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US-20260130020-A1 - ARRANGEMENTS FOR LIGHT EMITTING DIODE PACKAGES

US20260130020A1US 20260130020 A1US20260130020 A1US 20260130020A1US-20260130020-A1

Abstract

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LED packages are disclosed. Arrangements for LED packages are disclosed that provide improved reliability and improved emission characteristics in a variety of applications, including outdoor LED displays as well as general illumination. LED packages are disclosed with linear arrangements of LED chips and corresponding lenses to provide improved visibility and color mixing at higher viewing angles. LED packages are disclosed that include different types of lenses that are arranged within the same LED package depending on desired emission characteristics. Body structures for LED packages are disclosed that include arrangements for improved adhesion with encapsulant materials and optional potting materials to provide improved moisture barriers.

Inventors

  • Chak Hau Pang
  • Juzuo Sheng
  • Yue Kwong Lau
  • Zhenyu Zhong

Assignees

  • CREELED, INC.

Dates

Publication Date
20260507
Application Date
20241101

Claims (20)

  1. 1 . A lighting emitting diode (LED) device comprising: a submount; and a plurality of LED packages on the submount, at least one LED package of the plurality of LED packages comprising: a body comprising a primary emission face, a mounting face, and a body mesa formed at the primary emission face, the body mesa forming a plurality of cavities at the primary emission face, and the body mesa forming at least two sidewalls that are coupled to one another by a rounded corner of the body mesa; a plurality of LED chips, each cavity of the plurality of cavities comprising at least one LED chip of the plurality of LED chips; and an encapsulant over the plurality of LED chips and coupled to the at least two sidewalls and the rounded corner of the body mesa, the encapsulant comprising a pigment registered with a first cavity of the plurality of cavities, the pigment corresponding to an emission color of the at least one LED chip that is within the first cavity.
  2. 2 . The LED device of claim 1 , further comprising a potting material on the submount and between adjacent LED packages of the plurality of LED packages.
  3. 3 . The LED device of claim 2 , wherein the potting material is on the at least two sidewalls and on the rounded corner.
  4. 4 . The LED device of claim 1 , wherein the encapsulant forms a plurality of lenses and a separate lens of the plurality of lenses is registered with each cavity of the plurality of cavities.
  5. 5 . The LED device of claim 4 , wherein each lens comprises a round lens base.
  6. 6 . The LED device of claim 4 , wherein each lens comprises an oval lens base.
  7. 7 . The LED device of claim 4 , wherein at least one lens comprises a round lens base and at least one other lens comprises an oval lens base.
  8. 8 . The LED device of claim 1 , wherein the encapsulant forms a lens that is registered with a first cavity of the plurality of cavities and the encapsulant further forms a flat surface that is registered with a second cavity of the plurality of cavities.
  9. 9 . The LED device of claim 8 , wherein a sensor device is arranged within the second cavity.
  10. 10 . The LED device of claim 1 , wherein the plurality of cavities are arranged with a linear alignment.
  11. 11 . The LED device of claim 1 , wherein one or more surface features are formed in the body mesa between adjacent cavities of the plurality of cavities.
  12. 12 . The LED device of claim 1 , wherein one or more surface features are formed along at least one of the at least two sidewalls of the body mesa.
  13. 13 . The LED device of claim 1 , wherein the pigment is a first pigment region registered with the first cavity and the encapsulant further comprises separate second and third pigment regions that are respectively registered with corresponding second and third cavities of the plurality of cavities, wherein the second pigment region corresponds to an emission color of the at least one LED chip that is within the second cavity and the third pigment region corresponds to an emission color of the at least one LED chip that is within the third cavity.
  14. 14 . A lighting emitting diode (LED) device comprising: a submount; and a plurality of LED packages on the submount, at least one LED package of the plurality of LED packages comprising: a body comprising a primary emission face and a mounting face, the primary emission face forming a plurality of cavities that are arranged in a linear alignment; a plurality of LED chips, wherein each cavity of the plurality of cavities comprises at least one LED chip of the plurality of LED chips; and an encapsulant over the plurality of LED chips, the encapsulant forming a plurality of lenses and a separate lens of the plurality of lenses is registered with each cavity of the plurality of cavities, the encapsulant comprising a pigment that is registered with a first cavity of the plurality of cavities, the pigment corresponding to an emission color of the at least one LED chip that is within the first cavity.
  15. 15 . The LED device of claim 14 , further comprising a potting material on the submount and between adjacent LED packages of the plurality of LED packages.
  16. 16 . The LED device of claim 14 , wherein an aspect ratio of a length and width of the body is in a range from 2:1 to 4:1.
  17. 17 . The LED device of claim 14 , wherein each lens comprises a round lens base.
  18. 18 . The LED device of claim 14 , wherein each lens comprises an oval lens base.
  19. 19 . The LED device of claim 14 , wherein at least one lens comprises a round lens base and at least one other lens comprises an oval lens base.
  20. 20 . The LED device of claim 14 , wherein the pigment is a first pigment region registered with the first cavity and the encapsulant further comprises separate second and third pigment regions that are respectively registered with corresponding second and third cavities of the plurality of cavities, wherein the second pigment region corresponds to an emission color of the at least one LED chip that is within the second cavity and the third pigment region corresponds to an emission color of the at least one LED chip that is within the third cavity.

