US-20260129748-A1 - ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Abstract

The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes a first redistribution structure and a first encapsulant. The first encapsulant supports the first redistribution structure and is configured to function as a first reinforcement to provide a second redistribution structure. The redistribution structure has a plurality of conductive layers disposed over the first redistribution structure.

Inventors

• Hsu-Chiang Shih
• Cheng-Yuan KUNG
• Hung-Yi Lin
• MENG-WEI HSIEH
• Chien-Mei HUANG
• I-Ting Lin
• Sheng-Wen Yang

Assignees

• ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Dates

Publication Date

20260507

Application Date

20251230

Claims (20)

1. 1 . An electronic device, comprising: a plurality of first conductive elements arranged with a first density; a plurality of second conductive elements disposed adjacent to the first conductive elements and arranged with a second density less than the first density; a plurality of first electronic components disposed above the plurality of first conductive elements and the plurality of second conductive elements; and a second electronic component disposed under the plurality of first conductive elements and electrically connected to one of the first electronic components.
2. 2 . The electronic device of claim 1 , further comprising: a first encapsulant encapsulating the plurality of first conductive elements and the plurality of second conductive elements.
3. 3 . The electronic device of claim 2 , wherein the first encapsulant includes fillers.
4. 4 . The electronic device of claim 2 , further comprising: a second encapsulant encapsulating the second electronic component.
5. 5 . The electronic device of claim 1 , further comprising: a circuit structure electrically connecting the second electronic component to the plurality of first conductive elements.
6. 6 . The electronic device of claim 1 , wherein at least one of the plurality of first conductive elements is disposed under one of the plurality of first electronic components.
7. 7 . The electronic device of claim 1 , wherein one of the plurality of first conductive elements has a width less than that of one of the plurality of second conductive elements.
8. 8 . The electronic device of claim 1 , wherein one of the plurality of first conductive elements has a thickness greater than that of one of the plurality of second conductive elements.
9. 9 . The electronic device of claim 1 , wherein a pitch of the plurality of first conductive elements is less than a pitch of the plurality of second conductive elements.
10. 10 . The electronic device of claim 1 , wherein the plurality of second conductive elements has a first group under a first one of the plurality of first electronic components and a second group under a second one of the plurality of first electronic components, and at least one of the plurality of second conductive elements is disposed between the first group and the second group.
11. 11 . The electronic device of claim 1 , wherein one of the plurality of first electronic components vertically overlaps at least one of the plurality of first conductive elements and at least one of the plurality of second conductive elements.
12. 12 . The electronic device of claim 1 , wherein at least one of the plurality of first electronic components comprises a plurality of dies.
13. 13 . The electronic device of claim 12 , further comprising: a third encapsulant encapsulating the plurality of dies.
14. 14 . The electronic device of claim 12 , wherein the second electronic component vertically overlaps a gap between adjacent two of the plurality of first electronic components.
15. 15 . An electronic device, comprising: a plurality of first electronic components disposed adjacent to each other, wherein each one of the plurality of first electronic components comprises a plurality of dies; and a second electronic component electrically connected to and vertically overlapping at least one of the plurality of first electronic components.
16. 16 . The electronic device of claim 15 , further comprising: a first encapsulant encapsulating the plurality of dies.
17. 17 . The electronic device of claim 16 , further comprising: a second encapsulant encapsulating the second electronic component.
18. 18 . The electronic device of claim 17 , further comprising: a conductive element electrically connected to the second electronic component; and a third encapsulant encapsulating the conductive element.
19. 19 . The electronic device of claim 18 , wherein the conductive element is free from overlapping gaps defined by adjacent two of the plurality of first electronic components.
20. 20 . The electronic device of claim 15 , further comprising: a circuit structure having a first surface facing the second electronic component and a second surface facing the plurality of first electronic components, wherein the circuit structure has first pads on the first surface with a first pitch and second pads on the second surface with a second pitch, and the first pitch is less than the second pitch.

Description

CROSS REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser. No. 18/086,579, filed Dec. 21, 2022, now U.S. Pat. No. 12,513,815, the content of which is incorporated herein by reference in its entirety. BACKGROUND 1. Field of the Disclosure The present disclosure generally relates to an electronic device, in particular to an electronic device with a reinforcement configured to reduce warpage of the electronic device. 2. Description of the Related Art To meet the required electrical properties (e.g., low resistance and/or inductance) of an electronic device including different components (e.g., application-specific integrated circuit and/or power management integrated circuit), a redistribution structure including multiple dielectric layers (e.g., six dielectric layers or more) is utilized. However, such redistribution structure may generate significant warpage due to mismatch of coefficient of thermal expansion (CTE) among different materials, which makes the intermediate structure of the electronic device unable to be placed in manufacturing equipment SUMMARY In some embodiments, an electronic device includes a first redistribution structure and a first encapsulant. The first encapsulant supports the first redistribution structure and is configured to function as a first reinforcement to provide a second redistribution structure. The redistribution structure has a plurality of conductive layers disposed over the first redistribution structure. In some embodiments, an electronic device includes a redistribution structure, a first electronic component, a first reinforcement, and a second reinforcement. The first electronic component is disposed over the redistribution structure. The first reinforcement is disposed under the redistribution structure. The second reinforcement is disposed between the redistribution structure and the first electronic component. In some embodiments, a method of manufacturing an electronic device includes: providing a structure comprising a first redistribution structure and a first reinforcement supporting the first redistribution structure; forming a second redistribution structure over the first redistribution structure; and disposing a first electronic component over the second redistribution structure. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of some embodiments of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that various structures may not be drawn to scale, and dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion. FIG. 1A is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 1B is a partial enlarged view of the electronic device as shown in FIG. 1A, in accordance with an embodiment of the present disclosure. FIG. 1C is a partial enlarged view of the electronic device as shown in FIG. 1B, in accordance with an embodiment of the present disclosure. FIG. 2 is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 3A is a cross-sectional view of an electronic device, in accordance with an embodiment of the present disclosure. FIG. 3B is a partial enlarged view of the electronic device as shown in FIG. 3A, in accordance with an embodiment of the present disclosure. FIG. 4 illustrates one or more stages of an example of a method for manufacturing an electronic device according to some embodiments of the present disclosure. FIG. 4A is a partial enlarged view of the structure as shown in FIG. 4, in accordance with an embodiment of the present disclosure. FIG. 5 illustrates one or more stages of an example of a method for manufacturing an electronic device according to some embodiments of the present disclosure. FIG. 6 illustrates one or more stages of an example of a method for manufacturing an electronic device according to some embodiments of the present disclosure. FIG. 7 illustrates one or more stages of an example of a method for manufacturing an electronic device according to some embodiments of the present disclosure. FIG. 7A is a partial enlarged view of the structure as shown in FIG. 7, in accordance with an embodiment of the present disclosure. FIG. 8 illustrates one or more stages of an example of a method for manufacturing an electronic device according to some embodiments of the present disclosure. FIG. 9 illustrates one or more stages of an example of a method for manufacturing an electronic device according to some embodiments of the present disclosure. FIG. 10 illustrates one or more stages of an example of a method for manufacturing an electronic device according to some embodiments of the present disclosure. FIG. 11 illustrates one or more stages of an example of a method for manufacturing an electronic device according to some embodiments of the present disclosur