US-20260129802-A1 - AIR GUIDE COVER AND ELECTRONIC DEVICE

Abstract

The present disclosure discloses an air guide cover and an electronic device. The air guide cover includes a heat conduction member and a first heat dissipation member forming a circumferentially surrounded space; wherein at least a part of the heat conduction member is in contact with a heating element, and the air guide cover dissipates heat of the heating element. The air guide cover of the present disclosure may act as heat sinks of the heating element, and has a large heat dissipation area and strong heat dissipation capability, and the air guide cover also has effect of directing and guiding air from the heat sink.

Inventors

• Jie Zhao
• Yingjue LI
• Le Liang

Assignees

• DELTA ELECTRONICS (SHANGHAI) CO.,LTD.

Dates

Publication Date

20260507

Application Date

20251027

Priority Date

20241105

Claims (20)

1. 1 . An air guide cover, comprising: a heat conduction member and a first heat dissipation member forming a circumferentially surrounded space; wherein at least a part of the heat conduction member is configured to contact a heating element for dissipating heat of the heating element.
2. 2 . The air guide cover according to claim 1 , wherein, at least a part of a top surface of the heat conduction member is configured to contact a bottom surface of the heating element for conducting heat.
3. 3 . The air guide cover according to claim 1 , wherein, the first heat dissipation member comprises a first component, which is in an inverted U-shaped structure; the heat conduction member comprises a second component, which is bent and has a bending angle, the first component connected to the second component.
4. 4 . The air guide cover according to claim 1 , wherein the heat conduction member is at least one of a vapor chamber, a heat conduction sheet, a cold plate and a heat pipe.
5. 5 . The air guide cover according to claim 1 , wherein the heat conduction member and the first heat dissipation member are made of the same material.
6. 6 . The air guide cover according to claim 3 , wherein the first component comprises a first portion and a second portion, which are connected.
7. 7 . The air guide cover according to claim 6 , wherein the first portion and the second portion of the first component are in an inverted L-shape.
8. 8 . The air guide cover according to claim 4 , wherein the heat pipe is an ultra-thin heat pipe with a thickness of 0.3 to 0.5 mm.
9. 9 . The air guide cover according to claim 2 , wherein the heat conduction member in contact with the heating element has a thickness less than 8 mm.
10. 10 . The air guide cover according to claim 1 , wherein the air guide cover has a heat conductivity coefficient greater than or equal to 30 W/(m·k).
11. 11 . The air guide cover according to claim 3 , wherein materials of the first component and/or the second component are at least one of copper, aluminum alloy, graphene, and a composite material of diamond and metal.
12. 12 . The air guide cover according to claim 3 , wherein the first component comprises: a body member; a side panel member detachably connected to the body member, and the second component connected to the side panel member.
13. 13 . An electronic device, comprising: a heating element; the air guide cover according to claim 1 ; wherein the heating element is in contact with the heat conduction member of the air guide cover.
14. 14 . The electronic device according to claim 13 , wherein the electronic device further comprises: a first circuit board; a load; wherein, the heating element comprises at least one power supply module disposed on a bottom surface of the first circuit board, the load is located on a top surface of the first circuit board, and the power supply module supplies power to the load; a bottom surface of the at least one power supply module is in contact with a top surface of the heat conduction member.
15. 15 . The electronic device according to claim 14 , wherein the electronic device further comprises: at least one heat sink in contact with the load, and the heat sink located within an air guide region of the air guide cover, the air guide cover configured for guiding air to the heat sink.
16. 16 . The electronic device according to claim 14 , wherein projections of the at least one power supply module and the load on the first circuit board are at least partially overlapped.
17. 17 . The electronic device according to claim 14 , wherein a projection of the at least one power supply module on the first circuit board is located within a projection of the load on the first circuit board.
18. 18 . The electronic device according to claim 14 , wherein the first circuit board, the at least one power supply module and the load form a first module, and at least two of the first modules share one air guide cover.
19. 19 . The electronic device according to claim 18 , wherein the first module comprises a plurality of power supply modules disposed on the bottom surface of the first circuit board.
