US-20260129790-A1 - PIEZOELECTRIC HEAT DISSIPATION DEVICE AND HEAT DISSIPATION SYSTEM

US20260129790A1US 20260129790 A1US20260129790 A1US 20260129790A1US-20260129790-A1

Abstract

A piezoelectric heat dissipation device and a heat dissipation system are disclosed. The piezoelectric heat dissipation device includes a housing, a connection assembly, and a piezoelectric assembly. The piezoelectric heat dissipation device and the heat dissipation system of the present disclosure have a simple structure and are easy to miniaturize. The structural arrangement of the heat dissipation system helps improve the heat dissipation effect of the piezoelectric heat dissipation device. In addition, the piezoelectric heat dissipation device and the heat dissipation system of the present disclosure have a reasonable structural design, high heat dissipation efficiency, and low energy loss, and are suitable for heat dissipation of thin electronic products. Moreover, the piezoelectric heat dissipation device and the heat dissipation system of the present disclosure can prevent the formation of fatigue cracks in piezoelectric elements due to long-term use, thereby significantly extending the service life of the product. (To be published with FIG. 1 )

Inventors

Shuguang Zhang
Yan Qiu
Chaoqun Ke

Assignees

AUDIOWELL ELECTRONICS (GUANGDONG) CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20251029
Priority Date: 20241101

Claims (20)

