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US-20260129799-A1 - THERMAL INTERFACE MATERIAL SYSTEMS, ASSEMBLIES FORMED THEREFROM, AND METHODS OF MANUFACTURE THEREOF

US20260129799A1US 20260129799 A1US20260129799 A1US 20260129799A1US-20260129799-A1

Abstract

Thermal interface materials systems, assemblies formed therefrom, and methods of manufacture thereof are provided. A system includes a thermal interface material (TIM) layer and a first adhesive layer disposed over the TIM layer. The TIM layer includes a first polymer component and liquid metal droplets dispersed through the first polymer component. The TIM layer exhibits a storage modulus of 10 4 Pa to 10 7 Pa.

Inventors

  • Hing Jii Mea
  • Dylan S. Shah
  • Keyton D. Feller
  • Benjamin Dorau
  • Cara Rossetti
  • Peter Carter
  • Loren RUSSELL
  • Navid Kazem
  • Vivek Singh

Assignees

  • ARIECA INC.

Dates

Publication Date
20260507
Application Date
20251103

Claims (20)

  1. 1 . A system comprising: a thermal interface material (TIM) layer comprising a first polymer component, and liquid metal droplets dispersed through the first polymer component, wherein the TIM layer exhibits a storage modulus of 10 4 Pa to 10 7 Pa; and a first adhesive layer disposed over the TIM layer.
  2. 2 . The system of claim 1 , wherein the liquid metal droplets comprise an aspect ratio of at least 1.1.
  3. 3 . The system of claim 2 , wherein a width of the liquid metal droplets are substantially aligned with a longitudinal plane of the TIM layer.
  4. 4 . The system of claim 2 , wherein a width of the liquid metal droplets are offset from a longitudinal plane of the TIM layer.
  5. 5 . The system of claim 1 , wherein the first adhesive layer exhibits an adhesive strength that is at least 5% greater than an adhesive strength of the TIM layer without the first adhesive layer.
  6. 6 . The system of claim 1 , wherein the first adhesive layer exhibits an adhesive strength in a range of 10 3 to 10 8 Pa.
  7. 7 . The system of claim 1 , wherein the first adhesive layer exhibits an adhesive strength in a range of 10 5 to 10 8 Pa.
  8. 8 . The system of claim 1 , wherein the first adhesive layer comprises a partially uncured polymer component with a storage modulus in a range of 10 1 to 10 5 Pa.
  9. 9 . The system of claim 8 , wherein the partially uncured polymer component comprises at least one of an acrylic polymer, an acrylate polymer, a vinyl polymer, a polyester polymer, a polyurethane polymer, a polybutadiene polymer, a polyamide polymer, a polyether polymer, a polysiloxane polymer, a silicon hydride polymer, a fluoropolymer, a polyisoprene polymer, and a copolymer of any two or more thereof.
  10. 10 . The system of claim 8 , wherein the partially uncured polymer component and the first polymer component comprise the same polymer.
  11. 11 . The system of claim 8 , wherein the partially uncured polymer component and the first polymer component comprise different polymers.
  12. 12 . The system of claim 1 , wherein the first adhesive layer is capable to be cured by heating, moisture, drying, oxidation, pressure, catalyst, or a combination thereof.
  13. 13 . The system of claim 1 , further comprising: a second adhesive layer, wherein the TIM layer is positioned intermediate the first adhesive layer and the second adhesive layer.
  14. 14 . The system of claim 1 , further comprising a first temporary substrate disposed in contact with the first adhesive layer.
  15. 15 . The system of claim 1 , further comprising: a second adhesive layer, wherein the TIM layer is positioned intermediate the first adhesive layer and the second adhesive layer; a first temporary substrate disposed in contact with the first adhesive layer; and a second temporary substrate disposed in contact with the second adhesive layer.
  16. 16 . The system of claim 1 , wherein the system comprises a thickness in a range of 50 microns to 2000 microns.
  17. 17 . The system of claim 1 , wherein the first adhesive layer comprises a thickness in a range of 5 microns to 50 microns.
  18. 18 . The system of claim 1 , wherein the TIM layer comprises a thickness in a range of 20 microns to 1990 microns.
  19. 19 . The system of claim 1 , wherein the liquid metal droplets comprise at least one of gallium, a gallium alloy, indium, an indium alloy, tin, a tin alloy, mercury, and a mercury alloy.
  20. 20 . The system of claim 1 , wherein the first polymer component comprises at least one of an acrylic polymer, an acrylate polymer, a vinyl polymer, a polyester polymer, a polyurethane polymer, a polybutadiene polymer, a polyamide polymer, a polyether polymer, a polysiloxane polymer, a silicon hydride polymer, a fluoropolymer, a polyisoprene polymer, and a copolymer of any two or more thereof.

