US-20260129333-A1 - HEADPHONES

Abstract

A headphone including a sound generating component is provided. The sound generating component includes a first housing configured to form a first accommodating cavity and a sound generating assembly provided in the first accommodating cavity. The sound generating assembly includes two speakers each of which includes a diaphragm. The two speakers are assembled and cooperated with each other in an axial direction to form a first acoustic cavity between the two speakers. The sound generating assembly and the first housing cooperate with each other to form a second acoustic cavity between the sound generating assembly and the first housing. The second acoustic cavity is isolated from the first acoustic cavity. The first housing is provided with a sound outlet hole communicating with the first acoustic cavity and a pressure relief hole communicating with the second acoustic cavity.

Inventors

• Lei Zhang
• Chaojie CUI
• Lei Zhong
• Weijie Yuan
• Xiaobang WEN

Assignees

• Shenzhen Shokz Co., Ltd.

Dates

Publication Date

20260507

Application Date

20251230

Priority Date

20231211

Claims (20)

1. 1 . A headphone, comprising a sound generating component, the sound generating component comprising: a first housing configured to form a first accommodating cavity; and a sound generating assembly provided in the first accommodating cavity, wherein the sound generating assembly comprises two speakers, each of the two speakers comprises a diaphragm, the two speakers are assembled and cooperated with each other in an axial direction to form a first acoustic cavity between the two speakers, the sound generating assembly and the first housing cooperate with each other to form a second acoustic cavity between the sound generating assembly and the first housing, and the second acoustic cavity is isolated from the first acoustic cavity, the first housing is provided with a sound outlet hole communicating with the first acoustic cavity and a pressure relief hole communicating with the second acoustic cavity, a sound generated by one side of the diaphragm of each of the two speakers is output through the first acoustic cavity and the sound outlet hole, and a sound generated by another side of the diaphragm of each of the two speakers is output through the second acoustic cavity and the pressure relief hole.
2. 2 . The headphone according to claim 1 , wherein the two speakers have same acoustic characteristics and are coaxially disposed along the axial direction.
3. 3 . The headphone according to claim 1 , wherein the sound generating assembly further comprises a mounting bracket, the mounting bracket is provided in an annular shape, the two speakers are assembled and cooperated with two ends of the mounting bracket, respectively, to form the first acoustic cavity, and the mounting bracket is provided with a first sound-guiding hole through which the sound outlet hole and the first acoustic cavity are in communication with each other.
4. 4 . The headphone according to claim 1 , wherein each of the two speakers includes a voice coil, a magnetic circuit system, and a frame, wherein the frame is configured to support the diaphragm and the magnetic circuit system, the voice coil is connected to the diaphragm and provided within a magnetic field formed by the magnetic circuit system, the frames of the two speakers are assembled and cooperated with each other to form the first acoustic cavity, and at least one of the frames of the two speakers is provided with a first sound-guiding hole through which the sound outlet hole and the first acoustic cavity are in communication with each other.
5. 5 . The headphone according to claim 4 , wherein the diaphragms of the two speakers are disposed adjacent to each other, and the diaphragm of each of the two speakers is disposed on one side away from the magnetic circuit system corresponding to the speaker, and the first acoustic cavity is formed between the diaphragms of the two speakers.
6. 6 . The headphone according to claim 5 , wherein the sound outlet hole and the first sound-guiding hole are in communication with each other along a radial direction of the sound generating assembly, each of the sound outlet hole and the first sound-guiding hole is provided in a shape of a bar, and a length direction of the sound outlet hole and a length direction of the first sound-guiding hole are disposed along a circumferential direction of the sound generating assembly.
7. 7 . The headphone according to claim 5 , wherein a second sound-guiding hole is provided in the frame of each of the two speakers, and the second sound-guiding hole communicates a side of the diaphragm corresponding to the second sound-guiding hole and facing toward the magnetic circuit system with the second acoustic cavity.
8. 8 . The headphone according to claim 7 , wherein sides of the diaphragms of the two speakers facing their respective magnetic circuit systems share the second acoustic cavity and the pressure relief hole.
9. 9 . The headphone according to claim 5 , wherein one end of the magnetic circuit system away from the corresponding diaphragm is provided protruding from the frame, and a radial dimension of a protruding portion of the magnetic circuit system relative to the frame is less than a radial dimension at a support position where the frame supports the diaphragm.
