US-20260129788-A1 - MOTHERBOARD STRUCTURE AND ELECTRONIC DEVICE

US20260129788A1US 20260129788 A1US20260129788 A1US 20260129788A1US-20260129788-A1

Abstract

The present invention discloses a motherboard structure and an electronic device. The motherboard structure includes a circuit substrate, a processor, at least one adapter, at least one external card, and a heat dissipation module. The processor is arranged at the circuit substrate. The adapter is arranged at the circuit substrate, and includes a slot facing the processor. The external card is inserted into the slot, and the external card and the circuit substrate collectively define an opening facing the processor. The heat dissipation module is arranged at the processor, and includes a notch facing the opening. The heat dissipation module is adapted to generate an airflow flowing to the opening through the notch.

Inventors

Yi-Kang CHEN

Assignees

ASROCK INDUSTRIAL COMPUTER CORPORATION

Dates

Publication Date: 20260507
Application Date: 20241107
Priority Date: 20240130

Claims (14)

1 . A motherboard structure, comprising: A motherboard structure, comprising; a processor, arranged at the circuit substrate; at least one adapter, arranged at the circuit substrate, and comprising a slot facing the processor; at least one external card, inserted into the slot, the at least one external card and the circuit substrate collectively defining an opening facing the processor; and a heat dissipation module, arranged at the processor, and comprising a notch facing the opening, wherein the heat dissipation module is adapted to generate an airflow flowing to the opening through the notch.
2 . The motherboard structure according to claim 1 , wherein the external card is located between the adapter and the heat dissipation module.
3 . The motherboard structure according to claim 1 , wherein the external card comprises an upper surface, a lower surface, and a plurality of memories, the memories are respectively configured on the upper surface and the lower surface, and each of the memories comprises a double data rate fifth generation synchronous dynamic random-access memory.
4 . The motherboard structure according to claim 1 , wherein a number of the adapter is two, and the adapters are arranged side by side on the circuit substrate.
5 . The motherboard structure according to claim 1 , wherein the heat dissipation module comprises a fan and a plurality of heat dissipation fins, and the heat dissipation fins are arranged on a periphery of the fan from two opposite sides of the notch.
6 . The motherboard structure according to claim 1 , wherein a width of the notch is less than a width of the opening.
7 . The motherboard structure according to claim 1 , further comprising: a heat dissipation film, arranged at the external card.
8 . An electronic device, comprising: a computer case; and a motherboard structure, arranged in the computer case, and comprising: a circuit substrate; a processor, arranged at the circuit substrate; a processor, arranged at the circuit substrate; at least one adapter, arranged at the circuit substrate, and comprising a slot facing the processor; at least one external card, inserted into the slot, the at least one external card and the circuit substrate collectively defining an opening facing the processor; and a heat dissipation module, arranged at the processor, and comprising a notch facing the opening, wherein the heat dissipation module is adapted to generate an airflow flowing to the opening through the notch.
9 . The electronic device according to claim 8 , wherein the external card is located between the adapter and the heat dissipation module.
10 . The electronic device according to claim 8 , wherein the external card comprises an upper surface, a lower surface, and a plurality of memories, the memories are respectively configured on the upper surface and the lower surface, and each of the memories comprises a double data rate fifth generation synchronous dynamic random-access memory.
11 . The electronic device according to claim 8 , wherein a number of the adapter is two, and the adapters are arranged side by side on the circuit substrate.
12 . The electronic device according to claim 8 , wherein the heat dissipation module comprises a fan and a plurality of heat dissipation fins, and the heat dissipation fins are arranged on a periphery of the fan from two opposite sides of the notch.
13 . The electronic device according to claim 8 , wherein a width of the notch is less than a width of the opening.
14 . The electronic device according to claim 8 , wherein the motherboard structure further comprises a heat dissipation film, and the heat dissipation film is arranged at the external card.

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application claims the priority benefit of Taiwan application serial no. 113201110, filed on Jan. 30, 2024. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification. BACKGROUND Technical Field The present invention relates to a motherboard and an electronic device, and in particular, to a motherboard structure having desirable heat dissipation efficiency and an electronic device having the motherboard structure. Description of Related Art An electronic device, for example, a computer, usually includes a computer case and a motherboard arranged in the computer case. The motherboard is provided with a considerable quantity of elements, for example, a processor, a memory card, a display card, a resistor, and a capacitor. Some elements generate a considerable amount of heat during operation. To quickly dissipate the generated heat to outside, a heat dissipation module is usually mounted to perform heat dissipation. For example, a heat dissipation module including a fan is mounted to a central processing unit (CPU) to perform heat dissipation. However, due to the limitation of the Intel platform design guide, the element arranged on the motherboard usually has a fixed arrangement direction, and the direction is not adjusted to mate with the heat dissipation module. Even if the heat dissipation module is mounted to assist in the heat dissipation, some elements still have the problem of overtemperature. SUMMARY An objective of the present invention is to provide a motherboard structure and an electronic device, so as to achieve desirable heat dissipation efficiency. To achieve the above objective, a motherboard structure according to the present invention includes a circuit substrate, a processor, at least one adapter, at least one external card, and a heat dissipation module. The processor is arranged at the circuit substrate. The adapter is arranged at the circuit substrate, and includes a slot facing the processor. The external card is inserted into the slot, and the external card and the circuit substrate collectively define an opening facing the processor. The heat dissipation module is arranged at the processor, and includes a notch facing the opening. The heat dissipation module is adapted to generate an airflow flowing to the opening through the notch. To achieve the above objective, an electronic device according to the present invention includes a computer case and a motherboard structure. The motherboard structure is arranged in the computer case, and includes a circuit substrate, a processor, at least one adapter, at least one external card, and a heat dissipation module. The processor is arranged at the circuit substrate. The adapter is arranged at the circuit substrate, and includes a slot facing the processor. The external card is inserted into the slot, and the external card and the circuit substrate collectively define an opening facing the processor. The heat dissipation module is arranged at the processor, and includes a notch facing the opening. The heat dissipation module is adapted to generate an airflow flowing to the opening through the notch. Carrying on with the above, in the motherboard structure and the electronic device of the present invention, the adapter is arranged at the circuit substrate, and includes the slot facing the processor. The external card is inserted into the slot, and the external card and the circuit substrate collectively define the opening facing the processor. The heat dissipation module is arranged at the processor, and includes the notch facing the opening. The heat dissipation module is adapted to generate the airflow flowing to the opening through the notch. Therefore, the above structural design causes the motherboard structure and the electronic device of the present invention to have desirable heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS The disclosure will become more fully understood from the detailed description and accompanying drawings, which are given for illustration only, and thus are not limitative of the present disclosure, and wherein: FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 2 and FIG. 3 are respectively a three-dimensional schematic diagram and a schematic top view of a motherboard structure of the electronic device in FIG. 1. FIG. 4 is a schematic cross-sectional view of the motherboard structure in FIG. 2. FIG. 5 is a schematic cross-sectional view of an existing motherboard structure. FIG. 6 is a schematic cross-sectional view of a motherboard structure according to another embodiment of the present invention. DETAILED DESCRIPTION A motherboard structure and an electronic device according to embodiments of the present invention are described below with reference to relevant figures. Same elements are described with same reference nu