US-20260129794-A1 - LIQUID-COOLED POWER SUPPLY CHASSIS AND LIQUID-COOLED POWER SUPPLY CABINET USING THE SAME

US20260129794A1US 20260129794 A1US20260129794 A1US 20260129794A1US-20260129794-A1

Abstract

A liquid-cooled power supply chassis includes at least one power supply unit, at least one cold plate, a coolant input/output unit and a busbar. The cold plate is in thermal contact with the power supply unit to absorb a heat energy. Each cold plate has a coolant input port and a coolant output port. The coolant input/output unit includes a first conduit, a second conduit and a heat dissipation pipe. The first conduit connects the coolant input port and the heat dissipation pipe, and the second conduit connects the coolant output port and the heat dissipation pipe. The busbar includes a first copper busbar and a second copper busbar that are oppositely arranged, and the first copper busbar and the second copper busbar are electrically insulated from each other. The heat dissipation pipe is in thermal contact with the first and second copper busbar.

Inventors

Shu-Wei Chu
Chen-Chih LEE
WEI-HAO LIANG

Assignees

LITE-ON TECHNOLOGY CORPORATION

Dates

Publication Date: 20260507
Application Date: 20250407
Priority Date: 20250218

Claims (20)

1 . A liquid-cooled power supply chassis, comprising: at least a power supply unit; at least a cold plate, wherein the cold plate is in thermal contact with the power supply unit to absorb heat energy, the cold plate has a coolant input port and a coolant output port; a coolant input/output unit, comprising a first conduit, a second conduit and a heat dissipation manifold plate, wherein the first conduit connects the coolant input port and the heat dissipation manifold plate, and the second conduit connects the coolant output port and the heat dissipation manifold plate; and a power busbar, comprising a first copper busbar and a second copper busbar, wherein the first copper busbar and the second copper busbar are electrically insulated from each other, wherein the heat dissipation manifold plate is in thermal contact with the first copper busbar and the second copper busbar.
2 . The liquid-cooled power supply chassis of claim 1 , wherein the heat dissipation manifold plate is disposed between the first copper busbar and the second copper busbar, the heat dissipation manifold plate includes a first surface and a second surface, the first copper busbar is in thermal contact with the first surface, and the second copper busbar is in thermal contact with the second surface.
3 . The liquid-cooled power supply chassis of claim 2 , further comprising a first thermal pad and a second thermal pad, wherein the first thermal pad is disposed on the first surface and the second thermal pad is disposed on the second surface.
4 . The liquid-cooled power supply chassis of claim 1 , wherein the second copper busbar is disposed between the first copper busbar and the heat dissipation manifold plate, the second copper busbar includes a first surface and a second surface, the first copper busbar is in thermal contact with the first surface, and the heat dissipation manifold plate is in thermal contact with the second surface.
5 . The liquid-cooled power supply chassis of claim 4 further comprises a first thermal pad and a second thermal pad, wherein the first thermal pad is disposed on the first surface and the second thermal pad is disposed on the second surface.
6 . The liquid-cooled power supply chassis of claim 1 , wherein the heat dissipation manifold plate comprises a first heat dissipation manifold plate and a second heat dissipation manifold plate, the first heat dissipation manifold plate is disposed between the first copper busbar and the second copper busbar, the second copper busbar is disposed between the first heat dissipation manifold plate and the second heat dissipation manifold plate, the first heat dissipation manifold plate includes a first surface and a second surface, the first copper busbar is in thermal contact with the first surface, and the second copper busbar is in thermal contact with the second surface, and the second heat dissipation manifold plate includes a third surface, and the second copper busbar is in thermal contact with the third surface.
7 . The liquid-cooled power supply chassis of claim 6 , further comprising a first thermal pad, a second thermal pad and a third thermal pad, wherein the first thermal pad is disposed on the first surface, the second thermal pad is disposed on the second surface, and the third thermal pad is disposed on the third surface.
8 . The liquid-cooled power supply chassis of claim 1 , further comprising a circuit board, the circuit board is electrically connected to the power supply unit, wherein at least one of the first copper busbar and the second copper busbar comprises at least a copper pillar, the copper pillar passes through the heat dissipation manifold plate and is connected to the circuit board.