10. 10 . The headphone according to claim 4 , wherein the sound generating assembly is provided with a mounting boss, the first sound-guiding hole is provided on the mounting boss, and the mounting boss abuts against the first housing at a periphery of the sound outlet hole to isolate the first sound-guiding hole and the sound outlet hole from the second acoustic cavity; or the first housing is provided with the mounting boss, the sound outlet hole is provided on the mounting boss, and the mounting boss abuts against the sound generating assembly at a periphery of the first sound-guiding hole to isolate the first sound-guiding hole and the sound outlet hole from the second acoustic cavity.
11. 11 . The headphone according to claim 10 , wherein the sound generating assembly further comprises a mounting bracket, the mounting boss is disposed on the mounting bracket, the mounting bracket further comprises a bracket body connected to the mounting boss along a circumferential direction of the sound generating assembly and disposed in a defective annular shape, the bracket body is provided with two first support platforms that are opposite to each other along the axial direction, an outer end surface of the frame proximate to a side of the corresponding diaphragm is supported on the corresponding first support platform, and the mounting boss protrudes from the bracket body along the axial direction and a radial direction of the sound generating assembly, respectively, and is disposed at outer sides of outer peripheral surfaces of the two frames.
12. 12 . The headphone according to claim 4 , wherein the two frames are provided with pads and sound-guiding holes spaced apart from each other along a circumferential direction of the sound generating assembly, the sound-guiding hole is in communication with a side of the corresponding diaphragm facing the magnetic circuit system corresponding to the sound-guiding hole and the second acoustic cavity, each frame and a mounting bracket are provided with limiting structures cooperating with each other, the limiting structures are configured to limit the frame and the mounting bracket along the circumferential direction of the sound generating assembly, the limiting structures of the two frames are disposed opposite to each other in the axial direction, the sound generating assembly has a radial plane disposed along the axial direction and passing through the limiting structure, the pads on each frame are mirrored with respect to the radial plane, and the sound-guiding holes on the two frames are mirror symmetric with respect to the radial plane.
13. 13 . The headphone according to claim 10 , further comprising an ear hook and an abutting component, wherein the ear hook connects the sound generating component to the abutting component, in a wearing state, the sound generating component and the abutting component form a clamping state at both sides of a helix of a user, and the sound generating component is located in a cavum concha, wherein the first housing comprises a first rigid housing and a second rigid housing, the first rigid housing is connected to the ear hook, the first rigid housing and the second rigid housing enclose to form the first accommodating cavity, and the sound outlet hole is provided on the second rigid housing.
14. 14 . The headphone according to claim 13 , wherein the second rigid housing is provided with a protruding block protruding with respect to an end surface of the second rigid housing, the first rigid housing is provided with a groove recessed with respect to an end surface of the first rigid housing, the protruding block is embedded in the groove, and the sound outlet hole is partially provided in the protruding block.
15. 15 . The headphone according to claim 13 , wherein the mounting boss is disposed in the second rigid housing or in the sound generating assembly, the first rigid housing is provided with a third support platform inside, and the third support platform is configured to support the sound generating assembly to hold the sound generating assembly and the second rigid housing to abut against each other via the mounting boss when the first rigid housing and the second rigid housing are fixed to each other.
16. 16 . The headphone according to claim 1 , further comprising an ear hook and an abutting component, wherein the ear hook connects the sound generating component to the abutting component, and in a wearing state, the sound generating component and the abutting component form a clamping state at both sides of a helix of an ear of a user, and the sound generating component is located in a cavum concha, wherein the sound outlet hole and the pressure relief hole are mirror symmetric with respect to a symmetry plane provided along a length direction of the ear hook, respectively.
17. 17 . The headphone according to claim 16 , wherein on the symmetry plane, the pressure relief hole is provided towards the helix, and the sound outlet hole and the pressure relief hole are spaced apart from each other by a contact area between the first housing and the ear.
18. 18 . The headphone according to claim 1 , wherein the sound generating component is provided to keep at least a portion of an earhole open within the cavum concha.
19. 19 . A headphone, comprising a sound generating assembly, wherein the sound generating assembly includes two speakers, each of the two speakers includes a diaphragm, the two speakers cooperate with each other in an axial direction and the diaphragms of the two speakers are disposed adjacent to each other, and a ratio of a maximum axial dimension of the sound generating assembly to a maximum radial dimension of the sound generating assembly is in a range of 0.8˜1.3.
