US-20260129747-A1 - PRINTED CIRCUIT BOARD

US20260129747A1US 20260129747 A1US20260129747 A1US 20260129747A1US-20260129747-A1

Abstract

A printed circuit board includes a frame having a through-portion, a core layer disposed within the through-portion, the core layer comprising a glass layer and a metal via that passes through at least a portion of the glass layer, and a first insulating layer that covers at least a portion of both the frame and the core layer, the insulating layer filling at least a portion of the through-portion. In one embodiment, the overall thickness of the frame is greater than the overall thickness of the core layer, thereby facilitating improved process capability and enhanced variation characteristics. The printed circuit board is particularly suited for high-performance and miniaturized electronic applications.

Inventors

In Gun KIM

Assignees

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20250410
Priority Date: 20241106

Claims (20)

1 . A printed circuit board, comprising: a glass layer having a through-hole; a first insulating material disposed on a wall surface of the through-hole and in contact with the wall surface of the through-hole; and a first metal via including a first metal seed layer disposed on the first insulating material, and a first metal layer disposed on the first metal seed layer and filling at least a portion of the through-hole.
2 . The printed circuit board according to claim 1 , wherein the first insulating material includes an organic insulating material.
3 . (canceled)
4 . The printed circuit board according to claim 21 , wherein the second copper layer has a greater thickness than a thickness of at least one of the titanium layer or the first copper layer.
5 . The printed circuit board according to claim 1 , further comprising: a first metal pattern connected to an upper side of the first metal via; and a second metal pattern connected to a lower side of the first metal via, wherein the first metal pattern includes the first metal seed layer extending onto an upper surface of the first insulating material and an upper surface of the glass layer, and the first metal layer extending onto the first metal seed layer from the upper surface of the first insulating material and the upper surface of the glass layer and protruding to an upper side of the first via hole, and the second metal pattern includes the first metal seed layer extending onto a lower surface of the first insulating material and a lower surface of the glass layer, and the first metal layer extending onto the first metal seed layer from the lower surface of the first insulating material and the lower surface of the glass layer and protruding to a lower side of the first via hole.
6 . The printed circuit board according to claim 5 , wherein an extending portion of the first metal seed layer is in direct contact with the upper surface and the lower surface of the first insulating material, and the upper surface and the lower surface of the glass layer, respectively.
7 . The printed circuit board according to claim 5 , wherein the upper surface of the first insulating material is substantially coplanar with the upper surface of the glass layer, and the lower surface of the first insulating material is substantially coplanar with the lower surface of the glass layer.
8 . The printed circuit board according to claim 5 , wherein the upper surface of the first insulating material is recessed downwardly from the upper surface of the glass layer, the lower surface of the first insulating material is recessed upwardly from the lower surface of the glass layer, the first metal pattern has a step structure on the upper surface of the first insulating material, and the second metal pattern has a step structure on the lower surface of the first insulating material.
9 . The printed circuit board according to claim 1 , wherein the first insulating material has a first via hole in which the first metal via is disposed, in a cross-section penetrating through the through-hole and the first via hole, a shape of the through-hole and a shape of the first via hole are formed independently.
10 . The printed circuit board according to claim 1 , wherein the glass layer further has a through-portion spaced apart from the through-hole, a second insulating material having a plurality of second via holes is disposed within the through-portion, and a plurality of second metal vias are disposed within the plurality of second via holes, respectively, wherein each of the plurality of second metal vias includes a second metal seed layer disposed on a wall surface of each of the plurality of second via holes, and a second metal layer disposed on the second metal seed layer and filling at least a portion of each of the plurality of second via holes.
11 . (canceled)
12 . The printed circuit board according to claim 10 , wherein the plurality of second metal vias are connected to a plurality of third metal patterns on an upper side, respectively, and the plurality of second metal vias are connected to a plurality of fourth metal patterns on a lower side, respectively, wherein each of the plurality of third metal patterns includes the second metal seed layer extending onto an upper surface of the second insulating material, and the second metal layer extending onto the second metal seed layer from the upper surface of the second insulating material and protruding to an upper side of each of the plurality of second via holes, and each of the plurality of fourth metal patterns includes the second metal seed layer extending onto a lower surface of the second insulating material, and the second metal layer extending onto the second metal seed layer from the lower surface of the second insulating material and protruding to a lower side of each of the plurality of second via holes.
13 . The printed circuit board according to claim 10 , wherein each of the upper surface and the lower surface of the second insulating material has a concave portion, and at least one of the plurality of second via holes penetrates between a concave upper surface and a concave lower surface of the second insulating material.
14 . The printed circuit board according to claim 13 , further comprising: a plurality of third metal patterns respectively connected to an upper side of each of the plurality of second metal vias; a plurality of fourth metal patterns respectively connected to a lower side of each of the plurality of second metal vias; a first metal pattern connected to an upper side of the first metal via; and a second metal pattern connected to a lower side of the first metal via, wherein an upper surface of at least one of the plurality of third metal patterns is disposed below an upper surface of the first metal pattern, and a lower surface of at least one of the plurality of fourth metal patterns is disposed above a lower surface of the second metal pattern.
15 . (canceled)
16 . The printed circuit board of claim 1 , further comprising: a build-up portion including an insulating body disposed on the glass layer, one or more interconnection layers respectively disposed on or within the insulating body, and one or more via layers respectively disposed within the insulating body; and a semiconductor chip mounted on the build-up portion.
17 . (canceled)
18 . A printed circuit board, comprising: a glass layer having a through-hole; a first insulating material disposed within the through-hole and having a first via hole; and a first metal via disposed within the first via hole, wherein the first metal via includes: a first metal layer in which at least a portion thereof is disposed on a wall surface of the first via hole; a second metal layer in which at least a portion thereof is disposed on the first metal layer; and a third metal layer disposed on the second metal layer and filling at least a portion of the first via hole, wherein a nano void is formed at a boundary between the second metal layer and the first metal layer.
19 . The printed circuit board according to claim 18 , wherein the first metal layer includes a sputtered copper layer and the second metal layer includes chemical copper.
20 . The printed circuit board according to claim 18 , wherein the nano void is observable using a scanning electron microscope (SEM), a transmission electron microscope (TEM), a scanning transmission electron microscope (STEM), or a focused ion beam (FIB).

