US-20260129746-A1 - ENHANCE ISOLATION PACKAGE

US20260129746A1US 20260129746 A1US20260129746 A1US 20260129746A1US-20260129746-A1

Abstract

An electronic device is disclosed. The electronic device can include a substrate having metal traces. The substrate can have a length and a width, such that the length is longer than the width. The electronic device can further include one or more dies disposed on a first surface of the substrate and connected to the metal traces. An encapsulant can at least partially surround the first surface and a second surface of the substrate, the second surface opposite the first surface. The electronic device can also include a first slotted aperture disposed in proximity to a first end of the substrate and a second slotted aperture disposed in proximity to a second end of the substrate opposite the first end. The encapsulant can extend through the first slotted aperture and the second slotted aperture. The substrate can be a flexible substrate.

Inventors

David Frank Bolognia

Assignees

ANALOG DEVICES, INC.

Dates

Publication Date: 20260507
Application Date: 20241105

Claims (20)

1 . An electronic device, the electronic device comprising: a substrate having metal traces, the substrate having a length and a width, wherein the length is longer than the width; one or more dies disposed on a first surface of the substrate and connected to the metal traces; an encapsulant at least partially surrounding the first surface and a second surface of the substrate, the second surface opposite the first surface; and a first slotted aperture disposed in proximity to a first end of the substrate and a second slotted aperture disposed in proximity to a second end of the substrate opposite the first end, the encapsulant extending through the first slotted aperture and the second slotted aperture.
2 . The electronic device of claim 1 , wherein the substrate comprises a flexible substrate.
3 . The electronic device of claim 1 , further comprising a plurality of bond pads disposed on the second surface of the substrate, and a plurality of conductive connectors connected to the bond pads, wherein the plurality of conductive connectors comprise a first plurality and a second plurality of conductive connectors and a creepage distance measured between the first plurality and the second plurality of conductive connectors.
4 . The electronic device of claim 1 , further comprising at least one side of the substrate protruding from the encapsulant.
5 . The electronic device of claim 4 , further comprising a first end side of the substrate protruding from the encapsulant, a second end side of the substrate protruding from the encapsulant, wherein the second end is opposite the first end side, wherein the substrate comprises a first aperture through the first end side and a second aperture through a second end side exposed through the encapsulant.
6 . The electronic device of claim 4 , further comprising lateral sides of the substrate extending along a portion of the length, wherein a first lateral side protrudes from the encapsulant, and a second lateral side protruding from the encapsulant, wherein the second lateral side is opposite the first lateral side.
7 . The electronic device of claim 1 , further comprising a plurality of wells formed in the encapsulant on the second surface of the substrate and conductive connectors positioned within the plurality of wells, wherein a first profile of the plurality of wells in relation to a second profile of the conductive connectors provide a standoff height between the substrate and another surface.
8 . An electronic device, the electronic device comprising: a substrate having metal traces, the substrate having a length and a width, wherein the length is longer than the width; one or more dies disposed on a first surface of the substrate and connected to the metal traces, and; an encapsulant at least partially surrounding the first surface and a second surface of the substrate, the second surface opposite the first surface; and at least one side of the substrate protruding from the encapsulant.
9 . The electronic device of claim 8 , wherein the substrate comprises a flexible substrate.
10 . The electronic device of claim 8 , further comprising a plurality of bond pads disposed on the second surface of the substrate, and a plurality of conductive connectors connected to the bond pads.
11 . The electronic device of claim 8 , further comprising a first end side of the substrate protruding from the encapsulant, and a second end side of the substrate protruding from the encapsulant, wherein the second end side is opposite the first end side, wherein the substrate comprises a first aperture through the first end side and a second aperture through a second end side exposed through the encapsulant.
12 . The electronic device of claim 8 , further comprising lateral sides of the substrate extending along a portion of the length, wherein a first lateral side protrudes from the encapsulant, and a second lateral side protruding from the encapsulant, wherein the second lateral side is opposite the first lateral side.
13 . The electronic device of claim 8 , further comprising, further comprising a plurality of wells formed in the encapsulant on the second surface of the substrate and conductive connectors positioned within the plurality of wells, wherein a first profile of the plurality of wells in relation to a second profile of the conductive connectors provide a standoff height between the substrate and another surface.
14 . The electronic device of claim 8 , further comprising a first slotted aperture disposed in proximity to a first end of the substrate and a second slotted aperture disposed in proximity to a second end of the substrate opposite the first end, the encapsulant extending through the first slotted aperture and the second slotted aperture.
15 . A method for forming an electronic device, the method comprising: providing a substrate having a first surface and a second surface, the second surface opposite the first surface, and a length and a width, the length longer than the width; forming metal traces on the first surface of the substrate and mounting one or more dies on the first surface of the substrate and electrically connecting the one more dies to the metal traces; injecting an encapsulant to surround the first and second surfaces of the substrate; and forming a first slotted aperture disposed in proximity to a first end and a second slotted aperture disposed in proximity a second end of the substrate, the second end opposite the first end, the encapsulant extending through the first slotted aperture and the second slotted aperture.
16 . The method of claim 15 , further comprising patterning a perimeter trace on the first surface of the substrate which increases tension and reduces deformation of the substrate.
17 . The method of claim 15 , further comprising protruding at least one side of the substrate from the encapsulant.
18 . The method of claim 17 , further comprising protruding a first end side of the substrate from the encapsulant, protruding a second end side of the substrate protruding from the encapsulant, wherein the second end is opposite the first end side, and forming a first aperture through the first end side and a second aperture through the second end side exposed through the encapsulant.
19 . The method of claim 17 , further comprising protruding a first lateral side of lateral sides extending along the length of the substrate from the encapsulant, and protruding a second lateral side from the encapsulant, wherein the second lateral side is opposite the first lateral side.
20 . The method of claim 15 , further comprising forming a plurality of wells in the encapsulant on the second surface of the substrate by applying a force on the substrate to form depressions for fitting conductive connectors in the plurality of wells, wherein forming the wells further comprises forming a first plurality of wells on the first end and forming a second plurality of wells on a second end of the substrate, and mounting a first plurality of conductive connectors in the first plurality of wells and a second plurality of conductive connectors in the second plurality of wells, wherein a first profile of the plurality of wells in relation to a second profile of the conductive connectors provide a standoff height between the substrate and another surface.