20. 20 . The electronic device according to claim 14 , wherein the electronic device further comprises: a second circuit board located below the heat conduction member; wherein the second circuit board and the first circuit board have a first clearance therebetween; the first circuit board and the second circuit board are connected through a connector within the first clearance.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application 202411573404.X filed in P.R. China on Nov. 5, 2024, the entire contents of which are hereby incorporated by reference. Some references, if any, which may include patents, patent applications and various publications, may be cited and discussed in the description of this application. The citation and/or discussion of such references, if any, is provided merely to clarify the description of the present application and is not an admission that any such reference is “prior art” to the application described herein. All references listed, cited and/or discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference. BACKGROUND OF THE PRESENT DISCLOSURE 1. Field of the Present Disclosure The present disclosure relates to a power electronic system and its heat dissipation technology, and particularly, relates to an air guide cover and an electronic device. 2. Related Art With sharp demand for computing power and power density in the industries such as cloud computing and artificial intelligence, a higher requirement for efficiency and dynamic performance of the power supply system is put forward. The vertical power supply system architecture has attracted much attention due to advantages of good dynamic performance, high efficiency and low capacitance. The “vertical power supply system architecture” refers to a stack layout that the power supply module and the load are perpendicular to a circuit board, and arranged separately on a top surface and a bottom surface of the circuit board, and in such case, projections of the power supply module and the load on the circuit board are at least partially overlapped. As shown in FIG. 1, the existing “vertical power supply system architecture” is generally to provide a load 301′ (such as, a processor) on a top surface of an OAM board 300′, and provide a plurality of power supply modules 200′ on a bottom surface of the OAM board 300′ for supplying power to the load 301′. Moreover, a projection of the plurality of power supply modules 200′ on a plane of the OAM board is located within a range of a projection of the load on the plane of the OAM board. To improve strength of the OAM board 300′, reinforcing ribs 400′ and 500′ may also be disposed above and below the OAM board 300′, respectively. A heating power is large due to operation of the load, and a heat sink 600′ (such as, a fin heat sink) may also be arranged above the load 301′ for timely dissipating heat of the load 301′, the heat sink 600′ has an area as large as possible, but its projection on the plane of the OAM plate is located within the OAM board and has a certain height, and the possible maximum heat dissipation space of the heat sink 600′ is all spaces over the OAM board. A device combined by the OAM board 300′, the load 301′, the plurality of power supply modules 200′ and the heat sink 600′ is referred to as “an OAM module” (the sign is M1′ in the figure). To enhance rigidity of the OAM board and prevent it from wrapping and deformation, “an OAM module” may further include reinforcing ribs disposed above and below the OAM board 300′. High-speed signals may be transmitted through a connector (not shown) between the OAM module M1′ and the system board (not shown) to establish communication connection. As for the common AI server, eight OAM modules may be configured on one system board. However, the vertical power supply system architecture also proposes a huge challenge to heat dissipation of the power supply module: the power supply module faces the problem of high heat dissipation requirement, and large difficulty in heat dissipation. Generally, supplying power to one load requires 10 to 30 power supply modules, and these power supply modules are often centrally arranged below the OAM board, and have a large power density, a high heat flux density and high heat dissipation requirement. However, due to the requirement for transmission quality of the high-speed signals between the OAM module and the system board, the distance between the OAM board and the system board is small (5 to 8 mm according to Open Computing Project (OCP) standard), and the power supply modules are provided on a lower surface of the OAM board, such that a distance between the power supply modules and the system board is narrower, and it is impossible to arrange a fin heat sink between the power supply modules and the system board; moreover, when a plurality of OAM modules are provided on one system board, a clearance between the two adjacent OAM modules in a width direction of the server is usually 1 to 2 mm, a space between the OAM modules is also too narrow, and it is impossible to arrange the fin heat sink of the power supply modules; furthermore, the power supply modules provided on the botto