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US-20260129749-A1 - INTEGRATED PRINTED CIRCUIT BOARD WITH LIGHT GUIDE LAYER

US20260129749A1US 20260129749 A1US20260129749 A1US 20260129749A1US-20260129749-A1

Abstract

Integrated printed circuit boards (PCBs) and methods of manufacturing integrated PCBs are disclosed. In one embodiment, a method of manufacturing an integrated PCB includes depositing quantum sensing material on a first PCB or a second PCB. The first PCB or the second PCB includes one or more processors. The method further includes coupling a light source between the first PCB and the second PCB and coupling a detector between the first PCB and the second PCB. The detector detects light emitted by the quantum sensing material. The method also includes coupling the first PCB and the second PCB to from a light-tight cavity therebetween. The quantum sensing material, the light source, and the detector are disposed within or embedded within the light-tight cavity and the light-tight cavity includes an optical transport layer including silicon nitride.

Inventors

  • Paul Donald SCHMALENBERG
  • Ercan Mehmet DEDE

Assignees

  • TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.

Dates

Publication Date
20260507
Application Date
20241107

Claims (20)

  1. 1 . A method of manufacturing an integrated printed circuit board (PCB), the method comprising: depositing quantum sensing material on a first PCB or a second PCB, wherein the first PCB or the second PCB comprise one or more processors; coupling a light source between the first PCB and the second PCB; coupling a detector between the first PCB and the second PCB, wherein the detector detects light emitted by the quantum sensing material; and coupling the first PCB and the second PCB to from a light-tight cavity therebetween, wherein: the quantum sensing material, the light source, and the detector are disposed within or embedded within the light-tight cavity; and the light-tight cavity comprises an optical transport layer comprising silicon nitride.
  2. 2 . The method of claim 1 , wherein the detector is a silicon based photodetector.
  3. 3 . The method of claim 2 , further comprising encasing the detector within a filter.
  4. 4 . The method of claim 3 , wherein the filter permits light emitted from the quantum sensing material through the filter.
  5. 5 . The method of claim 1 , wherein the quantum sensing material comprises nitrogen vacancy diamond, hexagonal boron nitride, or silicon carbide.
  6. 6 . The method of claim 1 , further comprising coupling a microwave antenna to the first PCB or the second PCB.
  7. 7 . The method of claim 6 , wherein the microwave antenna guides microwaves to the quantum sensing material.
  8. 8 . The method of claim 1 , further comprising coupling a 3D Helmholtz coil to the first PCB or the second PCB.
  9. 9 . The method of claim 8 , further comprising spatially 3D metal printing the 3D Helmholtz coil on the first PCB or the second PCB.
  10. 10 . The method of claim 9 , wherein the spatially 3D metal printing on the first PCB or the second PCB is an electrochemical additive process.
  11. 11 . A method of manufacturing an integrated printed circuit board (PCB), the method comprising: depositing quantum sensing material on a first PCB or a second PCB, wherein the first PCB or the second PCB comprise one or more processors; coupling a light source between the first PCB and the second PCB; coupling a detector between the first PCB and the second PCB, wherein the detector detects light emitted by the quantum sensing material and the detector is a silicon based photodetector; coupling a microwave antenna to the first PCB or the second PCB; and coupling the first PCB and the second PCB to from a light-tight cavity therebetween, wherein: the quantum sensing material, the light source, and the detector are disposed within or embedded within the light-tight cavity; and the light-tight cavity comprises an optical transport layer comprising silicon nitride.
  12. 12 . The method of claim 11 , wherein the microwave antenna guides microwaves to the quantum sensing material.
  13. 13 . The method of claim 11 , further comprising coupling a 3D Helmholtz coil to the first PCB or the second PCB.
  14. 14 . The method of claim 13 , further comprising spatially 3D metal printing the 3D Helmholtz coil on the first PCB or the second PCB.
  15. 15 . The method of claim 14 , wherein the spatially 3D metal printing on the first PCB or the second PCB is an electrochemical additive process.
  16. 16 . An integrated printed circuit board (PCB) comprising: a first PCB; a second PCB coupled to the first PCB, wherein the first PCB and the second PCB form a light-tight cavity therebetween, the light-tight cavity comprising an optical transport layer comprising silicon nitride; quantum sensing material deposited on or embedded within the first PCB or the second PCB in the light-tight cavity; a light source coupled to the first PCB or the second PCB in the light-tight cavity; and a detector coupled to the first PCB or the second PCB in the light-tight cavity, wherein the detector detects light emitted by the quantum sensing material.
  17. 17 . The integrated PCB of claim 16 , further comprising a microwave antenna coupled to the first PCB or the second PCB, wherein the microwave antenna guides microwaves to the quantum sensing material.
  18. 18 . The integrated PCB of claim 16 , further comprising a 3D Helmholtz coil coupled to the first PCB or the second PCB.
  19. 19 . The integrated PCB of claim 16 , wherein the 3D Helmholtz coil is spatially 3D metal printed on the first PCB or the second PCB.
  20. 20 . The integrated PCB of claim 16 , further comprising a filter encasing the detector, wherein the filter permits light emitted from the quantum sensing material through the filter.

