US-20260129352-A1 - EARPHONES
Abstract
The present disclosure relates to an earphone. The earphone includes a first speaker, a second speaker, and a driving circuit. The driving circuit is configured to drive the first speaker and the second speaker, at least a portion of a frequency band of sound output by the first speaker is lower than a frequency band of sound output by the second speaker. The earphone further includes a high-pass frequency divider disposed between the driving circuit and the second speaker and configured to perform frequency division on an audio driving signal provided by the driving circuit to the second speaker, and a frequency-dividing point of the high-pass frequency divider is set to be not lower than 6 kHz.
Inventors
- Jianing LIANG
- Zhen Wang
- Chong Wang
- Lei Zhang
- Xin Qi
Assignees
- Shenzhen Shokz Co., Ltd.
Dates
- Publication Date
- 20260507
- Application Date
- 20251228
Claims (20)
- 1 . An earphone, comprising a first speaker; a second speaker; a driving circuit configured to drive the first speaker and the second speaker, wherein at least a portion of a frequency band of sound output by the first speaker is lower than a frequency band of sound output by the second speaker; and a high-pass frequency divider disposed between the driving circuit and the second speaker and configured to perform frequency division on an audio driving signal provided by the driving circuit to the second speaker, and a frequency-dividing point of the high-pass frequency divider is set to be not lower than 6 KHz.
- 2 . The earphone according to claim 1 , wherein the frequency-dividing point of the high-pass frequency divider is set to be not higher than 9 kHz.
- 3 . The earphone according to claim 1 , wherein the frequency-dividing point of the high-pass frequency divider is set to be not lower than 8 KHz.
- 4 . The earphone according to claim 1 , wherein the high-pass frequency divider is a one-order frequency divider consisting of a single capacitor.
- 5 . The earphone according to claim 1 , wherein a ratio of a resonant frequency of the second speaker to the frequency-dividing point is between 0.75 and 1.25.
- 6 . The earphone according to claim 5 , wherein the resonant frequency of the second speaker is equal to or greater than the frequency-dividing point.
- 7 . The earphone according to claim 1 , wherein the driving circuit is configured to simultaneously drive the first speaker and the second speaker via a same digital-to-analog conversion (DAC) circuit.
- 8 . The earphone according to claim 5 , wherein the audio driving signal of the driving circuit is configured to be directly input to the first speaker without undergoing frequency division processing.
- 9 . The earphone according to claim 1 , wherein a frequency-dividing point of the high-pass frequency divider is set such that a sound pressure level attenuation of sound output by the second speaker is not less than 20 dB.
- 10 . The earphone according to claim 9 , wherein the frequency-dividing point of the high-pass frequency divider is between 6 KHz and 9 kHz, and the sound pressure level attenuation of the sound output by the second speaker is not less than 30 dB.
- 11 . The earphone according to claim 1 , further comprising: a low-pass frequency divider connected in series with the first speaker, and is between the driving circuit and the first speaker, and configured to perform frequency division on an audio driving signal provided by the driving circuit to the first speaker.
- 12 . The earphone according to claim 11 , wherein the low-pass frequency divider is a one-order frequency divider consisting of a single inductor.
- 13 . The earphone according to claim 1 , wherein the second speaker includes: a second diaphragm for vibrating to generate sound, a second magnetic circuit system for driving the second diaphragm to generate the sound, and a speaker housing for carrying and mounting the second diaphragm and the second magnetic circuit system, a side of the second diaphragm facing away from the second magnetic circuit system forms a front cavity with a core housing for accommodating the first speaker and the second speaker, a side of the second diaphragm facing toward the second magnetic circuit system forms a rear cavity with the speaker housing, wherein the speaker housing is provided with a communication hole that communicates the rear cavity with an outside of the second speaker, and the communication hole penetrates through the second magnetic circuit system and extends toward the second diaphragm.
- 14 . The earphone according to claim 13 , wherein an acoustic resistance at the communication hole is in a range of 5×10 8 Pa·s/m−1.3×10 9 Pa·s/m.
- 15 . The earphone according to claim 13 , wherein an aperture range of the communication hole is 0.8 mm to 1.2 mm.
- 16 . An earphone, comprising: a first speaker; a second speaker; a driving circuit configured to drive the first speaker and the second speaker; and a high-pass frequency divider disposed between the driving circuit and the second speaker, wherein a frequency-dividing point of the high-pass frequency divider is set such that a sound pressure level attenuation of sound output by the second speaker is not less than 20 dB.