Description

BACKGROUND Field This disclosure relates to electric device structures and methods. In particular, some implementations are directed to methods and structures for assembling a high creepage electronic device for high voltage isolation. Description of the Related Art The approaches described in this section are approaches that could be pursued, but not necessarily approaches that have been previously conceived or pursued. Therefore, unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section. Advancements have been made to improve the integration and performance of microelectronic devices. As microelectronic devices become more complex, the importance of packaging solutions and processes has been developed to address the challenges posed by demands for compact and efficient designs. SUMMARY For purposes of summarizing the disclosure and the advantages achieved over the prior art, certain objects and advantages of the disclosure are described herein. Not all such objects or advantages may be achieved in any particular implementation. Thus, for example, those skilled in the art will recognize that the devices, systems, and methods may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other objects or advantages as may be taught or suggested herein. All of these implementations are intended to be within the scope of the devices, systems, and methods herein disclosed. These and other implementations will become readily apparent to those skilled in the art from the following detailed description of the implementations having reference to the attached figures, the devices, systems, and methods not being limited to any particular implementations disclosed. In some implementations, an electronic device can include: a substrate having metal traces, the substrate having a length and a width, wherein the length is longer than the width; one or more dies disposed on a first surface of the substrate and connected to the metal traces; an encapsulant at least partially surrounding the first surface and a second surface of the substrate, the second surface opposite the first surface; and a first slotted aperture disposed in proximity to a first end of the substrate and a second slotted aperture disposed in proximity to a second end of the substrate opposite the first end, the encapsulant extending through the first slotted aperture and the second slotted aperture. In some implementations, the substrate includes a flexible substrate. In some implementations, the electronic device includes a plurality of bond pads disposed on the second surface of the substrate, and a plurality of conductive connectors connected to the bond pads. In some implementations, the plurality of conductive connectors include a first plurality and a second plurality of conductive connectors. In some implementations, the first plurality and the second plurality of conductive connectors are spaced apart greater than the width of the substrate. In some implementations, electronic device can include a creepage distance measured between the first plurality and the second plurality of conductive connectors. In some implementations, the measured creepage distance is 15 mm. In some implementations, the electronic device, further including at least one side of the substrate protruding from the encapsulant. In some implementations, the electronic device includes a first end side of the substrate protruding from the encapsulant. In some implementations, the electronic device includes a second end side of the substrate protruding from the encapsulant, wherein the second end is opposite the first end side. In some implementations, the substrate includes a first aperture through the first end side and a second aperture through a second end side exposed through the encapsulant. In some implementations, the electronic device includes lateral sides of the substrate extending along a portion of the length, wherein a first lateral side protrudes from the encapsulant. In some implementations, the electronic device includes a second lateral side protruding from the encapsulant, wherein the second lateral side is opposite the first lateral side. In some implementations, the electronic device includes a perimeter patterned trace on the first surface of the substrate. In some implementations, the metal traces include copper. In some implementations, the length and the width of the substrate include an aspect ratio of 2:1. In some implementations, the length and the width of the substrate include an aspect ratio of 3:1. In some implementations, the substrate includes at least one of paper, polyethylene terephthalate (PET), and polyimide. In some implementations, the electronic device includes a plurality of wells formed in the encapsulant on the second surface