US-20260129768-A1 - FLIPPING DEVICE AND ELECTROPLATING PRODUCTION LINE

US20260129768A1US 20260129768 A1US20260129768 A1US 20260129768A1US-20260129768-A1

Abstract

Disclosed are a flipping device and an electroplating production line. The flipping device is applied to the electroplating production line. The electroplating production line includes two horizontal electroplating devices. The flipping device is provided between the two horizontal electroplating devices. The flipping device includes a frame, a feeding mechanism and a flipping mechanism provided on the frame. The feeding mechanism includes a first horizontal surface at one end close to the first horizontal electroplating device, and a second horizontal surface is provided at one end close to the second horizontal electroplating device. The first horizontal surface is configured to receive the circuit board from the first horizontal electroplating device after electroplating, and the feeding mechanism conveys the circuit board to the second horizontal surface. The flipping mechanism is configured to flip the circuit board on the feeding mechanism.

Inventors

Takwo CHAN

Assignees

UNIVERSAL CIRCUIT BOARD EQUIPMENT CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20250117
Priority Date: 20241104

Claims (10)

1 . A flipping device, applied to an electroplating production line, comprising: a frame; a feeding mechanism provided on the frame; and a flipping mechanism provided on the frame; wherein the electroplating production line comprises two horizontal electroplating devices, the horizontal electroplating device comprises an electroplating conveying mechanism and an electroplating tank, the electroplating conveying mechanism is configured to clamp a side of a circuit board and drive the circuit board to move in the electroplating tank for electroplating, the flipping device is provided between the two horizontal electroplating devices; the two horizontal electroplating devices comprises a first horizontal electroplating device and a second horizontal electroplating device, the feeding mechanism is provided with a first horizontal surface at one end close to the first horizontal electroplating device, and a second horizontal surface is provided at one end close to the second horizontal electroplating device; the first horizontal surface is configured to receive the circuit board from the first horizontal electroplating device after electroplating, the feeding mechanism conveys the circuit board to the second horizontal surface, enabling the circuit board to enter the second horizontal electroplating device horizontally from the second horizontal surface; and the flipping mechanism is configured to flip the circuit board on the feeding mechanism, enabling the electroplating conveying mechanisms of the two horizontal electroplating devices to clamp opposite sides of the circuit board respectively.
2 . The flipping device according to claim 1 , wherein the flipping mechanism comprises a driving component, a rotating shaft and a clamping component, the clamping component is provided on the rotating shaft, the rotating shaft is drivingly connected to the driving component, the clamping component is provided with a slot for inserting the circuit board, and the driving component is configured to drive the rotating shaft to rotate, enabling the clamping component to drive the circuit board to flip.
3 . The flipping device according to claim 2 , wherein the clamping component comprises a plurality of clamping blocks, the plurality of clamping blocks are provided at intervals along a length direction of the rotating shaft; each clamping block is provided with a groove, and a plurality of grooves are assembled together to form the slot.
4 . The flipping device according to claim 3 , wherein: the clamping component further comprises a plurality of first guide wheels, and the plurality of first guide wheels are provided at intervals on the rotating shaft and are provided at a bottom of the groove to slide against a side of the circuit board; and/or a plurality of the clamping blocks and a plurality of the first guide wheels are respectively provided on opposite sides of the rotating shaft.
5 . The flipping device according to claim 2 , wherein the driving component comprises a driving motor, a transmission belt and a transmission wheel, one end of the rotating shaft is connected to the transmission wheel, the transmission belt is sleeved on the transmission wheel and the driving motor, and the driving motor is configured to drive the transmission wheel to rotate through the transmission belt to drive the rotating shaft to rotate.
6 . The flipping device according to claim 1 , wherein the feeding mechanism comprises a first conveying line and a second conveying line provided at intervals, the first conveying line and the second conveying line are configured to transport the circuit board along a first direction, and the flipping mechanism is provided between the first conveying line and the second conveying line to flip a circuit board on the first conveying line to the second conveying line.
7 . The flipping device according to claim 6 , wherein the feeding mechanism further comprises a first pushing component and a second pushing component, the first pushing component is provided on the first conveying line to push the circuit board on the first conveying line to the flipping mechanism, and the second pushing component is provided on the second conveying line to push a circuit board on the second conveying line to move along the first direction.
8 . The flipping device according to claim 7 , wherein: the feeding mechanism further comprises a third conveying line and a fourth conveying line; the fourth conveying line is extended along a conveying direction of the first conveying line, the second pushing component is configured to push the circuit board on the second conveying line to the third conveying line, the third conveying line is provided along a second direction for transporting the circuit board on the second conveying line to the fourth conveying line, and the first direction forms an angle with the second direction; and/or the third conveying line is connected with the second conveying line and the fourth conveying line, and is raised and lowered along a third direction to lift the circuit board on the second conveying line or lower a circuit board on the third conveying line to the fourth conveying line.