20. 20 . A headphone, comprising a sound generating assembly, wherein the sound generating assembly includes two speakers, each of the two speakers includes a diaphragm, the diaphragms of the two speakers are disposed adjacent to each other in an axial direction, each of the diaphragms of the two speakers has a resonant peak frequency between 200 Hz and 300 Hz, and an absolute difference of resonant peak frequencies of the diaphragms of the two speakers is less than or equal to 50 Hz.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Patent Application No. PCT/CN2024/079714, filed on Mar. 1, 2024, which claims the priority of Chinese Patent Application No. 202311701969.7, filed on Dec. 11, 2023, Chinese Patent Application No. 202410174897.3, filed on Feb. 6, 2024, Chinese Patent Application No. 202410174900.1, filed on Feb. 6, 2024, and Chinese Patent Application No. 202410174802.8, filed on Feb. 6, 2024, the contents of each of which are hereby incorporated by reference. TECHNICAL FIELD The present disclosure generally relates to the field of electronic devices, and in particular to a headphone. BACKGROUND Headphones are widely used in people's daily lives. Headphones can be used with electronic devices, such as mobile phones, computers, etc., to provide sound playback functions for users. Ear-clip headphones are a new type of headphone. Ear-clip headphones usually have a small volume and can be clipped to a user's helix for use. Furthermore, these ear-clip headphones do not block the ear canal. Ear-clip headphones not only ensure safety in outdoor scenarios but also provide better wearing comfort compared to in-ear headphones. However, the sound quality of current ear-clip headphones is difficult to meet requirements. SUMMARY One or more embodiments of the present disclosure provide a headphone. The headphone includes a sound generating component. The sound generating component includes a first housing and a sound generating assembly. The first housing is configured to form a first accommodating cavity. The sound generating assembly is provided in the first accommodating cavity. The sound generating assembly includes two speakers. Each of the two speakers includes a diaphragm. The two speakers are assembled and cooperated with each other in an axial direction to form a first acoustic cavity between the two speakers. The sound generating assembly and the first housing cooperate with each other to form a second acoustic cavity between the sound generating assembly and the first housing. The second acoustic cavity is isolated from the first acoustic cavity. The first housing is provided with a sound outlet hole communicating with the first acoustic cavity and a pressure relief hole communicating with the second acoustic cavity. A sound generated by one side of the diaphragm of each of the two speakers is output through the first acoustic cavity and the sound outlet hole. A sound generated by another side of the diaphragm of each of the two speakers is output through the second acoustic cavity and the pressure relief hole. Providing two speakers in the sound generating assembly can effectively increase the sound pressure level of the sound generating assembly, thereby achieving better volume performance. This allows a user to hear clearer sound and effectively improves the sound quality of the headphone. In some embodiments, the two speakers have same acoustic characteristics and are coaxially disposed along the axial direction. In some embodiments, the sound generating assembly further includes a mounting bracket. The mounting bracket is provided in an annular shape. The two speakers are assembled and cooperated with two ends of the mounting bracket, respectively, to form the first acoustic cavity. The mounting bracket is provided with a first sound-guiding hole through which the sound outlet hole and the first acoustic cavity are in communication with each other. In some embodiments, each of the two speakers includes a voice coil, a magnetic circuit system, and a frame. The frame is configured to support the diaphragm and the magnetic circuit system. The voice coil is connected to the diaphragm and provided within a magnetic field formed by the magnetic circuit system. The frames of the two speakers are assembled and cooperated with the mounting bracket. In some embodiments, each of the two speakers includes a voice coil, a magnetic circuit system, and a frame. The frame is configured to support the diaphragm and the magnetic circuit system. The voice coil is connected to the diaphragm and provided within a magnetic field formed by the magnetic circuit system. The frames of the two speakers are assembled and cooperated with each other to form the first acoustic cavity. At least one of the frames of the two speakers is provided with a first sound-guiding hole through which the sound outlet hole and the first acoustic cavity are in communication with each other In some embodiments, the diaphragms of the two speakers are disposed adjacent to each other, and the diaphragm of each of the two speakers is disposed on one side away from the magnetic circuit system corresponding to the speaker. The first acoustic cavity is formed between the diaphragms of the two speakers. In some embodiments, the sound outlet hole and the first sound-guiding hole are in communication with each other along a radial direction of the sound generating assembly. Each of the s