1 . A piezoelectric heat dissipation device, comprising: a housing, a second connection assembly, and a piezoelectric assembly, wherein: the piezoelectric assembly is arranged in the housing and is connected to the housing through the second connection assembly, the piezoelectric assembly comprises a first piezoelectric element, a diaphragm, a support frame, and a jet plate connected in sequence along a first direction, the jet plate is provided with jet holes, and an energy conversion cavity in communication with the jet holes is defined by the diaphragm, the support frame, and the jet plate; and the housing comprises a housing body and an air exit plate, the housing body is provided with a first opening facing the jet plate in the first direction, the air exit plate is arranged to cover the first opening, the air exit plate is provided with air exit holes in communication with the jet holes, and the housing body is further provided with an air inlet in communication with the jet holes.
2 . The piezoelectric heat dissipation device of claim 1 , wherein: one side of the second connection assembly is connected to an edge of the jet plate, another side of the second connection assembly is connected to the air exit plate, the second connection assembly is provided with an intake passage, and the air inlet is in communication with the jet holes through the intake passage; and/or one side of the second connection assembly is connected to an outer peripheral wall of the piezoelectric assembly in the first direction, another side of the second connection assembly is connected to an inner peripheral wall of the housing body in the first direction, the second connection assembly is provided with an intake passage, and the air inlet is in communication with the jet holes through the intake passage.
3 . The piezoelectric heat dissipation device of claim 1 , wherein one side of the second connection assembly is connected to an edge of the diaphragm, and another side of the second connection assembly is connected to an inner wall of the housing body facing the diaphragm in the first direction.
4 . The piezoelectric heat dissipation device of claim 1 , wherein the second connection assembly comprises at least two elastic supporting members, the at least two elastic supporting members are connected to the piezoelectric assembly and the housing, and the at least two elastic supporting members are arranged at intervals along a circumferential direction of the piezoelectric assembly; and/or the piezoelectric heat dissipation device comprises a plurality of piezoelectric assemblies, the piezoelectric assembly is one of the plurality of piezoelectric assemblies, and the plurality of piezoelectric assemblies are arranged at intervals in a direction perpendicular to the first direction.
5 . A heat dissipation system, comprising one or more piezoelectric heat dissipation devices, each of the one or more piezoelectric heat dissipation devices being the piezoelectric heat dissipation device of claim 1 , wherein the one or more piezoelectric heat dissipation devices are arranged at intervals in a direction perpendicular to the first direction, outer peripheral walls of neighboring housing bodies are connected to each other, and the air inlet is provided on a side of the housing body facing away from the first opening in the first direction.
6 . The heat dissipation system of claim 5 , further comprising a heat generating element, wherein the air inlet is provided on the side of the housing body facing away from the first opening in the first direction, and the heat generating element is arranged spaced apart from a side of the piezoelectric heat dissipation device facing the air exit plate in the first direction; and/or further comprising a heat generating element, a heat-conducting plate, and a supporting member, wherein the heat-conducting plate comprises a hot end and a cold end opposite to the hot end in a second direction, the heat generating element is pressed against the hot end, the piezoelectric heat dissipation device is arranged spaced apart from the cold end in the first direction, one side of the supporting member is connected to the heat-conducting plate, another side of the supporting member is connected to an edge of the piezoelectric heat dissipation device, an outlet passage is defined by the air exit plate, the supporting member, and the heat-conducting plate, an air outlet is provided on one side of the supporting member adjacent to the cold end in the second direction, and the air outlet is in communication with the outlet passage; the air inlet is provided on the side of the housing body facing away from the first opening in the first direction, or on a side of the housing body facing away from the air outlet in the second direction; and the second direction is perpendicular to the first direction.
7 . A piezoelectric heat dissipation device, comprising: a piezoelectric assembly and an air exit plate, wherein the piezoelectric assembly comprises a piezoelectric element, a diaphragm, and a jet plate, wherein: the diaphragm has a first side surface and a second side surface opposite to the first side surface in a first direction, the piezoelectric element is attached to the first side surface, the jet plate protrudes away from the second side surface in the first direction, an energy conversion cavity is defined by the jet plate and the second side surface, the jet plate is provided with jet holes in communication with the energy conversion cavity, the air exit plate is arranged spaced apart from a side of the jet plate facing away from the energy conversion cavity in the first direction, an intake passage in communication with the jet holes is formed between the air exit plate and the jet plate, and the air exit plate is provided with air exit holes in communication with the jet holes.
8 . The piezoelectric heat dissipation device of claim 7 , wherein a curved structure protruding away from the second side surface along the first direction is formed in a middle portion of the jet plate, an annular structure extending outward is formed at an edge of the curved structure, the annular structure is connected to an edge of the second side surface, and the energy conversion cavity is defined by the curved structure and the second side surface; and/or the piezoelectric assembly further comprises a support frame, wherein an edge of the second side surface is connected to the jet plate through the support frame, and the energy conversion cavity is defined by the second side surface, the support frame, and the jet plate.
9 . The piezoelectric heat dissipation device of claim 7 , further comprising a housing, wherein a second opening is provided on one side of the housing in the first direction, the piezoelectric assembly is arranged in the housing, the air exit plate is arranged to cover the second opening, and the housing is further provided with an air inlet in communication with the intake passage.
10 . The piezoelectric heat dissipation device of claim 9 , further comprising an elastic assembly, wherein the piezoelectric assembly is connected to the housing through the elastic assembly; and the elastic assembly comprises an elastic cantilever, a fixed end of the elastic cantilever is connected to a peripheral wall of the housing which extends in the first direction, and a free end of the elastic cantilever is connected to a side wall of the piezoelectric assembly which extends in the first direction.
11 . The piezoelectric heat dissipation device of claim 10 , wherein the elastic assembly comprises at least four elastic cantilevers, the at least four elastic cantilevers are arranged at intervals along a circumferential direction of the energy conversion cavity, and a free end of each of the at least four elastic cantilevers is connected to an outer peripheral wall of the energy conversion cavity.
12 . The piezoelectric heat dissipation device of claim 9 , wherein the air inlet is provided on a side of the housing facing away from the second opening in the first direction, or the air inlet is provided on a peripheral wall of the housing which extends in the first direction; and the piezoelectric heat dissipation device further comprises a baffle plate, wherein the baffle plate is connected to a side of the air exit plate facing away from the jet plate in the first direction, part of the baffle plate is spaced apart from the air exit plate to form an outlet passage, an air outlet perpendicular to the first direction is further provided on the baffle plate, and the air outlet is in communication with the air exit holes through the outlet passage.