Description

CROSS-REFERENCE The present application claims priority to U.S. Provisional Application No. 63/715,829, filed Nov. 4, 2024. The entire contents of which is hereby incorporated by reference into this specification. GOVERNMENT SUPPORT This Invention was made with U.S. Government support pursuant to a grant by Air Force Research Laboratory under agreement number FA8650-18-2-5402. The U.S. Government has certain rights in the Invention. FIELD The present disclosure relates to thermal interface materials systems, assemblies formed therefrom, and methods of manufacture thereof. BACKGROUND A thermal interface material (TIM) can be used to thermally connect two or more layers together. For example, TIMs are often used in CPU packages to thermally connect the integrated heat spreader (HS) of a CPU package to a heat sink. There are various types of TIMs that can be used. However, current TIMs present challenges. SUMMARY Various aspects of the present disclosure are directed to a system comprising a thermal interface material (TIM) layer and a first adhesive layer disposed over the TIM layer. The TIM layer comprises a first polymer component and liquid metal droplets dispersed through the first polymer component. The TIM layer exhibits a storage modulus of 104 Pa to 107 Pa. In various examples, the liquid metal droplets comprise an aspect ratio of at least 1.1. In certain examples, a width of the liquid metal droplets are substantially aligned with a longitudinal plane of the TIM layer and/or a width of the liquid metal droplets are offset from a longitudinal plane of the TIM layer. In various examples, the first adhesive layer exhibits an adhesive strength in a range of 103 to 108 Pa or 101 to 108 Pa. In various examples, the TIM layer further comprises at least one of a catalyst, rigid particles, deformable particles, a coupling agent, fumed silica, a conductive agent, an additive, and a surfactant. In certain examples, the TIM layer has an ultimate tensile strain of at least 30%. In various examples, the system can further comprise a second adhesive layer, a first temporary substrate, and/or a second temporary substrate. Additional various aspects of the present disclosure are directed to an assembly comprising a first component layer, a second component layer and a system compressed and disposed in contact with and between the first component layer and the second component layer. The system comprises a TIM layer and a first adhesive layer disposed over the TIM layer. The TIM layer comprises a first polymer component and liquid metal droplets dispersed through the first polymer component. The TIM layer exhibits a storage modulus of 104 Pa to 107 Pa. In various examples, the first component layer and the second component layer, individually, comprise at least one of a battery, a processor, a heat sink, an integrated heat spreader, a heat pipe, a case, a fan, a liquid cooler, a relay, a SiC power module, a GaN power module, a memory chip, an integrated circuit, an antenna and packaging. In certain examples, the first component layer, the second component layer, or a combination thereof, comprise a pretreated surface in contact with the system. Additional certain aspects of the present disclosure are directed to a method of manufacturing an assembly. The method comprises applying a system in contact with and between a first component layer of and a second component layer. The method comprises compressing the system. The system comprises a TIM layer and a first adhesive layer disposed over the TIM layer. The TIM layer comprises a first polymer component and liquid metal droplets dispersed through the first polymer component. The TIM layer exhibits a storage modulus of 104 Pa to 107 Pa. Additional various aspects of the present disclosure are directed to a method comprising applying a TIM composition to a temporary substrate at a first thickness, thereby forming a TIM layer. The TIM composition comprising a first polymer component and liquid metal droplets dispersed through the first polymer component and having a first aspect ratio. The method comprises applying a force to the TIM composition to deform the liquid metal droplets such that the liquid metal droplets have a second aspect ratio. The second aspect ratio is greater than the first aspect ratio. The method comprises curing the first polymer component, thereby forming a TIM layer having the first polymer component that is cured and the liquid metal droplets having the second aspect ratio. In various examples, the method can comprise removing the temporary substrate. In certain examples, applying a force to the TIM layer comprises applying a shear force to the TIM layer, and/or applying a normal force to the TIM layer to reduce the first thickness to a second thickness. In various examples, curing the first polymer component occurs during applying a force to the TIM layer, after applying a force to the TIM layer, or a combination thereof. In various examples, app