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) This application claims benefit of priority to Korean Patent Application No. 10-2024-0155978 filed on Nov. 6, 2024 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. TECHNICAL FIELD The present disclosure relates to a printed circuit board. In order to cope with high performance and miniaturization strategies of semiconductors, a level of miniaturization and densification required for printed circuit boards has been increasing. For example, in order to manufacture high-end products such as a server substrate, a high multilayer and a large body have been required. However, as the number of wiring layers increases and a size of a body increases, a substrate may be more vulnerable to warpage. In order to solve such an issue, using a glass core has been considered. SUMMARY An aspect of the present disclosure is to improve process capability and variation characteristics of a printed circuit board including a glass layer, the printed circuit board having a fine via and a fine insulating thickness. A core layer including a glass layer may be disposed in a through-portion formed in a frame, and the overall thickness of the frame may be made thicker than that of the core layer, such that the frame and an insulating layer, stacked on the core layer, maintain a constant thickness tolerance between them. In this case, a central line of the frame in a thickness direction and a central line of the core layer in a thickness direction may be disposed on different levels. In addition, when an external surface of the frame is viewed through in a direction, perpendicular to the thickness direction, connection vias, formed on upper sides of the frame and the insulating layer, may at least partially overlap each other, and connection vias, formed on lower sides of the frame and the insulating layer, may not entirely overlap each other. According to an aspect of the present disclosure, there is provided a printed circuit board including a frame having a through-portion, a core layer having at least a portion disposed in the through-portion, the core layer including a glass layer and a metal via passing through at least a portion of the glass layer, and a first insulating layer covering at least a portion of each of the frame and the core layer, the first insulating layer filling at least a portion of the through-portion. An overall thickness of the frame may be greater than an overall thickness of the core layer. According to another aspect of the present disclosure, there is provided a printed circuit board including a frame having a through-portion, a core layer having at least a portion disposed in the through-portion, the core layer including a glass layer and a metal via passing through at least a portion of the glass layer, a first insulating layer covering at least a portion of each of the frame and the core layer, the first insulating layer filling at least a portion of the through-portion, a first connection via passing through at least a portion of an upper side of the first insulating layer, the first connection via connected to an upper side of the metal via, and a second connection via passing through at least a portion of a lower side of the first insulating layer, the second connection via connected to a lower side of the metal via. When an external surface of the frame is viewed through in a direction, perpendicular to a thickness direction, the frame and the first connection via may at least partially overlap each other. According to example embodiments of the present disclosure, a printed circuit board including a glass layer, wherein the printed circuit board comprises a fine via and a fine insulating thickness, may have improved process capability and variation characteristics. BRIEF DESCRIPTION OF DRAWINGS The foregoing and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings, in which: FIG. 1 is a schematic block diagram of an example of an electronic device system; FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board; FIG. 3 is a schematic cross-sectional view of another example of a printed circuit board; FIG. 4 is a schematic cross-sectional view of yet another example of a printed circuit board; and FIG. 5 is a schematic cross-sectional view of another example of a printed circuit board. DETAILED DESCRIPTION Hereinafter, example embodiments of the present disclosure are described with reference to the accompanying drawings. The shapes and sizes of components in the drawings may be exaggerated or reduced for clearer description. FIG. 1 is a schematic block diagram of an example of an electronic device system. Referring to the drawings, an electronic device 1000 may accommodate a mainboard 1010. The mainboard 1010 may include ch