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US-20260129800-A1 - HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

US20260129800A1US 20260129800 A1US20260129800 A1US 20260129800A1US-20260129800-A1

Abstract

An electronic device is provided. The electronic device includes a housing including a plurality of first fins, a plurality of second fins, a vapor chamber including a first cover, a second cover, and a plurality of pillars, an electronic component, and a printed circuit board (PCB), wherein the housing includes at least one heatsink portion forming an opening region, wherein the vapor chamber is disposed such that at least a portion of a first side of the first cover of the vapor chamber is exposed through the opening region, wherein the plurality of second fins are disposed on the exposed at least a portion of the first side of the first cover, wherein the electronic component is disposed on a side of the printed circuit board, and wherein the electronic component is disposed in a space between the first side of the second cover facing the side of the printed circuit board and the side of the printed circuit board.

Inventors

  • Sangsoo YU
  • Guangxin ZHAO

Assignees

  • SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date
20260507
Application Date
20251229
Priority Date
20230630

Claims (20)

  1. 1 . An electronic device comprising: a housing including a plurality of first fins; a plurality of second fins; a vapor chamber including a first cover, a second cover, and a plurality of pillars; an electronic component; and a printed circuit board (PCB), wherein the housing includes at least one heatsink portion forming an opening region, wherein the vapor chamber is disposed such that at least a portion of a first side of the first cover of the vapor chamber is exposed through the opening region, wherein the plurality of second fins are disposed on the exposed at least the portion of the first side of the first cover, wherein the electronic component is disposed on a side of the printed circuit board, and wherein the electronic component is disposed in a space between a first side of the second cover facing the side of the printed circuit board and the side of the printed circuit board.
  2. 2 . The electronic device of claim 1 , wherein a thickness of a second fin among the plurality of second fins is thinner than a thickness of a first fin among the plurality of first fins.
  3. 3 . The electronic device of claim 1 , wherein the plurality of pillars are disposed between the first cover and the second cover, and wherein a fluid is disposed in a space between the first cover, the second cover, and the plurality of pillars.
  4. 4 . The electronic device of claim 1 , wherein the vapor chamber comprises: a first wick structure coupled to a second side of the first cover opposite to the first side of the first cover; and a second wick structure coupled to a second side of the second cover opposite to the first side of the second cover.
  5. 5 . The electronic device of claim 4 , wherein the first wick structure includes a plurality of first holes for the plurality of pillars, and wherein the second wick structure includes a plurality of second holes for the plurality of pillars.
  6. 6 . The electronic device of claim 4 , further comprising: an upper cover coupled to the second side of the first cover opposite to the first side of the first cover, wherein the plurality of pillars are disposed between the upper cover and the second cover, wherein the first cover is formed of a first metallic material, and wherein the upper cover is formed of a second metallic material different from the first metallic material.
  7. 7 . The electronic device of claim 6 , wherein the first metallic material comprises aluminum, and wherein the second metallic material comprises copper.
  8. 8 . The electronic device of claim 1 , wherein the first cover comprises a first clad metal formed of a first metallic material and a second metallic material, and wherein the second cover comprises a second clad metal formed of the first metallic material and the second metallic material.
  9. 9 . The electronic device of claim 8 , wherein the first metallic material comprises aluminum, and wherein the second metallic material comprises copper.
  10. 10 . The electronic device of claim 8 , wherein the first side of the first cover comprises the first metallic material of the first clad metal, wherein the first side of the second cover comprises the first metallic material of the second clad metal, wherein a second side of the first cover opposite to the first side comprises the second metallic material of the first clad metal, and wherein a second side of the second cover opposite to the first side comprises the second metallic material of the second clad metal.
  11. 11 . The electronic device of claim 1 , further comprising: at least one electronic component disposed on the side of the printed circuit board, wherein the at least one electronic component is disposed to contact the housing, wherein a temperature margin for the at least one electronic component is higher than a temperature margin for the electronic component, wherein the electronic component includes at least one of at least one processor, a central processing unit (CPU), or a field programmable gate array (FPGA), and wherein the at least one electronic component includes a component having a power amplifier.
  12. 12 . The electronic device of claim 1 , further comprising: a gasket, wherein a region of the first side of the first cover that is different from the exposed at least the portion of the first side of the first cover, is coupled to the housing through the gasket.
  13. 13 . The electronic device of claim 1 , wherein the plurality of first fins are disposed on a side of the at least one heatsink portion, wherein the plurality of first fins and the plurality of second fins protrude in a direction in which the first side of the first cover faces, wherein each first fin of the plurality of first fins has a plate shape, wherein each second fin of the plurality of second fins has a plate shape, wherein the first cover of the vapor chamber includes a coating layer, and wherein the coating layer includes the exposed at least the portion of the first side of the first cover.
  14. 14 . An electronic device comprising: a housing including a plurality of first fins; a plurality of modules; and a printed circuit board (PCB), wherein each module among the plurality of modules comprises: a plurality of second fins, a vapor chamber including a first cover, a second cover, and a plurality of pillars, and an electronic component, wherein the housing includes at least one heatsink portion forming an opening region, wherein the vapor chamber is disposed such that at least a portion of a first side of the first cover of the vapor chamber is exposed through the opening region, wherein the plurality of second fins are disposed on the exposed at least the portion of the first side of the first cover, wherein the electronic component is disposed on a side of the printed circuit board, and wherein the electronic component is disposed in a space between a first side of the second cover facing the side of the printed circuit board and the side of the printed circuit board.
