US-20260130025-A1 - PACKAGING STRUCTURE, SYSTEM, AND METHOD

US20260130025A1US 20260130025 A1US20260130025 A1US 20260130025A1US-20260130025-A1

Abstract

A packaging structure, system(s), and method(s) for packaging electronic element(s) are provided. The packing structure is disposed on a substrate (e.g., a circuit board) and includes a transistor, a first resistor, and a first light-emitting element. The packaging structure further includes a first heat-dissipation layer sandwiched between the transistor and the first resistor, and a second heat-dissipation layer sandwiched between the first resistor and the first light-emitting element. Additionally or alternatively, an additional packaging structure is disposed on the circuit board. The additional packaging structure includes a second resistor, a second light-emitting element, and a third heat-dissipation layer sandwiched between the second resistor and the second light-emitting element. The packaging structure may be electrically connected to the additional packaging structure, such that the first and/or second light-emitting element provide indicator light(s) for a component (e.g., a storage drive) hosted by the substrate (e.g., the circuit board).

Inventors

Chunghsing Han

Assignees

Aivres Systems Inc.

Dates

Publication Date: 20260507
Application Date: 20251230

Claims (20)

1 . A packaging structure, comprising: a transistor; a resistor; a first heat-dissipation layer sandwiched between the transistor and the resistor, a light-emitting element; and a second heat-dissipation layer sandwiched between the resistor and the light-emitting element.
2 . The packaging structure of claim 1 , wherein the resistor is connected to the light-emitting element via a first conductive element.
3 . The packaging structure of claim 1 , wherein the transistor is disposed on a circuit board.
4 . The packaging structure of claim 3 , wherein the transistor comprises a first pin connecting to a gate of the transistor, the first pin of the transistor being soldered onto the circuit board to receive a control signal.
5 . The packaging structure of claim 4 , wherein the control signal is configured to control the light-emitting element to indicate a status of an electronic component hosted by the circuit board.
6 . The packaging structure of claim 5 , wherein the circuit board is a backplane comprising a connector for connection with the electronic component, and the electronic component is a storage device.
7 . The packaging structure of claim 3 , wherein the transistor includes a second pin connecting to a source of the transistor, the second pin of the transistor being soldered onto the circuit board for connection to ground.
8 . The packaging structure of claim 3 , further comprising a conductive connector that connects the resistor to the circuit board.
9 . The packaging structure of claim 1 , wherein the transistor includes a drain connected to the light-emitting element via a second conductive element.
10 . The packaging structure of claim 1 , further comprising one or more support elements to support the second heat-dissipation layer, the one or more support elements being sandwiched between the first and second heat-dissipation layers.
11 . The packaging structure of claim 10 , wherein the one or more support elements include a plurality of tapered columns spaced apart from each other and disposed around a periphery of the first or second heat-dissipation layer.
12 . The packaging structure of claim 1 , wherein the first or second heat-dissipation layer includes an insulating material.
13 . A packaging structure, comprising: a transistor disposed on a circuit board; a resistor; a heat-dissipation groove that accommodates the resistor; and a light-emitting element disposed above the heat-dissipation groove, wherein the heat-dissipation groove includes a bottom portion and a side wall portion, and wherein the bottom portion of the heat-dissipation groove is sandwiched between the transistor and the resistor.
14 . The packaging structure of claim 13 , comprising: a heat-dissipation layer disposed between the light-emitting element and the resistor that is accommodated in the heat-dissipation groove.
15 . The packaging structure of claim 13 , wherein the side wall portion of the heat-dissipation groove includes one or more side walls substantially perpendicular to the bottom portion.
16 . The packaging structure of claim 13 , wherein the side wall portion of the heat-dissipation groove includes an opening that allows a first connecting element to connect the resistor with the circuit board via the opening.
17 . The packaging structure of claim 13 , wherein the heat-dissipation groove further accommodates a second connecting element that connects the resistor with the light-emitting element.
18 . The packaging structure of claim 13 , further comprising a third connecting element that connects the transistor with the light-emitting element.
19 . A packaging method, comprising: disposing a transistor on a circuit board; disposing a first heat-dissipation layer or a heat-dissipation groove over the transistor; disposing a resistor over the first heat-dissipation layer or within the heat-dissipation groove; and disposing a light-emitting element over the resistor or the heat-dissipation groove, wherein the light-emitting element is separated from the resistor using a second heat-dissipation layer or the heat-dissipation groove.
20 . The packaging method of claim 19 , further comprising: prior to disposing the light-emitting element: configuring a first end of a first conductive element to connect with the resistor, configuring a second end of the first conductive element to be connected to a first soldering region disposed on a surface of the second heat-dissipation layer that faces away from the resistor, configuring a first end of a second conductive element to connect with the transistor, and configuring a second end of the second conductive element to be connected to a second soldering region disposed on the surface of the second heat-dissipation layer that faces away from the resistor, the second soldering region being separate from the first soldering region.

