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US-20260128578-A1 - Overmolded Interconnect Device

US20260128578A1US 20260128578 A1US20260128578 A1US 20260128578A1US-20260128578-A1

Abstract

A method for forming an overmolded interconnect device includes molding a first layer of an automotive component having a surface, depositing conductive material onto a portion of the surface, and molding a second layer over the surface to substantially enclose at least a portion of the conductive material between the first layer and the second layer.

Inventors

  • Andrew Massey

Assignees

  • VALEO VISION

Dates

Publication Date
20260507
Application Date
20241101

Claims (20)

  1. 1 . A method, comprising: molding a first layer of an automotive component having a surface; depositing conductive material onto a portion of the surface; and molding a second layer over the surface to substantially enclose at least a portion of the conductive material between the first layer and the second layer.
  2. 2 . The method of claim 1 , wherein the depositing comprises spraying the conductive material onto the surface.
  3. 3 . The method of claim 2 , further comprising: masking, before the depositing of the conductive material, a portion of the surface from the spraying.
  4. 4 . The method of claim 1 , wherein: the conductive material comprises a formed conductive sheet; and the depositing comprises positioning the formed conductive sheet onto the surface.
  5. 5 . The method of claim 1 , wherein: the conductive material comprises an insulated wire; and the depositing comprises positioning the insulated wire onto the surface.
  6. 6 . The method of claim 5 , wherein: the insulated wire comprises a portion of a wiring harness; and the positioning comprises positioning the wiring harness onto the surface.
  7. 7 . The method of claim 1 , wherein: the depositing comprises depositing second conductive material onto a second portion of the surface; and the molding comprises molding the second layer over the first layer to substantially enclose at least a portion of the second conductive material between the first layer and the second layer.
  8. 8 . The method of claim 1 , wherein the second layer includes a second surface, the method further comprising: depositing second conductive material onto the second surface; and molding a third layer over the second surface to substantially enclose at least a portion of the second conductive material between the second layer and the third layer, wherein the second layer electrically insulates the at least the portion of the conductive material from the at least the portion of the second conductive material.
  9. 9 . A method, comprising: forming a first layer of a part in a first shot of an injection molding process; masking some of the first layer so that a surface of the first layer is exposed; depositing conductive material onto the surface; forming a second layer of the part in a second shot of the injection molding process; and enclosing, during the forming the second layer by the second shot, at least a portion of the conductive material between the first layer and the second layer.
  10. 10 . The method of claim 9 , wherein the depositing comprises spraying the conductive material onto the surface.
  11. 11 . The method of claim 9 , further comprising: masking, before the forming the second layer of the part, the first layer a second time so that a second surface of the first layer is exposed; and depositing second conductive material onto the second surface.
  12. 12 . The method of claim 11 , wherein the enclosing, during the forming the second layer by the second shot, includes at least a portion of the second conductive material between the first layer and the second layer.
  13. 13 . The method of claim 9 , further comprising: masking some of the second layer so that a surface of the second layer is exposed; depositing second conductive material onto the surface of the second layer; forming a third layer of the part in a third shot of the injection molding process; and enclosing, during the forming the third layer by the third shot, at least a portion of the second conductive material between the second layer and the third layer.
  14. 14 . An apparatus, comprising: a first layer of polymeric material; a circuit, comprising: a first electrically conductive path including a first terminal; and a second electrically conductive path including a second terminal, wherein the first terminal and the second terminal are configured to connect to a power source; and a second layer covering at least a portion of the first layer and enclosing at least a portion of the circuit between the first layer and the second layer, wherein the apparatus is part of a vehicle.
  15. 15 . The apparatus of claim 14 , further comprising: an electrical component electrically connected to the first electrically conductive path and the second electrically conductive path.
  16. 16 . The apparatus of claim 15 , wherein the electrical component is a light source embedded into the first layer.
  17. 17 . The apparatus of claim 16 , wherein the light source is at least partially exposed through the first layer.
  18. 18 . The apparatus of claim 14 , wherein the first terminal and the second terminal are at least partially exposed through the second layer.
  19. 19 . The apparatus of claim 14 , wherein the portion of the circuit enclosed between the first layer and the second layer includes at least a portion of the first electrically conductive path and does not include a portion of the second electrically conductive path.
  20. 20 . The apparatus of claim 14 , further comprising: a second circuit comprising a third electrically conductive path; and a third layer covering at least a portion of the second layer and enclosing at least a portion of the second circuit between the second layer and the third layer.

