US-20260129803-A1 - LIQUID-COOLING HEAT-DISSIPATION PLATE HAVING SPARSELY ARRANGED PIN-FINS AND DENSELY ARRANGED PIN-FINS

US20260129803A1US 20260129803 A1US20260129803 A1US 20260129803A1US-20260129803-A1

Abstract

A liquid-cooling heat dissipating plate with sparsely arranged pin-fins and densely arranged pin-fins includes a heat dissipating plate body and a plurality of pin-fins. The heat dissipating plate body has a first heat dissipating face and a second heat dissipating face being opposite to each other. The first heat dissipating face is for contacting a plurality of chips, and an angle between a chip arrangement direction and a cooling liquid flowing direction is between 65° to 115°. The second heat dissipating face is for contacting the cooling liquid, with the plurality of pin-fins being formed thereon. A plurality of sparse regions with lower fin density and a plurality of dense regions with higher fin density are configured on the heat dissipating plate body, such that a flow speed of the cooling liquid along the cooling liquid flowing direction increases when the cooling liquid flows through each sparse region.

Inventors

Yi-Hsin Huang
Kuo-Wei Lee
Tze-Yang Yeh
Chien-Cheng Wu
Chun-Lung Wu
CHING-MING YANG
Ming-Hsuan Chang

Assignees

AMULAIRE THERMAL TECHNOLOGY, INC.

Dates

Publication Date: 20260507
Application Date: 20241107

Claims (8)

1 . A liquid-cooling heat dissipating plate having sparsely arranged pin-fins and densely arranged pin-fins for being arranged in a closed liquid-cooling sink, comprising: a heat dissipating plate body having a first heat dissipating surface for contacting a plurality of chips and a second heat dissipating surface for contacting a cooling liquid, wherein the first heat dissipating surface and the second heat dissipating surface are opposite to each other; and a plurality of pin-fins formed on the second heat dissipating face of the heat dissipating plate body; wherein an angle between a chip arrangement direction and a cooling liquid flowing direction is between 65° to 115°, and the plurality of pin-fins are divided into a plurality of sparse regions with lower fin density and a plurality of dense regions with higher fin density on the heat dissipating plate body along a degree of 65° to 115° of the cooling liquid flowing direction, which increases a flow speed of the cooling liquid along the cooling liquid flowing direction when the cooling liquid flows through each of the sparse regions.
2 . The liquid-cooling heat dissipating plate according to claim 1 , wherein a fin total surface area per unit area of the sparse region is 0% to 20% of a fin total surface area per unit area of the dense region.
3 . The liquid-cooling heat dissipating plate according to claim 1 , wherein a distance between each of the plurality of pin-fins is between 0.5 to 1.5 mm.
4 . The liquid-cooling heat dissipating plate according to claim 1 , wherein a maximum projection width of the sparse region is 20% to 100% of a projection width of the chip.
5 . The liquid-cooling heat dissipating plate according to claim 1 , wherein the pin-fins are formed by metal injection molding or forging, and a draft angle of the pin-fins is between 0° to 5°.
6 . The liquid-cooling heat dissipating plate according to claim 1 , wherein the plurality of sparse regions and the plurality of dense regions are distributed at an upstream side and/or downstream side of the plurality of chips along the cooling liquid flowing direction.
7 . The liquid-cooling heat dissipating plate according to claim 1 , wherein the plurality of chips are defined as a chip cluster by three or more than three chips arranged along the chip arrangement direction, and the upstream side and the downstream side of a central chip of the chip cluster are configured to have the sparse regions arranged thereon.
8 . The liquid-cooling heat dissipating plate according to claim 7 , wherein, when the number of the chips of the chip cluster is odd, the central chip of the chip cluster is one of the plurality of chips disposed at a center of the chip cluster, and when the number of the chips of the chip cluster is even, the central chip of the chip cluster is two of the plurality of chips disposed at a center of the chip cluster.

Description

Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference. FIELD OF THE DISCLOSURE The present disclosure relates to a liquid-cooling heat dissipation plate, and more particularly to a liquid-cooling heat dissipation plate with sparsely arranged pin-fins and densely arranged pin-fins. BACKGROUND OF THE DISCLOSURE Heat sinks are quite common in the applications of various products. Generally, advanced products usually adopt water/liquid-cooling heat sinks, which have the advantages of being more silent and providing stable cooling compared to wind-cooling heat sinks. However, for a plurality of chips of the power modules used in electric vehicles, which are running at increasingly faster speeds, the liquid-cooling heat sinks are no longer able to satisfy the needs for heat dissipation of these chips. Therefore, how to conduct heat dissipation more efficiently through liquid-cooling technology has long been an issue to be addressed in the relevant industry. SUMMARY OF THE DISCLOSURE In response to the above-referenced technical inadequacy the present disclosure provides a liquid-cooling heat dissipation plate with sparsely arranged pin-fins and densely arranged pin-fins. In order to solve the above-mentioned problems, one of the technical aspects adopted by the present disclosure is to provide a liquid-cooling heat dissipating plate with sparsely arranged pin-fins and densely arranged pin-fins for being arranged in a closed liquid-cooling heat sink, including: a heat dissipating plate body with a first heat dissipating surface for contacting a plurality of chips and a second heat dissipating face for contacting a cooling liquid, the first heat dissipating surface and the second heat dissipating surface being opposite to each other, and a plurality of pin-fins formed on the second heat dissipating face of the heat dissipating plate body, in which an angle between a chip arrangement direction and a cooling liquid flowing direction is between 65° to 115°, and the plurality of pin-fins are divided into a plurality of sparse regions with lower fin density and a plurality of dense regions with higher fin density on the heat dissipating plate body along a degree of 65° to 115° of the cooling liquid flowing direction, such that a flow speed of the cooling liquid along the cooling liquid flowing direction increases when the cooling liquid flows through each of the sparse regions. In one of the possible or preferred embodiments, a fin total surface area per unit area of the sparse region is 0% to 20% of a fin total surface area per unit area of the dense region. In one of the possible or preferred embodiments, the distance between each of the pin-fins is between 0.5 to 1.5 mm. In one of the possible or preferred embodiments, a maximum projection width of the sparse region is 20% to 100% of a projection width of the chip. In one of the possible or preferred embodiments, the pin-fins are formed by metal injection molding or forging, and a draft angle of the pin-fins is between 0° to 5°. In one of the possible or preferred embodiments, the plurality of sparse regions and the plurality of dense regions are distributed at an upstream side and/or a downstream side of the plurality of chips along the cooling liquid flowing direction. In one of the possible or preferred embodiments, the plurality of chips are defined as a chip cluster by three or more than three chips arranged along the chip arrangement direction, and the upstream side and the downstream side of a central chip of the chip cluster are configured to have the sparse regions arranged thereon. In one of the possible or preferred embodiments, when the number of the chips of the chip cluster is odd, the central chip of the chip cluster is one of the plurality of chips disposed at a center of the chip cluster, and when the number of the chips of the chip cluster is even, the central chip of the chip cluster is two of the plurality of chips disposed at a center of the chip cluster. These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS The described embodiments may be better understood by reference to the following description and the accompanying dr