9 . The liquid-cooled power supply chassis of claim 1 , further comprising a power connector having a positive electrode and a negative electrode, wherein the first copper busbar and the second copper busbar are respectively connected to the positive electrode and the negative electrode.
10 . A liquid-cooled power supply cabinet, comprising: at least a liquid-cooled power supply chassis including at least a power supply unit; a coolant input/output unit, comprising a first connection port, a second connection port, a heat dissipation manifold plate, a coolant input manifold, and a coolant output manifold, wherein the heat dissipation manifold plate is located in the liquid-cooled power supply chassis, the first connection port connects the heat dissipation manifold plate and the coolant input manifold, and the second connection port connects the heat dissipation manifold plate and the coolant output manifold; and a power busbar, comprising a first copper busbar and a second copper busbar, wherein the first copper busbar and the second copper busbar are electrically insulated from each other, wherein the heat dissipation manifold plate is in thermal contact with the first copper busbar and the second copper busbar.
11 . The liquid-cooled power supply cabinet of claim 10 , wherein the liquid-cooled power supply cabinet further comprises at least a cold plate, the cold plate is in thermal contact with the power supply unit to absorb heat energy and has a coolant input port and a coolant output port, and the coolant input port and the coolant output port are respectively connected to the heat dissipation manifold plate.
12 . The liquid-cooled power supply cabinet of claim 11 , wherein the coolant input/output unit further comprises a first conduit and a second conduit, the first conduit connects the coolant input port and the heat dissipation manifold plate, and the second conduit connects the coolant output port and the heat dissipation manifold plate.
13 . The liquid-cooled power supply cabinet of claim 10 , wherein the heat dissipation manifold plate is disposed between the first copper busbar and the second copper busbar, the heat dissipation manifold plate includes a first surface and a second surface, the first copper busbar is in thermal contact with the first surface, and the second copper busbar is in thermal contact with the second surface.
14 . The liquid-cooled power supply cabinet of claim 13 , further comprising a first thermal pad and a second thermal pad, wherein the first thermal pad is disposed on the first surface and the second thermal pad is disposed on the second surface.
15 . The liquid-cooled power supply cabinet of claim 10 , wherein the second copper busbar is disposed between the first copper busbar and the heat dissipation manifold plate, the second copper busbar includes a first surface and a second surface, the first copper busbar is in thermal contact with the first surface, and the heat dissipation manifold plate is in thermal contact with the second surface.
16 . The liquid-cooled power supply cabinet of claim 15 , further comprising a first thermal pad and a second thermal pad, wherein the first thermal pad is disposed on the first surface and the second thermal pad is disposed on the second surface.
17 . The liquid-cooled power supply cabinet of claim 10 , wherein the heat dissipation manifold plate comprises a first heat dissipation manifold plate and a second heat dissipation manifold plate, the first heat dissipation manifold plate is disposed between the first copper busbar and the second copper busbar, the second copper busbar is disposed between the first heat dissipation manifold plate and the second heat dissipation manifold plate, the first heat dissipation manifold plate includes a first surface and a second surface, the first copper busbar is in thermal contact with the first surface, and the second copper busbar is in thermal contact with the second surface, the second heat dissipation manifold plate includes a third surface, and the second copper busbar is in thermal contact with the third surface.
18 . The liquid-cooled power supply cabinet of claim 17 , further comprising a first thermal pad, a second thermal pad and a third thermal pad, wherein the first thermal pad is disposed on the first surface, the second thermal pad is disposed on the second surface, and the third thermal pad is disposed on the third surface.
19 . The liquid-cooled power supply cabinet of claim 10 , wherein at least one of the first copper busbar and the second copper busbar comprises at least one copper pillar, the copper pillar passes through the heat dissipation manifold plate.
20 . The liquid-cooled power supply cabinet of claim 10 , further comprises a power connector having a positive electrode and a negative electrode, wherein the first copper busbar and the second copper busbar are respectively connected to the positive electrode and the negative electrode.