  15. 15 . The electronic device of claim 14 , wherein a thickness of a second fin among the plurality of second fins is thinner than a thickness of a first fin among the plurality of first fins.
  16. 16 . The electronic device of claim 14 , wherein the plurality of pillars are disposed between the first cover and the second cover, and wherein a fluid is disposed in a space between the first cover, the second cover, and the plurality of pillars.
  17. 17 . The electronic device of claim 14 , wherein the vapor chamber comprises: a first wick structure coupled to a second side of the first cover opposite to the first side of the first cover; and a second wick structure coupled to a second side of the second cover opposite to the first side of the second cover.
  18. 18 . The electronic device of claim 14 , wherein a thermal interface material (TIM) is disposed between the first side of the second cover facing the side of the printed circuit board and the electronic component.
  19. 19 . The electronic device of claim 18 , wherein the TIM comprises a metal and a ceramic particle having a thermal conductivity characteristic based on a polymer material.
  20. 20 . A vapor chamber comprising: a first metal structure; a second metal structure coupled to the first metal structure and forming a space for a fluid between the first metal structure and the second metal structure; and a plurality of pillars disposed in the space, wherein the first metal structure is formed based on a clad in which a first metallic material and a second metallic material are combined, wherein the second metal structure is formed based on a clad in which the first metallic material and the second metallic material are combined, wherein the first metal structure is disposed such that the first metallic material is located at a first side of the first metal structure and the second metallic material is located at a second side of the first metal structure opposite to the first side, wherein the second metal structure is disposed such that the first metallic material is located at a first side of the second metal structure and the second metallic material is located at a second side of the second metal structure opposite to the first side, wherein at least a portion of the second side of the first metal structure is coupled to at least a portion of the second side of the second metal structure, wherein the first metallic material comprises aluminum, and wherein the second metallic material comprises copper.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) This application is a continuation application, claiming priority under 35 U.S.C. § 365 (c), of an International application No. PCT/KR2024/006039, filed on May 3, 2024, which is based on and claims the benefit of a Korean patent application number 10-2023-0087102, filed on Jul. 5, 2023, in the Korean Intellectual Property Office, and of a Chinese patent application number 202310800766.7, filed on Jun. 30, 2023, in the Chinese Intellectual Property Office, the disclosure of each of which is incorporated by reference herein in its entirety. BACKGROUND 1. Field The disclosure relates to a heat dissipation structure and an electronic device including the same. 2. Description of Related Art An electronic device may include various electronic components to perform communication. The electronic components in the electronic device may generate heat. For example, heat generated from an electronic component may degrade performance of the electronic component and another electronic component. In order to disperse the heat generated from the electronic component, the electronic device may include a heat dissipation structure. The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure. SUMMARY Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide a heat dissipation structure and an electronic device including the same. Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments. In accordance with an aspect of the disclosure, an electronic device is provided. The electronic device includes a housing including a plurality of first fins, a plurality of second fins, a vapor chamber including a first cover, a second cover, and a plurality of pillars, an electronic component, and a printed circuit board (PCB), wherein the housing includes at least one heatsink portion forming an opening region, wherein the vapor chamber is disposed such that at least a portion of a first side of the first cover of the vapor chamber is exposed through the opening region, wherein the plurality of second fins are disposed on the exposed at least the portion of the first side of the first cover, wherein the electronic component is disposed on a side of the printed circuit board, and wherein the electronic component is disposed in a space between a first side of the second cover facing the side of the printed circuit board and the side of the printed circuit board. In accordance with another aspect of the disclosure, an electronic device is provided. The electronic device includes a housing including a plurality of first fins, a plurality of modules, and a printed circuit board (PCB), wherein each module among the plurality of modules includes a plurality of second fins, a vapor chamber including a first cover, a second cover, and a plurality of pillars, and an electronic component, wherein the housing includes at least one heatsink portion forming an opening region, wherein the vapor chamber is disposed such that at least a portion of a first side of the first cover of the vapor chamber is exposed through the opening region, wherein the plurality of second fins is disposed on the exposed at least the portion of the first side of the first cover, wherein the electronic component is disposed on a side of the printed circuit board, and wherein the electronic component is disposed in a space between a first side of the second cover facing the side of the printed circuit board and the side of the printed circuit board. In accordance with another aspect of the disclosure, a vapor chamber is provided. The vapor chamber includes a first metal structure, a second metal structure coupled to the first metal structure and forming a space for a fluid between the first metal structure and the second metal structure, and a plurality of pillars disposed in the space, wherein the first metal structure is formed based on a clad in which a first metallic material and a second metallic material are combined, wherein the second metal structure is formed based on a clad in which the first metallic material and the second metallic material are combined, wherein the first metal structure is disposed such that the first metallic material is located at a first side of the first metal structure and the second metallic material is located at a second side of the first metal structure opposite to the first side, wherein the second metal structure is disposed such that the first metallic material is located at a first side of the second metal st