Description

TECHNICAL FIELD This disclosure relates to overmolded interconnected devices and, more particularly, to systems and methods for embedding wiring within molded parts. BACKGROUND A vehicle may include many types of electronics. Wiring harnesses are often used to organize electrical wires within the vehicle. However, wiring harnesses may be inefficient, impractical, unsightly, expensive, or too fragile for some vehicle parts. Therefore, there is a need for alternative electric wire organization. SUMMARY The present teachings provide a method including molding a first layer of an automotive component having a surface, depositing conductive material onto a portion of the surface, and molding a second layer over the surface to substantially enclose at least a portion of the conductive material between the first layer and the second layer. The present teachings provide a method including forming a first layer of a part in a first shot of an injection molding process, masking some of the first layer so that a surface of the first layer is exposed, depositing conductive material onto the surface, forming a second layer of the part in a second shot of the injection molding process, and enclosing, during the forming the second layer by the second shot, at least a portion of the conductive material between the first layer and the second layer. The present teachings provide an apparatus including a first layer of polymeric material, a circuit, and a second layer covering at least a portion of the first layer and enclosing at least a portion of the circuit between the first layer and the second layer. The circuit includes a first electrically conductive path with a first terminal and a second electrically conductive path with a second terminal. The apparatus is part of a vehicle. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a vehicle including a vehicle grille with an array of embedded lights. FIG. 2A is an elevation view of a vehicle grille with an array of embedded lights. FIG. 2B is a schematic illustration of a circuit encapsulated within the vehicle grille of FIG. 2A during a molding process. FIG. 2C is an elevation view of the vehicle grille of FIG. 2A showing circuits encapsulated within the vehicle grille. FIG. 3A is a cross-sectional view of a first layer formed in a molding process. FIG. 3B is a cross-sectional view of the first layer of FIG. 3A and an insulated conductor, wherein the insulated conductor is partially nested in the first layer. FIG. 3C is a cross-sectional view of a second layer formed in the molding process, wherein the second layer is overmolded with respect to the first layer and insulated conductor of FIG. 3B. FIG. 4 is a flowchart of a method for encapsulating a conductive material during a molding process. FIG. 5A is a cross-sectional view of a first layer formed in a molding process. FIG. 5B is a cross-sectional view of the first layer of FIG. 5A and a mask to guide conductive material onto the first layer. FIG. 5C is a cross-sectional view of the first layer of FIG. 5B and the mask with deposited conductive material. FIG. 5D is a cross-sectional view of a second layer formed in the molding process, wherein the second layer is overmolded with respect to the first layer and deposited conductive material of FIG. 5C. FIG. 6 is a flowchart of a method for encapsulating deposited conductive material during a molding process. FIG. 7A is a cross-sectional view of a first layer formed in a molding process. FIG. 7B is a cross-sectional view of the first layer of FIG. 7A with deposited first conductive material. FIG. 7C is a cross-sectional view of a second layer formed in the molding process, wherein the second layer is partially overmolded with respect to the first layer and deposited first conductive material of FIG. 7B. FIG. 7D is a cross-sectional view of the first layer, deposited first conductive material, and the second layer of FIG. 7C with deposited second conductive material. FIG. 7E is a cross-sectional view of a third layer formed in the molding process and an insulated wire connected to the deposited second conductive material, wherein the third layer is overmolded with respect to the first layer, the second layer, and deposited second conductive material of FIG. 7D. FIG. 7F is a cross-sectional view of a third layer formed in the molding process and a terminal connected to the deposited second conductive material, wherein the third layer is overmolded with respect to the first layer, the second layer, and deposited second conductive material of FIG. 7D. FIG. 8 is a flowchart of a method for encapsulating deposited first conductive material and deposited second conductive material during a molding process. DETAILED DESCRIPTION The explanations and illustrations presented herein are intended to acquaint others skilled in the art with the teachings, its principles, and its practical application. Those skilled in the art may adapt and apply the teachings in its numerous for