Description

RELATED APPLICATIONS This application is a continuation of U.S. patent application Ser. No. 17/608,268, filed November 2, 2021, which is a 35 U.S.C. § 371 national phase filing of International Application Ser. No. PCT/CN2019/087957, filed May 22, 2019, the disclosures of which are hereby incorporated herein by reference in their entireties. FIELD OF THE DISCLOSURE The present disclosure relates to solid-state lighting devices including light-emitting diodes (LEDs) and more particularly to LED packages. BACKGROUND Solid-state lighting devices such as light-emitting diodes (LEDs) are increasingly used in both consumer and commercial applications. Advancements in LED technology have resulted in highly efficient and mechanically robust light sources with a long service life. Accordingly, modern LEDs have enabled a variety of new display applications and are being increasingly utilized for general illumination applications, often replacing incandescent and fluorescent light sources. LEDs are solid-state devices that convert electrical energy to light and generally include one or more active layers of semiconductor material (or an active region) arranged between oppositely doped n-type and p-type layers. When a bias is applied across the doped layers, holes and electrons are injected into the one or more active layers where they recombine to generate emissions such as visible light or ultraviolet emissions. An LED chip typically includes an active region that may be fabricated, for example, from silicon carbide, gallium nitride, gallium phosphide, aluminum nitride, gallium arsenide-based materials, and/or from organic semiconductor materials. LED packages are solid-state devices that incorporate one or more LED chips into a packaged device. An LED chip may be enclosed in a component package to provide environmental and/or mechanical protection, light focusing and the like. LEDs are now being used in displays, both big and small. Large or giant screen LED displays are becoming more common in many indoor and outdoor locations, such as at sporting events, race tracks, concerts and in large public areas such as Times Square in New York City. Many of these displays or screens can be as large as 60 feet tall and 60 feet wide, or larger. These screens can comprise thousands of “pixels” mounted on a flat surface to generate an image, with each pixel containing a plurality of LEDs. The pixels can use high efficiency and high brightness LEDs that allow the displays to be visible from relatively far away, even in the daytime when subject to sunlight. The pixels can have as few as three or four LEDs (one red, one green, and one blue) that allow the pixel to emit many different colors of light from combinations of red, green and/or blue light. In the largest screens, pixel modules may be arranged together to form the display where each pixel module can have three or more LEDs, with some having dozens of LEDs. The pixels can be arranged in a rectangular grid with the size and density of the screen determining the number of pixels. For example, a rectangular display can be 640 pixels wide and 480 pixels high, with the end size of the screen being dependent upon the actual size of the pixels. Conventional LED based displays are controlled by a computer or control system that accepts an incoming signal (e.g., a TV signal), and based on the particular color needed at the pixel module to form the overall display image, the control system determines which LED in each of the pixel modules is to emit light and how brightly. A power system can also be included that provides power to each of the pixel modules and the power to each of the LEDs can be modulated so that it emits at the desired brightness. Conductors are provided to apply the appropriate power signal to each of the LEDs in the pixel modules. Some large LED displays are arranged for wide angle or wide pitch emission that allows for a wide lateral range of viewing angles. Pixels for conventional LED displays may use oval lamp LEDs or round lamp LEDs depending on the desired viewing angle, with some using three LED lamps for each pixel. FIG. 1 shows one embodiment of conventional red, green and blue LED lamps 12, 14 and 16 that can be used to form a pixel in a display, and FIG. 2 shows a conventional pixel 10 that includes the red, green and blue LED lamps 12, 14, 16 that are mounted to a substrate 18 using conventional through-hole techniques. Fabricating large screens with three or more separate LED lamps per pixel across a large surface area can be costly and complicated. The art continues to seek improved LEDs and solid-state lighting devices having increased light output and increased light emission efficiencies without impairing manufacturability and reliability of such devices, while providing desirable illumination characteristics capable of overcoming challenges associated with conventional lighting devices. SUMMARY The present disclosure relates to solid-state light