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US-20260129759-A1 - ELECTRONIC COMPONENT MODULE

US20260129759A1US 20260129759 A1US20260129759 A1US 20260129759A1US-20260129759-A1

Abstract

An electronic component module includes: a rigid board; a plurality of electronic components mounted on the rigid board; and a bendable flexible substrate mounted on the rigid board. The flexible substrate is mounted on the rigid board, passing between the plurality of electronic components. The flexible substrate includes a wiring line for transmitting a signal, and a first ground layer. The first ground layer is electrically connected to a reference potential of the rigid board.

Inventors

  • Shun Imai

Assignees

  • MURATA MANUFACTURING CO., LTD.

Dates

Publication Date
20260507
Application Date
20251104
Priority Date
20241105

Claims (11)

  1. 1 . An electronic component module comprising: a rigid board; a plurality of electronic components mounted on the rigid board; and a flexible substrate that is bendable and mounted on the rigid board, wherein when viewing one main surface of the rigid board in plan, the flexible substrate is mounted on the rigid board, passing between the plurality of electronic components mounted on the rigid board, the flexible substrate includes a wiring line configured to transmit a signal, and a first ground layer, and the first ground layer is electrically connected to a reference potential of the rigid board.
  2. 2 . The electronic component module according to claim 1 , wherein the flexible substrate includes a connection portion connected to the main surface of the rigid board, and an erected portion erected from the main surface of the rigid board by being bent, and the flexible substrate in a bent state is mounted on the rigid board.
  3. 3 . The electronic component module according to claim 2 , wherein the flexible substrate includes two of the connection portions, and the two of the connection portions are connected to separate positions on the main surface of the rigid board.
  4. 4 . The electronic component module according to claim 1 , wherein the flexible substrate includes a base film, the wiring line is on one main surface side of the base film, and the first ground layer is on another main surface side of the base film.
  5. 5 . The electronic component module according to claim 1 , wherein the flexible substrate further includes a second ground layer, and the wiring line is between the first ground layer and the second ground layer.
  6. 6 . The electronic component module according to claim 2 , wherein a portion of the wiring line is in the connection portion, and a surface mount device is connected to the wiring line in the connection portion.
  7. 7 . The electronic component module according to claim 6 , wherein a recess is on the main surface of the rigid board, and the connection portion is in the recess.
  8. 8 . The electronic component module according to claim 2 , wherein the flexible substrate includes an electrode plate electrically connected to the first ground layer, the electrode plate is erected from the main surface of the rigid board, the rigid board and a portion of the flexible substrate other than an end portion of the electrode plate are sealed by an insulating member, and the end portion of the electrode plate is configured to have a reference potential applied thereto.
  9. 9 . The electronic component module according to claim 2 , wherein the flexible substrate includes a first electrode plate electrically connected to the wiring line, the electronic component module further comprises: a ground substrate which surrounds a periphery of the flexible substrate; and a connection substrate that covers the flexible substrate and the ground substrate, the ground substrate includes a second electrode plate, the first electrode plate and the second electrode plate are erected from the main surface of the rigid board, a portion of the flexible substrate other than an end portion of the first electrode plate, a portion of the ground substrate other than an end portion of the second electrode plate, and the rigid board are sealed by an insulating member, the connection substrate includes electrodes at positions corresponding to the end portion of the first electrode plate and the end portion of the second electrode plate, and the end portion of the first electrode plate and the end portion of the second electrode plate are connected to the electrodes at the positions corresponding thereto.
  10. 10 . The electronic component module according to claim 2 , wherein the flexible substrate includes a base film, the wiring line is on one main surface side of the base film, and the first ground layer is on another main surface side of the base film.
  11. 11 . The electronic component module according to claim 2 , wherein the flexible substrate further includes a second ground layer, and the wiring line is between the first ground layer and the second ground layer.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims benefit of priority to Japanese Patent Application No. 2024-193805, filed Nov. 5, 2024, the entire content of which is incorporated herein by reference. BACKGROUND Technical Field The present disclosure relates to an electronic component module. Background Art An electronic component module includes a substrate having a surface on which a wiring line is provided, and a plurality of electronic components mounted on the surface of the substrate. Further, an electronic component module disclosed in International Publication No. 2018/151134 includes a circuit board and an electrical element arranged so as to straddle electronic components mounted on the circuit board. SUMMARY The electronic component module disclosed in International Publication No. 2018/151134 has room for improvement with respect to the suppression of signal interference between the components mounted on the circuit board. In view of the above, the present disclosure provides an electronic component module capable of suppressing signal interference between the components mounted on a circuit board. An electronic component module according to the present disclosure includes a rigid board; a plurality of electronic components mounted on the rigid board; and a flexible substrate that is bendable and mounted on the rigid board. When viewing one main surface of the rigid board in plan, the flexible substrate is mounted on the rigid board, passing between the plurality of electronic components mounted on the rigid board. The flexible substrate includes a wiring line for transmitting a signal, and a first ground layer. The first ground layer is electrically connected to a reference potential of the rigid board. According to the present disclosure, signal interference between the components mounted on a circuit board can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view illustrating an electronic component module according to a first embodiment; FIG. 2 is a perspective view illustrating a configuration of a multilayer wiring board before a flexible substrate is mounted in FIG. 1; FIG. 3 is a view illustrating a configuration of the flexible substrate according to the first embodiment; FIG. 4 is an enlarged view illustrating a portion of the flexible substrate illustrated in FIG. 3; FIG. 5 is a view illustrating the flexible substrate in a state of being bent along bending lines; FIG. 6 is a view illustrating a cross-section of a portion of the flexible substrate illustrated in FIG. 5; FIG. 7 is a view for explaining the structure of a short portion of the flexible substrate illustrated in FIG. 5; FIG. 8 is a view for explaining the structure of the short portion of the flexible substrate illustrated in FIG. 5; FIG. 9 is a view illustrating a configuration of a main portion of a flexible substrate used in an electronic component module according to a second embodiment; FIG. 10 is a view illustrating a configuration of the main portion of the flexible substrate used in the electronic component module according to the second embodiment; FIG. 11 is a view illustrating a configuration of the main portion of the flexible substrate used in the electronic component module according to the second embodiment; FIG. 12 is a view illustrating a first example of a structure in which a surface mount device is mounted using the flexible substrate according to the second embodiment; FIG. 13 is a view illustrating a cross-section of a portion of the flexible substrate illustrated in FIG. 12; FIG. 14 is a view illustrating a second example of a structure in which a surface mount device is mounted using the flexible substrate according to the second embodiment; FIG. 15 is a view illustrating a cross-section of a portion of the flexible substrate illustrated in FIG. 14; FIG. 16 is a sectional view illustrating a configuration of a flexible substrate according to a modification of the second embodiment; FIG. 17 is a view illustrating a configuration of a main portion of a flexible substrate used in an electronic component module according to a third embodiment; FIG. 18 is a view illustrating the flexible substrate in a state of being bent along respective bending lines; FIG. 19 is a perspective view illustrating the electronic component module according to the third embodiment; FIG. 20 is a view illustrating a state in which the electronic component module is filled with a resin; FIG. 21 is a view illustrating a configuration of a main portion of a flexible substrate used in an electronic component module according to a fourth embodiment; FIG. 22 is a view illustrating the flexible substrate in a state of being bent along respective bending lines; FIG. 23 is a perspective view illustrating a configuration example of a ground substrate; FIG. 24 is a view illustrating a state in which the flexible substrate and the ground substrate are provided on the multilayer wiring board; FIG. 25