US-20260129915-A1 - ELECTRONIC DEVICE

US20260129915A1US 20260129915 A1US20260129915 A1US 20260129915A1US-20260129915-A1

Abstract

An electronic device is provided. The electronic device includes a substrate, a thin-film transistor layer, a first passivation layer, an organic layer, a metal layer, and a light-emitting element. The thin-film transistor layer is disposed on the substrate. The first passivation layer is disposed on the thin-film transistor layer, and includes an opening or a recess. The organic layer is disposed on the first passivation layer. The organic layer includes a first portion and a second portion separated from the first portion by a space. The metal layer is disposed on the thin-film transistor layer, and the metal layer corresponds to the opening or the recess and the space. The light-emitting element is in contact with the metal layer. The metal layer is in direct contact with the first passivation layer. In a cross-sectional view, the organic layer and the metal layer do not overlap.

Inventors

Chueh-Yuan NIEN
Chao-Chin Sung
Chao-Sen YANG
Chien-Tzu Chu
Yu-Chien Kao
Li-Wei Sung

Assignees

Innolux Corporation

Dates

Publication Date: 20260507
Application Date: 20260105
Priority Date: 20211020

Claims (3)

1 . An electronic device, comprising: a substrate; a thin-film transistor layer disposed on the substrate; a first passivation layer disposed on the thin-film transistor layer, wherein the first passivation layer comprises an opening or a recess; an organic layer disposed on the first passivation layer, wherein the organic layer comprises a first portion and a second portion separated from the first portion by a space; a metal layer disposed on the thin-film transistor layer, wherein the metal layer corresponds to the opening or the recess and the space; and a light-emitting element in contact with the metal layer, wherein the metal layer is in direct contact with the first passivation layer, and in a cross-sectional view, the organic layer and the metal layer do not overlap.
2 . The electronic device as claimed in claim 1 , wherein a first thickness of the first passivation layer overlapping the organic layer is different from a second thickness of the first passivation layer not overlapping the organic layer.
3 . The electronic device as claimed in claim 2 , wherein the first thickness is greater than the second thickness.

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application is a continuation of pending U.S. patent application Ser. No. 17/932,728, filed Sep. 16, 2022, which claims the benefit of China Application No. 202111219132.X, filed Oct. 20, 2021, the entirety of which are incorporated by reference herein. BACKGROUND Technical Field The present disclosure is related to a method of manufacturing an electronic device, and in particular it is related to a manufacturing method that can improve the structural reliability of an electronic device and an electronic device formed by the manufacturing method. Description of the Related Art Electronic products including display panels, such as tablet computers, notebook computers, smartphones, monitors, and televisions, have become indispensable necessities in modern society. With the flourishing development of various electronic products, consumers have high expectations for the quality, function, or price of these products. Electronic components in an electronic device are usually bonded or electrically connected to a substrate through bonding pads, solder pads or other conductive elements. However, due to the difference in coefficient of thermal expansion (CTE) between the substrate and the light-emitting element, when the temperature changes, the junction between the substrate and the light-emitting element may easily be affected by stress, resulting in cracks or peeling. Furthermore, problems such as abnormal electrical connection of the driving circuits are caused. As described above, existing electronic devices that include display panels still do not meet requirements in all respects. Therefore, researchers in this industry are currently seeking to develop a method of manufacturing an electronic device that can further improve the structural reliability of the electronic device. SUMMARY In accordance with some embodiments of the present disclosure, an electronic device is provided. The electronic device includes a substrate, a thin-film transistor layer, a thin-film transistor layer, a first passivation layer, an organic layer, a metal layer, and a light-emitting element. The thin-film transistor layer is disposed on the substrate. The first passivation layer is disposed on the thin-film transistor layer, and includes an opening or a recess. The organic layer is disposed on the first passivation layer. The organic layer includes a first portion and a second portion separated from the first portion by a space. The metal layer is disposed on the thin-film transistor layer, and the metal layer corresponds to the opening or the recess and the space. The light-emitting element is in contact with the metal layer. The metal layer is in direct contact with the first passivation layer. In a cross-sectional view, the organic layer and the metal layer do not overlap. A detailed description is given in the following embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The disclosure may be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein: FIG. 1 is a cross-sectional diagram of an electronic device in accordance with some embodiments of the present disclosure; FIG. 2 is a cross-sectional diagram of an electronic device in accordance with some embodiments of the present disclosure; FIG. 3 is a cross-sectional diagram of an electronic device in accordance with some embodiments of the present disclosure; FIG. 4 is a cross-sectional diagram of an electronic device in accordance with some embodiments of the present disclosure; FIG. 5, FIG. 6, FIG. 7, FIG. 8, FIG. 9A, FIG. 9B, FIG. 10A, FIG. 10B, FIG. 11A and FIG. 11B are cross-sectional diagrams of an electronic device during different process stages in accordance with some embodiments of the present disclosure; FIG. 12A and FIG. 12B are cross-sectional diagrams of an electronic device during different process stages in accordance with some embodiments of the present disclosure. DETAILED DESCRIPTION An electronic device and a method of manufacturing an electronic device according to the present disclosure are described in detail in the following description. It should be understood that in the following detailed description, for purposes of explanation, numerous specific details and embodiments are set forth in order to provide a thorough understanding of the present disclosure. The elements and configurations described in the following detailed description are set forth in order to clearly describe the present disclosure. These embodiments are used merely for the purpose of illustration, and the present disclosure is not limited thereto. In addition, different embodiments may use like and/or corresponding numerals to denote like and/or corresponding elements in order to clearly describe the present disclosure. However, the use of like and/or corresponding numerals of different embodiments does not suggest an