Description

TECHNICAL FIELD The embodiments described herein generally relate to printed circuit boards. In particular, embodiments of the present disclosure are directed to printed circuit boards in electronic devices used as sensors. BACKGROUND Printed circuit boards (PCBs) may be made of various materials and integrated into various electronic systems. Specifically, PCBs may be utilized in sensor technology. However, existing materials may limit sensing capabilities, as inaccuracies may occur. Moreover, existing materials are limited in sensitivity and are often require large surface areas. Accordingly, a need exists for a PCB sensor with high rates of accuracy, increased sensitivity, and compactness. SUMMARY In one embodiment, a method of manufacturing an integrated PCB is provided. The method includes depositing quantum sensing material on a first PCB or a second PCB. The first PCB or the second PCB include one or more processors. The method further includes coupling a light source between the first PCB and the second PCB and coupling a detector between the first PCB and the second PCB. The detector detects light emitted by the quantum sensing material. The method also includes coupling the first PCB and the second PCB to from a light-tight cavity therebetween. The quantum sensing material, the light source, and the detector are disposed within or embedded within the light-tight cavity and the light-tight cavity includes an optical transport layer including silicon nitride. In another embodiment, a method of manufacturing an integrated PCB includes depositing quantum sensing material on a first PCB or a second PCB. The first PCB or the second PCB include one or more processors. The method further includes coupling a light source between the first PCB and the second PCB and coupling a detector between the first PCB and the second PCB. The detector detects light emitted by the quantum sensing material and the detector is a silicon based photodetector. The method also includes coupling a microwave antenna to the first PCB or the second PCB and coupling the first PCB and the second PCB to from a light-tight cavity therebetween. The quantum sensing material, the light source, and the detector are disposed within or embedded within the light-tight cavity and the light-tight cavity includes an optical transport layer including silicon nitride. In yet another embodiment, in integrated PCB is provided. The integrated PCB includes a first PCB and a second PCB coupled to the first PCB. The first PCB and the second PCB form a light-tight cavity therebetween and the light-tight cavity includes an optical transport layer including silicon nitride. The integrated PCB also includes quantum sensing material deposited on or embedded within the first PCB or the second PCB in the light-tight cavity, a light source coupled to the first PCB or the second PCB in the light-tight cavity, and a detector coupled to the first PCB or the second PCB in the light-tight cavity. The detector detects light emitted by the quantum sensing material. These and additional features provided by the embodiments described herein will be more fully understood in view of the following detailed description, in conjunction with the drawings. BRIEF DESCRIPTION OF THE DRAWINGS The embodiments set forth in the drawings are illustrative and exemplary in nature and not intended to limit the subject matter defined by the claims. The following detailed description of the illustrative embodiments can be understood when read in conjunction with the following drawings, where like structure is indicated with like reference numerals and in which: FIG. 1 schematically illustrates a side cross-sectional view of an integrated PCB, according to one or more embodiments described and illustrated herein; FIG. 2 schematically illustrates a block diagram depicting a method of manufacturing an integrated PCB, according to one or more embodiments described and illustrated herein; and FIG. 3 schematically illustrates a block diagram depicting a method of manufacturing an integrated PCB, according to one or more embodiments described and illustrated herein. DETAILED DESCRIPTION Embodiments described herein relate to integrated printed circuit boards (PCBs) with a light guide layer including silicon nitride and methods of manufacturing such integrated PCBs. In embodiments, a method of manufacturing an integrated PCB includes depositing quantum sensing material on a first PCB or a second PCB, coupling light source between the first PCB and the second PCB, coupling a detector between the first PCB and the second PCB, and coupling the first PCB and the second PCB to form a light-tight cavity therebetween, such that the quantum sensing material, light source, and detector are disposed within or embedded within the light-tight cavity and the light tight cavity includes an optical transport layer including silicon nitride. The integrated PCB may be utilized as a magnetic field sensor, temper