US-20260129988-A1 - IMAGE PICKUP MODULE, ENDOSCOPE, AND METHOD FOR MANUFACTURING IMAGE PICKUP MODULE

US20260129988A1US 20260129988 A1US20260129988 A1US 20260129988A1US-20260129988-A1

Abstract

An image pickup module includes a wiring board including a first principal surface and a second principal surface, a land and a draw-out wiring being disposed on the first principal surface, the wiring board including a through hole, a through wiring layer in electrical communication with the draw-out wiring being disposed on an inner surface of the through hole; a resin disposed in the through hole and sealing an opening on a side of the first principal surface; a bonding member bonded to the land; and a camera unit bonded to the bonding members.

Inventors

Keiichi Kobayashi
Daichi KODAMA
Junya Yamada

Assignees

OLYMPUS MEDICAL SYSTEMS CORP.

Dates

Publication Date: 20260507
Application Date: 20251204

Claims (20)

1 . An image pickup module comprising: a wiring board including a first principal surface and a second principal surface on an opposite side of the first principal surface, a plurality of lands and a plurality of draw-out wirings extended respectively from the plurality of lands being disposed on the first principal surface, the wiring board including a plurality of through holes penetrating through the first principal surface and the second principal surface, a plurality of through wiring layers being disposed on respective inner surfaces of the plurality of through holes, the plurality of through wiring layers being in electrical communication with the plurality of draw-out wirings, respectively; a plurality of resins disposed respectively in the plurality of through holes and each sealing an opening on a side of the first principal surface; a plurality of bonding members bonded respectively to the plurality of lands; and a camera unit bonded to the plurality of bonding members.
2 . The image pickup module according to claim 1 , wherein an end surface of each of the plurality of resins on a side of the first principal surface is located between a surface of each of the plurality of draw-out wirings and the first principal surface.
3 . The image pickup module according to claim 1 , wherein a plurality of wiring patterns and a plurality of patterned solder resists are disposed on the second principal surface, the plurality of patterned solder resists being for mounting an electronic component on each of the plurality of wiring patterns, and the plurality of resins is the same as the plurality of patterned solder resists.
4 . The image pickup module according to claim 1 , wherein the wiring board is a three-dimensional wiring board including a bottom surface and a protrusion, the first principal surface serving as the bottom surface, the protrusion being surrounded by walls and including a cavity, and the camera unit is housed in the cavity.
5 . The image pickup module according to claim 4 , wherein the wiring board is a molded interconnect device, and a distance between an inner surface of the cavity and an end portion of each of the plurality of draw-out wirings is greater than 0.2 mm.
6 . The image pickup module according to claim 1 , wherein the bonding member is solder, the plurality of lands includes a first land and a plurality of second lands, the plurality of second lands being placed at N symmetrical positions (N being a natural number equal to or greater than 2) around the first land, and areas of regions where the solder spreads on the plurality of draw-out wirings are substantially the same.
7 . The image pickup module according to claim 6 , further comprising: a dummy draw-out wiring extended from the first land and connected to one of the second lands.
8 . The image pickup module according to claim 7 , wherein both end portions of the dummy draw-out wiring are covered by solder resist patterns, respectively.
9 . The image pickup module according to claim 1 , wherein an inner dimension of each of the plurality of through holes increases from the first principal surface to the second principal surface, and an inner surface of each of the plurality of through wiring layers has a step.
10 . The image pickup module according to claim 1 , wherein the camera unit includes a plurality of optical elements and an imager stacked together.
11 . An endoscope including an insertion portion including a distal end portion in which an image pickup module is disposed, the image pickup module comprising: a wiring board including a first principal surface and a second principal surface on an opposite side of the first principal surface, a plurality of lands and a plurality of draw-out wirings extended respectively from the plurality of lands being disposed on the first principal surface, the wiring board including a plurality of through holes penetrating through the first principal surface and the second principal surface, a plurality of through wiring layers being disposed on respective inner surfaces of the plurality of through holes, the plurality of through wiring layers being in electrical communication with the plurality of draw-out wirings, respectively; a plurality of resins disposed respectively in the plurality of through holes and each sealing an opening on a side of the first principal surface; a plurality of bonding members bonded respectively to the plurality of lands; and a camera unit bonded to the plurality of bonding members.
12 . The endoscope according to claim 11 , wherein the plurality of through holes extend in a direction intersecting a long axis direction of the distal end portion.
13 . The endoscope according to claim 12 , wherein an inner dimension of each of the plurality of through holes increases in a direction from an outer surface of the distal end portion, on which the image pickup module is disposed, toward an interior of the distal end portion.
14 . The endoscope according to claim 11 , wherein an end surface of each of the plurality of resins on a side of the first principal surface is located between a surface of each of the plurality of draw-out wirings and the first principal surface.
15 . The endoscope according to claim 11 , wherein the bonding member is solder, the plurality of lands includes a first land and a plurality of second lands, the plurality of second lands being placed at N symmetrical positions (N being a natural number equal to or greater than 2) around the first land, and areas of regions where the solder spreads on the plurality of draw-out wirings are substantially the same.
16 . The endoscope according to claim 15 , further comprising: a dummy draw-out wiring extended from the first land and connected to one of the second lands.
17 . The endoscope according to claim 16 , wherein both end portions of the dummy draw-out wiring are covered by solder resist patterns, respectively.
18 . A method for manufacturing an image pickup module, the method comprising: fabricating a wiring board including a first principal surface and a second principal surface on an opposite side of the first principal surface, a plurality of lands and a plurality of draw-out wirings extended respectively from the plurality of lands being disposed on the first principal surface, the wiring board including a plurality of through holes penetrating through the first principal surface and the second principal surface, a plurality of through wiring layers being disposed on respective inner surfaces of the plurality of through holes, the plurality of through wiring layers being in electrical communication with the plurality of draw-out wirings, respectively; disposing a plurality of resins in the plurality of through holes, respectively, to thereby sealing an opening of each of the plurality of through holes on a side of the first principal surface; and bonding a plurality of external electrodes of a camera unit to the plurality of lands, respectively, by using a bonding member.
19 . The method for manufacturing the image pickup module according to claim 18 , further comprising: in fabricating the wiring board, disposing the plurality of lands, the plurality of draw-out wirings, and the plurality of through wiring layers, and simultaneously disposing a plurality of wiring patterns on the second principal surface, the plurality of wiring patterns being in electrical communication with the plurality of through wiring layers, respectively; disposing a plurality of patterned solder resists on the plurality of wiring patterns to mount an electronic component on each of the plurality of wiring patterns; and mounting the electronic component on each of the plurality of wiring patterns, wherein the plurality of resins is disposed simultaneously with the solder resists, the plurality of resins being the same as the solder resists.
20 . The method for manufacturing the image pickup module according to claim 18 , further comprising: to fabricate the wiring board, molding a three-dimensional substrate; forming a through hole and an active layer by laser irradiation; and disposing, by a plating method, the plurality of lands, the plurality of draw-out wirings, and the plurality of through wiring layers.

