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US-20260129813-A1 - POWER SUPPLY MODULE

US20260129813A1US 20260129813 A1US20260129813 A1US 20260129813A1US-20260129813-A1

Abstract

A power supply module includes: a plurality of drive boards configured to separately drive electronic circuits composed of a plurality of electronic components that generates different amounts of heat; a heat shield electronic component composed of one of the plurality of electronic components, the heat shield electronic component separating the plurality of drive boards from each other; and a heat transfer reducing member configured to reduce heat transfer from one of the drive boards to the other drive board via the heat shield electronic component, the heat transfer reducing member overlapping at least part of the drive board as viewed in plan.

Inventors

  • Masaru Nitta
  • Hidefumi Koashi

Assignees

  • AISIN CORPORATION

Dates

Publication Date
20260507
Application Date
20231108
Priority Date
20221116

Claims (15)

  1. 1 . A power supply module comprising: a plurality of drive boards configured to separately drive electronic circuits composed of a plurality of electronic components that generates different amounts of heat; a heat shield electronic component composed of one of the plurality of electronic components, the heat shield electronic component separating the plurality of drive boards from each other; and a heat transfer reducing member configured to reduce heat transfer from one of the drive boards to the other drive board via the heat shield electronic component, the heat transfer reducing member overlapping at least part of the drive board as viewed in plan.
  2. 2 . The power supply module according to claim 1 , wherein the heat shield electronic component is a film capacitor.
  3. 3 . The power supply module according to claim 1 , wherein the heat transfer reducing member is a control board configured to control the drive board.
  4. 4 . The power supply module according to claim 3 , wherein the control board is a common board configured to control the plurality of drive boards.
  5. 5 . The power supply module according to claim 3 , further comprising a housing that houses the drive board, wherein the control board is housed in the housing.
  6. 6 . The power supply module according to claim 1 , wherein the heat shield electronic component is taller than the electronic components disposed near both sides of the heat shield electronic component.
  7. 7 . The power supply module according to claim 1 , wherein a distance between the heat shield electronic component and the heat transfer reducing member is smaller than a distance between each of the plurality of drive boards and the heat transfer reducing member.
  8. 8 . The power supply module according to claim 2 , wherein the heat shield electronic component is taller than the electronic components disposed near both sides of the heat shield electronic component.
  9. 9 . The power supply module according to claim 3 , wherein the heat shield electronic component is taller than the electronic components disposed near both sides of the heat shield electronic component.
  10. 10 . The power supply module according to claim 4 , wherein the heat shield electronic component is taller than the electronic components disposed near both sides of the heat shield electronic component.
  11. 11 . The power supply module according to claim 5 , wherein the heat shield electronic component is taller than the electronic components disposed near both sides of the heat shield electronic component.
  12. 12 . The power supply module according to claim 2 , wherein a distance between the heat shield electronic component and the heat transfer reducing member is smaller than a distance between each of the plurality of drive boards and the heat transfer reducing member.
  13. 13 . The power supply module according to claim 3 , wherein a distance between the heat shield electronic component and the heat transfer reducing member is smaller than a distance between each of the plurality of drive boards and the heat transfer reducing member.
  14. 14 . The power supply module according to claim 4 , wherein a distance between the heat shield electronic component and the heat transfer reducing member is smaller than a distance between each of the plurality of drive boards and the heat transfer reducing member.
  15. 15 . The power supply module according to claim 5 , wherein a distance between the heat shield electronic component and the heat transfer reducing member is smaller than a distance between each of the plurality of drive boards and the heat transfer reducing member.

Description

TECHNICAL FIELD The present disclosure relates to power supply modules. BACKGROUND ART A power supply module equipped with electronic circuits such as an inverter and a converter is conventionally known in the art (see, for example, Patent Document 1). For example, this power supply module converts power supplied from a commercial power supply and charges a battery with the converted power, or converts power supplied from a battery mounted on a vehicle such as an automobile and supplies the converted power to an electronic device such as a motor. In the power supply module described in Patent Document 1, a case is divided into upper and lower spaces, and a converter circuit is disposed in the upper space and an inverter circuit is disposed in the lower space. A cooling channel through which a coolant flows is provided at the bottom of the lower space, and heat is transferred to the metal case to cool the converter circuit and the inverter circuit. RELATED ART DOCUMENTS Patent Documents Patent Document 1: Japanese Unexamined Patent Application Publication No. 11-121690 (JP 11-121690 A) SUMMARY OF THE INVENTION Problem to be Solved by the Invention A power supply module uses various electronic components that generate different amounts of heat, such as a switching element, a reactor, a capacitor, and a transformer. In the power supply module described in Patent Document 1 described in Patent Document 1, the converter circuit and the inverter circuit are separately disposed in the upper space and the lower space, respectively. Therefore, for example, heat from a switching element of the converter circuit, namely an element that generates a relatively large amount of heat, raises the ambient temperature via air. In this case, the heat stagnates, which tends to reduce cooling efficiency. Accordingly, there is a demand for a compact power supply module that can improve cooling efficiency. Means for Solving the Problem A characteristic configuration of a power supply module according to the present disclosure is that the power supply module includes: a plurality of drive boards configured to separately drive electronic circuits composed of a plurality of electronic components that generates different amounts of heat; a heat shield electronic component composed of one of the plurality of electronic components, the heat shield electronic component separating the plurality of drive boards from each other; and a heat transfer reducing member configured to reduce heat transfer from one of the drive boards to the other drive board via the heat shield electronic component, the heat transfer reducing member overlapping at least part of the drive board as viewed in plan. Of the plurality of driver boards configured to separately drive the plurality of electronic circuits, heat from the electronic circuit mounted on one of the drive boards may be transferred via air to the electronic circuit mounted on the other drive board, which may reduce cooling efficiency. Therefore, this configuration includes: the heat shield electronic component that separates the plurality of drive boards from each other; and the heat transfer reducing member that is configured to reduce heat transfer from one of the drive boards to the other drive board via the heat shield electronic component and that overlaps at least part of the drive board as viewed in plan. This allows the electronic circuits that are separately controlled by the drive boards to be independently cooled by the heat shield electronic component and the heat transfer reducing member. Moreover, since the heat shield electronic component is composed of one of the plurality of electronic components, there is no need to provide a separate heat shield member. The power supply module can thus be made compact. The compact power supply module that can improve cooling efficiency is thus provided. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a circuit configuration diagram of a cooling system including a power supply module according to a first embodiment. FIG. 2 is an exploded perspective view of the power supply module. FIG. 3 is a longitudinal section of the power supply module. FIG. 4 is an enlarged view of a portion B in FIG. 3. FIG. 5 is a sectional view taken along line V-V and viewed in the direction of the arrows in FIG. 2. FIG. 6 is a partial longitudinal section of a power supply module according to a second embodiment. FIG. 7 is a partial longitudinal section of a power supply module according to a third embodiment. FIG. 8 is a partial enlarged plan view of the power supply module. FIG. 9 is a sectional view taken along line IX-IX and viewed in the direction of the arrows in FIG. 8. MODES FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of a power supply module according to the present disclosure will be described in detail with reference to the drawings. The embodiments described below are merely examples illustrating the present disclosure, and the present disclosure is