that extends from the bottom wall and at least partially forms an interior volume, and a support plate movably positioned within the interior volume. The raised floor tile enclosure system further includes electronic equipment supported by the support plate and a floor tile coupled to the equipment tray that can enclose the interior volume. The support plate can move toward the bottom wall when the floor tile us coupled to the equipment tray. The electronic equipment can be received entirely within the interior volume when enclosed by the floor tile.

Inventors

Tim Ortel
Dennis Burrell

Assignees

HUBBELL INCORPORATED (DELAWARE)

Dates

Publication Date: 20260507
Application Date: 20251027

Claims (20)

1 . A raised floor tile enclosure system comprising: a pedestal; a bracket connected to the pedestal; an equipment tray assembly supported by the bracket and including, a bottom wall, at least one side wall extending from the bottom wall and at least partially forming an interior volume, and a support plate movably positioned within the interior volume; electronic equipment supported by the support plate; and a floor tile coupled to the equipment tray and configured to enclose the interior volume; wherein the support plate is configured to move toward the bottom wall when the floor tile us coupled to the equipment tray; and wherein the electronic equipment is configured to be received entirely within the interior volume when enclosed by the floor tile.
2 . The raised floor tile enclosure system of claim 1 , wherein the bottom wall and the at least one side wall are constructed from a first material configured to block transmission of RF waves, and where the floor tile is constructed from a second material configured to allow for the transmission of RF waves.
3 . The raised floor tile enclosure system of claim 2 , wherein the first material is a metal and the second material is concrete.
4 . The raised floor tile enclosure system of claim 1 , wherein the bracket includes a body and a thumb screw press fit into the body, and wherein the thumb screw is configured to connect the bracket to the pedestal.
5 . The raised floor tile enclosure system of claim 1 , wherein the equipment tray assembly further includes a faceplate coupled to the at least one side wall, and wherein the floor tile is configured to be coupled to the faceplate.
6 . The raised floor tile enclosure system of claim 5 , wherein the faceplate includes an outer perimeter formed outside of the interior volume, and wherein a cutout is disposed inward of the outer perimeter.
7 . The raised floor tile enclosure system of claim 1 , wherein a biasing member is coupled between the support plate and the bottom wall, and wherein the floor tile is configured to compress the biasing member and cause the support plate to move toward the bottom wall.
8 . The raised floor tile enclosure system of claim 7 , wherein a spacer is coupled to the bottom wall, and wherein the biasing member is a coil spring that is positioned against an outer surface of the spacer.
9 . The raised floor tile enclosure system of claim 1 , wherein a cable gland is formed through the bottom wall and configured to permit electrical cables to pass into the interior volume.
10 . A raised floor tile enclosure system comprising: a pedestal; a bracket connected to the pedestal; an equipment tray assembly supported by the bracket and including, a bottom wall, at least one side wall extending from the bottom wall and at least partially forming an interior volume, a coil spring extending from the bottom wall, and a support plate coupled to the coil spring and translatable toward the bottom wall against a spring bias of the coil spring; a wireless access point supported by the support plate; and a floor tile coupled to the equipment tray to enclose the interior volume; wherein contact between the floor tile and the wireless access point is configured to cause the support plate to move against the spring bias; and wherein the wireless access point is configured to be received entirely within the interior volume when enclosed by the floor tile.
11 . The raised floor tile enclosure system of claim 10 , wherein the bottom wall and the at least one side wall are constructed from a first material configured to block transmission of RF waves, and where the floor tile is constructed from a second material configured to allow for the transmission of RF waves, and wherein the first material is a metal and the second material is concrete.
12 . The raised floor tile enclosure system of claim 10 , wherein the bracket includes a body and a thumb screw press fit into the body, and wherein the thumb screw is configured to connect the bracket to the pedestal.
13 . The raised floor tile enclosure system of claim 10 , wherein the equipment tray assembly further includes a faceplate coupled to the at least one side wall, and wherein the floor tile is configured to be coupled to the faceplate.
14 . The raised floor tile enclosure system of claim 13 , wherein the faceplate includes an outer perimeter formed outside of the interior volume, and wherein a cutout is disposed inward of the outer perimeter.
15 . The raised floor tile enclosure system of claim 10 , wherein a biasing member is coupled between the support plate and the bottom wall, and wherein the floor tile is configured to compress the biasing member and cause the support plate to move toward the bottom wall.
16 . The raised floor tile enclosure system of claim 15 , wherein a spacer is coupled to the bottom wall, and wherein the biasing member is a coil spring that is positioned against an outer surface of the spacer.
17 . The raised floor tile enclosure system of claim 10 , wherein a cable gland is formed through the bottom wall and configured to permit electrical cables to pass into the interior volume.
