US-20260129742-A1 - PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE COMPRISING SAME

US20260129742A1US 20260129742 A1US20260129742 A1US 20260129742A1US-20260129742-A1

Abstract

A printed circuit board assembly is provided. The printed circuit board assembly includes a printed circuit board (PCB), a plurality of electronic components configured to be mounted on a first surface of the PCB, a first shielding member configured to cover the plurality of electronic components, and a heat transfer member received within the first shielding member, having a portion disposed in a space formed between the plurality of electronic components, and configured to be thermally deformable.

Inventors

Yoonhee Chang
Haejin LEE
Min Park
Jeonggen YOON
Myungjun KIM
Jinhyeok Park
Jieun HWANG
JungHoon Kim
Jongdo PARK
Jonggeun YOON

Assignees

SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20251231
Priority Date: 20230731

Claims (15)

1 . A printed circuit board assembly comprising: a printed circuit board (PCB); a plurality of electronic components configured to be mounted on a first surface of the PCB; a first shielding member configured to cover the plurality of electronic components; and a heat transfer member received within the first shielding member, having a portion disposed in a space formed between the plurality of electronic components, and configured to be thermally deformable.
2 . The printed circuit board assembly of claim 1 , wherein the heat transfer member is configured to have a glass transition temperature of 40 degrees Celsius or higher.
3 . The printed circuit board assembly of claim 1 , further comprising: a main heat generating element mounted on a portion corresponding to the heat transfer member on a second surface opposite to the first surface of the PCB.
4 . The printed circuit board assembly of claim 1 , further comprising: at least one second shielding member disposed around the first shielding member, wherein the first shielding member includes a graphite sheet extending from an upper surface of the first shielding member and configured to cover the at least one second shielding member.
5 . The printed circuit board assembly of claim 1 , wherein the heat transfer member includes at least one of a rubber material or a phase change material (PCM)-based material.
6 . An electronic device comprising: a housing; a display; and a printed circuit board assembly disposed within the housing, wherein the printed circuit board assembly includes: a printed circuit board (PCB), a plurality of electronic components mounted on a first surface of the PCB, a first shielding member provided to cover the plurality of electronic components, and a heat transfer member received within the first shielding member, having at least a portion disposed in a space formed between the plurality of electronic components, and configured to be thermally deformable.
7 . The electronic device of claim 6 , wherein the heat transfer member has a glass transition temperature of 40 degrees Celsius or higher.
8 . The electronic device of claim 6 , further comprising: a main heat generating element mounted on a portion corresponding to the heat transfer member on a second surface opposite to the first surface of the PCB.
9 . The electronic device of claim 6 , wherein the first shielding member includes a graphite sheet.
10 . The electronic device of claim 9 , wherein the printed circuit board assembly further includes at least one second shielding member disposed around the first shielding member, and wherein the graphite sheet extends from an upper surface of the first shielding member and is configured to cover the at least one second shielding member.
11 . The electronic device of claim 6 , wherein the heat transfer member includes at least one of a rubber-based material or a phase change material (PCM)-based material.
12 . A manufacturing method of a printed circuit board assembly, the manufacturing method comprising: disposing a heat transfer member configured to be thermally deformable on a plurality of electronic components mounted on a printed circuit board (PCB); disposing a first shielding member to cover the heat transfer member and the plurality of electronic components; and pressing the first shielding member with an upper jig including a heating block.
13 . The manufacturing method of claim 12 , wherein a glass transition temperature of the heat transfer member is 40 degrees Celsius or higher.
14 . The manufacturing method of claim 12 , wherein the heating block is at 125 degrees Celsius to 135 degrees Celsius, and wherein in pressing the first shielding member with the upper jig, the upper jig presses the first shielding member for 5 seconds or more.
15 . The manufacturing method of claim 12 , wherein in covering the heat transfer member and the plurality of electronic components with the first shielding member, a portion of an upper surface of the first shielding member is disposed to protrude upward, and wherein in case that the upper surface of the first shielding member is pressed by the heating block, a protruding portion of the upper surface of the first shielding member is pressed and the heat transfer member permeates into a space between the plurality of electronic components.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) This application is a continuation application, claiming priority under 35 U.S.C. § 365(c), of an International application No. PCT/KR2024/008619, filed on Jun. 21, 2024, which is based on and claims the benefit of a Korean patent application number 10-2023-0099938, filed on Jul. 31, 2023, in the Korean Intellectual Property Office, and of a Korean patent application number 10-2023-0141831, filed on Oct. 23, 2023, in the Korean Intellectual Property Office, the disclosure of each of which is incorporated by reference herein in its entirety. BACKGROUND 1. Field The disclosure relates to a printed circuit board assembly and an electronic device including the same. 2. Description of Related Art Electronic devices, such as smartphones and tablet computers, are becoming an important means of rapidly changing information transfer. These electronic devices facilitate users' tasks through a graphical user interface (GUI) environment using a touchscreen and provide various multimedia based on a web environment. Electronic devices are equipped with various communication components or electronic components to provide various functions. For example, an electronic device provides a music playback function using stereo sound by having stereo speaker modules equipped thereon. Further, the electronic device has a camera module to provide a photographing function. Also, the electronic device provides a communication function with other electronic devices through a network by a communication module equipped therein. To achieve higher-performance electronic devices, a plurality of electronic components is mounted in a limited printed circuit board space. The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure. SUMMARY Electronic devices may experience increased heat generation from mounted components due to slimmer body designs and use of high-specification application processors (APs). Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide a printed circuit board assembly having an additional heat dissipation structure. Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments. In accordance with an aspect of the disclosure, a printed circuit board assembly is provided. The printed circuit board assembly includes a printed circuit board (PCB), a plurality of electronic components configured to be mounted on a first surface of the PCB, a first shielding member configured to cover the plurality of electronic components, and a heat transfer member received within the first shielding member, having a portion disposed in a space formed between the plurality of electronic components, and configured to be thermally deformable. In accordance with another aspect of the disclosure, an electronic device is provided. The electronic device includes a housing, a display, and a printed circuit board assembly disposed within the housing, wherein the printed circuit board assembly includes a printed circuit board (PCB), a plurality of electronic components mounted on a first surface of the PCB, a first shielding member provided to cover the plurality of electronic components, and a heat transfer member received within the first shielding member, having at least a portion disposed in a space formed between the plurality of electronic components, and configured to be thermally deformable. In accordance with another aspect of the disclosure, a manufacturing method of a printed circuit board assembly is provided. The manufacturing method includes disposing a heat transfer member configured to be thermally deformable on a plurality of electronic components mounted on a printed circuit board (PCB), disposing a first shielding member to cover the heat transfer member and the plurality of electronic components, and pressing the first shielding member with an upper jig including a heating block. According to various embodiments proposed in the disclosure, the printed circuit board assembly has enhanced heat dissipation performance for a main heat generating element such as an AP. Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description take