Description

This application claims the benefits of U.S. provisional application Ser. No. 63/716,784, filed Nov. 6, 2024 and Taiwan application Serial No. 114105906, filed Feb. 18, 2025, the subject matters of which are incorporated herein by reference. BACKGROUND OF THE INVENTION Field of the Invention The invention relates in general to a liquid cooling system, and more particularly to a liquid-cooled power supply chassis and a liquid-cooled power supply cabinet using the same. Description of the Related Art Traditional liquid cooling architecture requires adding a cold plate or thermal copper plate for active heat dissipation in the cabinet. The heat energy is transferred to the coolant through the cold plate or thermal copper plate, and then the heat energy is taken away by the coolant. If the heat energy is not conducted to the outside of the cabinet by means of the cold plate or the thermal copper plate, the internal temperature of the cabinet will be too high and may cause damage to the components. In addition, the copper busbar with high current load will also generate heat, causing the internal temperature of the cabinet to be too high. SUMMARY OF THE INVENTION The present invention relates to a liquid-cooled power supply chassis and a liquid-cooled power supply cabinet using the same, wherein the waste heat can be conducted to the outside of the chassis through the coolant to achieve rapid cooling. According to one aspect of the present invention, a liquid-cooled power supply chassis is provided. The liquid-cooled power supply chassis includes at least a power supply unit, at least a cold plate, a coolant input/output unit, and a power bus. The cold plate is in thermal contact with the power supply unit to absorb heat energy. Each cold plate has a coolant input port and a coolant output port. The coolant input/output unit includes a first conduit, a second conduit and a heat dissipation manifold plate. The first conduit is connected to the coolant input port and the heat dissipation manifold plate, and the second conduit is connected to the coolant output port and the heat dissipation manifold plate. The power busbar includes a first copper busbar and a second copper busbar which are arranged opposite to each other, and the first copper busbar and the second copper busbar are electrically insulated from each other. The heat dissipation manifold plate is in thermal contact with the first copper busbar and the second copper busbar. According to one aspect of the present invention, a liquid-cooled power supply cabinet is provided, including at least a liquid-cooled power supply chassis, a coolant input/output unit, and a power busbar. The liquid-cooled power supply chassis includes at least a power supply unit. The coolant input/output unit includes a first connection port, a second connection port, a heat dissipation manifold plate, a coolant input manifold and a coolant output manifold. The heat dissipation manifold plate is located in the liquid-cooled power supply chassis, the first connection port connects the heat dissipation manifold plate and the coolant input manifold, the second connection port connects the heat dissipation manifold plate and the coolant output manifold, and the power busbar includes a first copper busbar and a second copper busbar that are arranged opposite to each other, and the first copper busbar and the second copper busbar are electrically insulated from each other. The heat dissipation manifold plate is in thermal contact with the first copper busbar and the second copper busbar. The above and other aspects of the invention will become better understood with regard to the following detailed description of the preferred but non-limiting embodiment(s). The following description is made with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a liquid-cooled power supply chassis according to an embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of the copper busbar in FIG. 1. FIGS. 3A and 3B are schematic diagrams showing the appearance and the exploded view of the coolant input/output unit in FIG. 1. FIG. 4 is a schematic diagram illustrating the coolant conduction of a liquid-cooled power supply cabinet according to an embodiment of the present invention. FIG. 5 is a schematic diagram of a liquid-cooled power supply chassis according to another embodiment of the present invention. FIG. 6A is a three-dimension schematic diagram of the coolant input/output unit in FIG. 5. FIG. 6B is a schematic cross-sectional view of the coolant input/output unit along line A-A in FIG. 6A. FIG. 7 is a schematic diagram showing the coolant conduction of a liquid-cooled power supply cabinet according to another embodiment of the present invention. FIG. 8 is a schematic diagram of a liquid-cooled power supply chassis according to another embodiment of the present invention. FIGS. 9A and 9B are schematic diagrams