18 . A method of installing a raised floor tile enclosure system comprising: connecting a first bracket to a first pedestal; connecting a second bracket to a second pedestal; connecting a third bracket to a third pedestal; connecting a fourth bracket to a fourth pedestal; positioning an equipment tray assembly on top of the first bracket, second bracket, third bracket, and fourth bracket, wherein the equipment tray assembly includes, a bottom wall, at least one side wall extending from the bottom wall and at least partially forming an interior volume, a coil spring extending from the bottom wall, and a support plate coupled to the coil spring and translatable toward the bottom wall against a spring bias of the coil spring; selecting between a first wireless access point having a first shape and a second wireless access point having a second shape that is different than the first shape; positioning the selected one of the first wireless access point and the second wireless access point on the support plate; and connecting a floor tile to the equipment tray assembly to enclose the interior volume to cause the support plate to move against the spring bias; wherein the selected one of the first wireless access point and the second wireless access point is configured to be received entirely within the interior volume when enclosed by the floor tile.
19 . The method of claim 18 , further comprising, removing the floor tile from the equipment tray; replacing the selected one of the first wireless access point and the second wireless access point with the other of the first wireless access point and the second wireless access point; and reconnecting the floor tile to the equipment tray assembly.
20 . The method of claim 18 , wherein positioning an equipment tray assembly on top of the first bracket, second bracket, third bracket, and fourth bracket includes placing the equipment tray assembly on top of the first bracket, second bracket, third bracket, and fourth bracket without use of additional fasteners or tools.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims the benefit to U.S. Provisional Application No. 63/712,222, filed Oct. 25, 2024, the entire contents of which is incorporated by reference in its entirety. FIELD The present invention is generally directed to a means and method for installing an access point or other electronic gear under a raised floor tile. BACKGROUND Access points used for WIFI coverage are typically mounted to ceilings or walls. In examples where raised floor tile systems are used, access points may be installed under the floor. Raised floors typically have electronic equipment installed in enclosures, made of metal or plastic, that are attached to the pedestal legs, using clamps and tools and the clamps require adjusting to achieve the correct height on the legs. Existing enclosures are mounted to the underside of the concrete floor tile, using screws or adhesive. Plastic enclosures allow RF signals to pass through but allows interference from other nearby electronics to interfere with the signal being propagated by the access point. Metal enclosures prevent RF inference but also block the signal being propagated by the access point. SUMMARY In some forms, there is an RF sealed tray with an open top to permit RF signal transmission. In some forms, there is an RF tray that can be installed and/or uninstalled without tools. In some forms, there is an adjustable equipment tray that permits a face of an access point to be flush with the bottom of the floor tile regardless of access point model. In some forms, there is equipment tray assembly for supporting an electronic access point that includes a bottom wall, at least one side wall that extends from the bottom wall and at least partially forms an interior volume, a coil spring that extends from the bottom wall, and a support plate coupled to the coil spring and translatable toward the bottom wall against a spring bias of the coil spring. In some forms, there is a raised floor tile enclosure system that includes a pedestal, a bracket connected to the pedestal, and an equipment tray assembly supported by the bracket. The equipment tray assembly includes a bottom wall, at least one side wall that extends from the bottom wall and at least partially forms an interior volume, and a support plate movably positioned within the interior volume. The raised floor tile enclosure system further includes electronic equipment supported by the support plate and a floor tile coupled to the equipment tray that can enclose the interior volume. The support plate can move toward the bottom wall when the floor tile us coupled to the equipment tray. The electronic equipment can be received entirely within the interior volume when enclosed by the floor tile. In some forms, there is a raised floor tile enclosure system that includes a pedestal, a bracket connected to the pedestal, and an equipment tray assembly supported by the bracket. The equipment tray assembly includes a bottom wall, at least one side wall that extends from the bottom wall and at least partially forms an interior volume, a coil spring that extends from the bottom wall, and a support plate coupled to the coil spring and translatable toward the bottom wall against a spring bias of the coil spring. The raised floor tile enclosure system further includes a wireless access point supported by the support plate and a floor tile coupled to the equipment tray that can enclose the interior volume. Contact between the floor tile and the wireless access point can cause the support plate to move against the spring bias. The wireless access point can be received entirely within the interior volume when enclosed by the floor tile. In some forms, there is a method of installing a raised floor tile enclosure system. A first bracket is connected to a first pedestal. A second bracket is connected to a second pedestal. A third bracket is connected a third pedestal. A fourth bracket is connected to a fourth pedestal. An equipment tray assembly is positioned on top of the first bracket, second bracket, third bracket, and fourth bracket. The equipment tray assembly includes a bottom wall, at least one side wall that extends from the bottom wall and at least partially forms an interior volume, a coil spring that extends from the bottom wall, and a support plate coupled to the coil spring and translatable toward the bottom wall against a spring bias of the coil spring. One of a first wireless access point having a first shape and a second wireless access point having a second shape that is different than the first shape is selected. The selected one of the first wireless access point and the second wireless access point is positioned on the support plate. A floor tile is connected to the equipment tray assembly to enclose the interior volume to cause the support plate to move against the spring bias. The selected one of the first wireless access point and the second wireless access point can be received