Description

TECHNICAL FIELD The present disclosure relates generally to packaging, and more particularly, to systems and methods for packaging one or more electronic elements (e.g., circuit elements). BACKGROUND An electronic system often includes multiple electronic elements. For example, the electronic system may be a server device that includes a hard drive and a LED lighting element that indicates a state of the hard drive. For the electronic system (or a portion thereof) that has a limited size or to have a reduced size, there is a need to reduce the packaging volume of one or more electronic elements or a circuit that includes the one or more electronic elements (e.g., the LED lighting element). SUMMARY Techniques are described herein for packaging structures and methods that reduce packaging volume of one or more electronic elements. The one or more electronic elements can include, for instance, one or more transistors, one or more resistors, and/or one or more light-emitting elements that form part of a circuit (e.g., an illumination circuit). The packaging structures according to one or more embodiments can include multi-layer structure(s), which allows a circuit board to have more space to accommodate more packaging structures (e.g., when more status indicators are desired). According to one aspect of the present disclosure, a packaging structure is provided. The packaging structure may include: a transistor; a resistor; a first heat-dissipation layer sandwiched between the transistor and the resistor; a light-emitting element; and/or a second heat-dissipation layer sandwiched between the first resistor and the first light-emitting element. In some embodiments, the resistor is connected to the light-emitting element via a first conductive element. The light-emitting element can be a single-color LED or a dual-color LED for indicating a state of a component (e.g., a storage device). In some embodiments, the transistor is disposed on a circuit board. In some embodiments, the packaging structure includes a first pin connecting the transistor with the circuit board. For example, the first pin can be a conductive strip included in or coupled to the transistor, where a first end of the first pin connects a gate of the transistor and a second end of the first pin is soldered onto the circuit board to receive a control signal (e.g., via a conductive trace that transmits/carries the control signal). In some embodiments, the control signal is configured to control the light-emitting element to indicate a status (e.g., “on,” “off,” etc.) of an electronic component hosted by the circuit board. In some embodiments, the circuit board is a backplane that includes a connector for connection with the electronic component. In some other embodiments, the circuit board may be a motherboard, or any other applicable board or substrate. In some embodiments, the electronic components can be, for instance, a storage device (e.g., HDD inserted to a slot of the circuit board), or any other applicable component. In some embodiments, the transistor includes a second pin connecting to a source of the transistor, where the second pin of the transistor is soldered onto the circuit board for connection to ground. In some embodiments, the packaging structure further includes a conductive connector that connects the resistor to the circuit board. In some embodiments, the transistor is connected (e.g., electrically) to the light-emitting element via a second conductive element. For example, the transistor includes a drain that is connected to the light-emitting element via the second conductive element. In some embodiments, the packaging structure further includes one or more support elements to support the second heat-dissipation layer. The one or more support elements may be sandwiched between the first and second heat-dissipation layers. In some embodiments, the one or more support elements include a plurality of tapered columns spaced apart from each other and disposed around a periphery of the first or second heat-dissipation layer. In some embodiments, the first or second heat-dissipation layer may each include an insulating material (e.g., aluminum-based, ceramic-based, etc.). In some embodiments, the first heat-dissipation layer may include a first insulating material, and the second heat-dissipation layer may include a second insulating material. The first insulating material may be the same as, or different from, the second insulating material. In some embodiments, the first or second insulating material may each include a porous structure. According to another aspect of the present disclosure, a packaging structure is provided. The packaging structure includes: a transistor disposed on a substrate (e.g., a circuit board); a resistor; a heat-dissipation groove that accommodates the resistor; and a light-emitting element disposed above the heat-dissipation groove. In some embodiments, the heat-dissipation groove includes a bottom porti