13 . The piezoelectric heat dissipation device of claim 7 , wherein the piezoelectric heat dissipation device comprises a piezoelectric element, a diaphragm, a support frame, a jet plate, and an air exit plate, wherein the support frame is provided with an energy conversion cavity which is open on two sides thereof in the first direction; and the diaphragm and the jet plate are respectively arranged to cover the two sides of the energy conversion cavity in the first direction and are connected to the support frame, the jet plate is provided with jet holes, the piezoelectric element comprises a first piezoelectric element and/or a second piezoelectric element, the first piezoelectric element is arranged on a side of the diaphragm facing away from the energy conversion cavity in the first direction, the second piezoelectric element is attached to a side of the jet plate facing away from the energy conversion cavity in the first direction, the piezoelectric element is provided with a central hole, the air exit plate is arranged spaced apart from the side of the jet plate facing away from the energy conversion cavity in the first direction, and the air exit plate is provided with air exit holes in communication with the jet holes.
14 . The piezoelectric heat dissipation device of claim 13 , wherein a projection of the piezoelectric element in the first direction is circular, and the central hole is a circular hole; and/or the piezoelectric element is attached to the side of the jet plate facing away from the energy conversion cavity in the first direction, and a projection of each of the jet holes in the first direction falls within the central hole.
15 . The piezoelectric heat dissipation device of claim 13 , wherein a spacing dimension between the diaphragm and the jet plate in the first direction is defined as H 1 wherein 0.02 mm≤H 1 0 ≤0. 5 mm; and/or a spacing dimension between the jet plate and the air exit plate in the first direction is defined as H 2 wherein 0.1 mm≤H 2 ≤2 mm.
16 . The piezoelectric heat dissipation device of claim 13 , wherein each of the jet holes is a circular hole, and a diameter of each of the jet holes ranges from 0.005 mm to 0.5 mm; and/or diameters of the air exit holes are larger than diameters of the jet holes, and in the first direction, any one of the air exit holes is arranged corresponding to at least one of the jet holes.
17 . The piezoelectric heat dissipation device of claim 13 , wherein an area of a projection of the jet plate in the first direction is defined as S 1 a total area of projections of the jet holes in the first direction is defined as S 2 and 0.1%≤S 2 /S 1 ≤10%; and/or wherein an area of a projection of the air exit plate in the first direction is defined as S 3 a total area of projections of the air exit holes in the first direction is defined as S 4 and 1%≤S 4 /S 3 ≤20%.
18 . The piezoelectric heat dissipation device of claim 13 , further comprising a first connection assembly, wherein the air exit plate is connected to an edge of the jet plate through the first connection assembly, or the air exit plate is connected to an edge of the diaphragm through the first connection assembly; and the first connection assembly is provided with an intake passage in communication with the jet holes.
19 . The piezoelectric heat dissipation device of claim 18 , further comprising a housing, wherein the housing is provided with a window on one side thereof in the first direction, the air exit plate is arranged to cover the window, the piezoelectric element, the diaphragm, the support frame, and the jet plate are arranged in the housing, and the housing is provided with an air inlet in communication with the intake passage.
20 . The piezoelectric heat dissipation device of claim 19 , wherein the air inlet is provided on a side of the housing facing away from the window in the first direction.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is based on and claims the benefit of priority from Chinese Patent Application No. 202510298856X filed on 13 March 2025, Chinese Patent Application No. 2024115514270 filed on 01 November 2024, and Chinese Patent Application No. 202511412904X filed on 29 September 2025. All these applications are incorporated by reference herein it their entireties. TECHNICAL FIELD The present disclosure relates to the technical field of piezoelectric devices, and in particular, to a piezoelectric heat dissipation device and a heat dissipation system. BACKGROUND As the running speed and computing power of electronic devices and integrated circuit chips continue to increase, heat generation is also increasing dramatically. To address the heat generated by the electronic devices, various heat dissipation mechanisms such as mechanical fans have been proposed. However, with the continuous trend toward miniaturization of electronic devices, conventional heat dissipation schemes using mechanical fans are no longer applicable. In recent years, piezoelectric cooling fans have gradually attracted attention as a novel heat dissipation technology. Piezoelectric cooling fans utilize the bending vibrations of piezoelectric materials to drive a fluid to flow, thereby achieving heat dissipation. However, piezoelectric cooling fans also face a series of challenges, such as the growing demand for heat dissipation and the need for product miniaturization and thinning. Moreover, existing piezoelectric fans still have room for improvement in the aspects such as structural design, heat dissipation efficiency, and reliability, and need to be further improved. In addition, existing piezoelectric cooling fan technologies also have some drawbacks. For example, over long-term operation, the piezoelectric material in piezoelectric cooling fans undergoes significant bending deformation, which can easily cause fatigue cracks, leading to product failure and shortening the service life of the product. SUMMARY The present disclosure aims to at least solve one of the technical problems in the related art. A first aspect of the present disclosure is to design a piezoelectric heat dissipation device and a heat dissipation system to achieve miniaturization and thinning. To achieve the above objective, the present disclosure provides a piezoelectric heat dissipation device, including: a housing, a second connection assembly, and a piezoelectric assembly, where: the piezoelectric assembly is arranged in the housing and is connected to the housing through the second connection assembly, the piezoelectric assembly includes a first piezoelectric element, a diaphragm, a support frame, and a jet plate connected in sequence along a first direction, the jet plate is provided with jet holes, and an energy conversion cavity in communication with the jet holes is defined by the diaphragm, the support frame, and the jet plate; and the housing includes a housing body and an air exit plate, the housing body is provided with a first opening facing the jet plate in the first direction, the air exit plate is arranged to cover the first opening, the air exit plate is provided with air exit holes in communication with the jet holes, and the housing body is further provided with an air inlet in communication with the jet holes. Compared with the existing technology, the piezoelectric heat dissipation device and the heat dissipation system according to the embodiments of the first aspect of the present disclosure have the following advantages. The piezoelectric heat dissipation device and the heat dissipation system according to the embodiments of the present disclosure have a simple structure. The piezoelectric assembly serves as a basic driving unit, and includes the first piezoelectric element, the diaphragm, the support frame, and the jet plate. The piezoelectric heat dissipation device and the heat dissipation system do not have the movable blade structure of a conventional fan, and therefore are easy to miniaturize and can be used in a thinner electronic product. In addition, in the present disclosure, the jet holes are in communication with the air exit holes, and the air inlet is in communication with the air exit holes, thus forming good air inlet and air outlet paths, to ensure the heat dissipation effect of the heat dissipation device and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic structural sectional view of a piezoelectric heat dissipation device according to a first embodiment of a first aspect of the present disclosure; FIG. 2 is a schematic structural sectional view of the piezoelectric heat dissipation device according to the first embodiment of the first aspect of the present disclosure, in which a diaphragm is deformed downward; FIG. 3 is a schematic structural sectional view of the piezoelectric heat dissipation device according to the first embodiment of t