- 17 . The earphone according to claim 16 , wherein a ratio of a resonant frequency of the second speaker to the frequency-dividing point is between 0.75 and 1.25.
- 18 . The earphone according to claim 16 , wherein the frequency-dividing point of the high-pass frequency divider is between 6 kHz and 9 kHz, and the sound pressure level attenuation of the sound output by the second speaker is not less than 30 dB.
- 19 . The earphone according to claim 18 , wherein the high-pass frequency divider performs first-order frequency division on an audio driving signal provided by the driving circuit to the second speaker.
- 20 . The earphone according to claim 16 , further comprising: a low-pass frequency divider connected in series with the first speaker, and is between the driving circuit and the first speaker, and configured to perform frequency division on an audio driving signal provided by the driving circuit to the first speaker.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of International Patent Application No. PCT/CN2024/095602, filed on May 27, 2024, the contents of which are hereby incorporated by reference. TECHNICAL FIELD The present disclosure generally relates to the field of electronic devices, and more particularly, to an earphone. BACKGROUND With the development of acoustic technology, earphones have been widely used in people's daily lives. An earphone may use a combination of a plurality of speakers to output sound, so as to provide an auditory feast for a user. In the use of the earphone, different speakers may be responsible for outputting sounds of different frequency bands. Generally, a plurality of speakers that emit sounds of different frequency bands may adopt a driving manner of single-channel electrical signal driving or multi-channel electrical signal driving. When the single-channel electrical signal driving is adopted, since the diaphragm of a speaker responsible for outputting a sound of a relatively high frequency band is usually thin, the diaphragm may experience excessive amplitude when receiving a low-frequency signal, leading to distortion that compromises sound quality and user experience. SUMMARY The present disclosure provides an earphone. The earphone includes a first speaker, a second speaker, and a driving circuit. The driving circuit is configured to drive the first speaker and the second speaker. At least a portion of a frequency band of sound output by the first speaker is lower than a frequency band of sound output by the second speaker. The earphone further includes a high-pass frequency divider disposed between the driving circuit and the second speaker and configured to perform frequency division on an audio driving signal provided by the driving circuit to the second speaker, and a frequency-dividing point of the high-pass frequency divider is set to be not lower than 6 KHz. In some embodiments, the frequency-dividing point of the high-pass frequency divider is set to be not higher than 9 kHz. In some embodiments, the frequency-dividing point of the high-pass frequency divider is set to be not lower than 8 KHz. In some embodiments, the high-pass frequency divider is a one-order frequency divider consisting of a single capacitor. In some embodiments, a ratio of a resonant frequency of the second speaker to the frequency-dividing point is between 0.75 and 1.25. In some embodiments, the resonant frequency of the second speaker is equal to or greater than the frequency-dividing point. In some embodiments, the driving circuit is configured to simultaneously drive the first speaker and the second speaker via a same digital-to-analog conversion circuit (DAC) circuit. In some embodiments, the audio driving signal of the driving circuit is configured to be directly input to the first speaker without undergoing frequency division processing. The present disclosure provides an earphone. The earphone includes a first speaker, a second speaker, and a driving circuit. The driving circuit is configured to drive the first speaker and the second speaker. The earphone further includes a high-pass frequency divider disposed between the driving circuit and the second speaker. A frequency-dividing point of the high-pass frequency divider is set such that a sound pressure level attenuation of sound output by the second speaker is not less than 20 dB. In some embodiments, a ratio of a resonant frequency of the second speaker to the frequency-dividing point is between 0.75 and 1.25. In some embodiments, the frequency-dividing point of the high-pass frequency divider is between 6 kHz and 9 kHz, and the sound pressure level attenuation of the sound output by the second speaker is not lower than 30 dB. In some embodiments, the high-pass frequency divider performs first-order frequency division on an audio driving signal provided by the driving circuit to the second speaker. BRIEF DESCRIPTION OF THE DRAWINGS In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings may be obtained from these drawings without creative effort. FIG. 1 is a schematic diagram illustrating an exemplary structure of an earphone according to some embodiments of the present disclosure; FIG. 2 is a schematic diagram illustrating an exemplary structure of the earphone in FIG. 1 from another perspective according to some embodiments of the present disclosure; FIG. 3 is a schematic diagram illustrating an exemplary structure of the earphone in FIG. 1 from another perspective according to some embodiments of the present disclosure; FIG. 4 is a schematic diagram illustrating an exemplary front profile of an ear of a