9 . The flipping device according to claim 8 , wherein: the feeding mechanism further comprises a third pushing component and a fourth pushing component; the third pushing component is provided on the third conveying line to push the circuit board on the third conveying line to the fourth conveying line along the second direction, and the fourth pushing component is configured to push the circuit board on a fourth conveying line along the first direction and adjust a spacing between two adjacent circuit boards; and/or the feeding mechanism further comprises a positioning component, the positioning component is provided on the fourth conveying line, the third pushing component is configured to push the circuit board on the third conveying line to move along the second direction and abut against the positioning component.
10 . An electroplating production line, comprising: two horizontal electroplating devices; the flipping device according to claim 1 , wherein the flipping device is provided between the two horizontal electroplating devices.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to Chinese Patent Application No. 202411560904.X, filed on Nov. 4, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD The present application relates to the technical field of circuit board electroplating, and in particular to a flipping device and an electroplating production line. BACKGROUND In the related art, the effect of electroplating the printed circuit board (PCB) once is not very ideal, and secondary and tertiary electroplating are required. The primary and secondary electroplating will plate thinner, but the surface of the board is required to be plated very evenly, so the primary and secondary electroplating adopts a horizontal electroplating method. In order to achieve the best electroplating effect, the board will be flipped and the clamping point edge will be replaced. Because the current close to the clamping point edge is large and the plating will generally be thicker. The board is flipped because the chemical environment of the upper and lower board surfaces is different. After the existing flipping device is flipped, the positioning accuracy of the board is low, the turning step is slow and cumbersome, the efficiency is not high, and the quality of the circuit board electroplating is affected. SUMMARY The main purpose of the present application is to provide a flipping device and an electroplating production line, aiming to solve the problem that the electroplating quality of existing circuit boards is poor. To achieve the above purpose, the present application provides a flipping device, applied to an electroplating production line. In an embodiment, the flipping device includes a frame, a feeding mechanism provided on the frame, and a flipping mechanism provided on the frame. The electroplating production line includes two horizontal electroplating devices, the horizontal electroplating device includes an electroplating conveying mechanism and an electroplating tank, the electroplating conveying mechanism is configured to clamp a side of a circuit board and drive the circuit board to move in the electroplating tank for electroplating, the flipping device is provided between the two horizontal electroplating devices. In an embodiment, the two horizontal electroplating devices includes a first horizontal electroplating device and a second horizontal electroplating device, the feeding mechanism is provided with a first horizontal surface at one end close to the first horizontal electroplating device, and a second horizontal surface is provided at one end close to the second horizontal electroplating device. In an embodiment, the first horizontal surface is configured to receive the circuit board from the first horizontal electroplating device after electroplating, the feeding mechanism conveys the circuit board to the second horizontal surface, enabling the circuit board to enter the second horizontal electroplating device horizontally from the second horizontal surface. In an embodiment, the flipping mechanism is configured to flip the circuit board on the feeding mechanism, enabling the electroplating conveying mechanisms of the two horizontal electroplating devices to clamp opposite sides of the circuit board respectively. In an embodiment, the flipping mechanism includes a driving component, a rotating shaft and a clamping component, the clamping component is provided on the rotating shaft, the rotating shaft is drivingly connected to the driving component, the clamping component is provided with a slot for inserting the circuit board, and the driving component is configured to drive the rotating shaft to rotate, enabling the clamping component to drive the circuit board to flip. In an embodiment, the clamping component includes a plurality of clamping blocks, the plurality of clamping blocks are provided at intervals along a length direction of the rotating shaft; each clamping block is provided with a groove, and a plurality of grooves are assembled together to form the slot. In an embodiment, the clamping component further includes a plurality of first guide wheels, and the plurality of first guide wheels are provided at intervals on the rotating shaft and are provided at a bottom of the groove to slide against a side of the circuit board; and/or a plurality of the clamping blocks and a plurality of the first guide wheels are respectively provided on opposite sides of the rotating shaft. In an embodiment, the driving component includes a driving motor, a transmission belt and a transmission wheel, one end of the rotating shaft is connected to the transmission wheel, the transmission belt is sleeved on the transmission wheel and the driving motor, and the driving motor is configured to drive the transmission wheel to rotate through the transmission belt to drive the rotating shaft to rotate. In an embodiment, the feeding mechanism includes a first conveying line and a secon