Description

CROSS REFERENCE TO RELATED APPLICATION This application is a continuation application of PCT/JP2023/021361 filed on Jun. 8, 2023, the entire contents of which are incorporated herein by this reference. BACKGROUND 1. Technical Field The present disclosure relates to an image pickup module in which a camera unit is disposed, an endoscope including the image pickup module in which the camera unit is disposed, and a method for manufacturing the image pickup module in which the camera unit is disposed. 2. Description of the Related Art In recent years, three-dimensional circuit devices, such as molded interconnect devices (MIDs), have been used to miniaturize electronic devices and more sophisticated. The publication of Japanese Patent Application Laid-Open Publication No. 2017-23234 discloses a camera unit of an endoscope using an irregularly-shaped circuit substrate, which is a three-dimensional circuit device. The camera unit includes an image pickup device, a flat wiring board (planar wiring board) on which an electronic component is mounted, and an irregularly-shaped circuit substrate (three-dimensional wiring board). A plurality of cables is bonded to each of a plurality of side surfaces of the irregularly-shaped circuit substrate. International Publication No. 2021/181530 discloses an image pickup module in which a camera unit is mounted in a cavity of a molded interconnect device. External electrodes of the camera unit are connected to signal cables via through wirings of through holes that penetrate through a bottom surface of a cavity to lead to a back surface. SUMMARY An image pickup module of an aspect of the present disclosure includes a wiring board including a first principal surface and a second principal surface on an opposite side of the first principal surface, a plurality of lands and a plurality of draw-out wirings extended respectively from the plurality of lands being disposed on the first principal surface, the wiring board including a plurality of through holes penetrating through the first principal surface and the second principal surface, a plurality of through wiring layers being disposed on respective inner surfaces of the plurality of through holes, the plurality of through wiring layers being in electrical communication with the plurality of draw-out wirings, respectively; a plurality of resins disposed respectively in the plurality of through holes and each sealing an opening on a side of the first principal surface; a plurality of bonding members bonded respectively to the plurality of lands; and a camera unit bonded to the plurality of bonding members. An endoscope of an aspect of the present disclosure includes an insertion portion including a distal end portion in which an image pickup module is disposed. The image pickup module includes a wiring board including a first principal surface and a second principal surface on an opposite side of the first principal surface, a plurality of lands and a plurality of draw-out wirings extended respectively from the plurality of lands being disposed on the first principal surface, the wiring board including a plurality of through holes penetrating through the first principal surface and the second principal surface, a plurality of through wiring layers being disposed on respective inner surfaces of the plurality of through holes, the plurality of through wiring layers being in electrical communication with the plurality of draw-out wirings, respectively; a plurality of resins disposed respectively in the plurality of through holes and each sealing an opening on a side of the first principal surface; a plurality of bonding members bonded respectively to the plurality of lands; and a camera unit bonded to the plurality of bonding members. A method for manufacturing an image pickup module of an aspect of the present disclosure includes steps of: manufacturing a wiring board including a first principal surface and a second principal surface on an opposite side of the first principal surface, a plurality of lands and a plurality of draw-out wirings extended respectively from the plurality of lands being disposed on the first principal surface, the wiring board including a plurality of through holes penetrating through the first principal surface and the second principal surface, a plurality of through wiring layers being disposed on respective inner surfaces of the plurality of through holes, the plurality of through wiring layers being in electrical communication with the plurality of draw-out wirings, respectively; disposing a plurality of resins in the plurality of through holes, respectively, to thereby sealing an opening of each of the plurality of through holes on a side of the first principal surface; and bonding a plurality of external electrodes of a camera unit to the plurality of lands, respectively, by using a bonding member. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an image pickup module of a first embod