US-20260130038-A1 - DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR

US20260130038A1US 20260130038 A1US20260130038 A1US 20260130038A1US-20260130038-A1

Abstract

A display module and a manufacturing method therefor are provided. The display module includes a substrate including a plurality of electrode pads, a first non-conductive adhesive member formed on a surface of the substrate and having a first curing temperature, a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature, and a plurality of light emitting elements bonded to the plurality of electrode pads, wherein electrodes of the plurality of light emitting elements are respectively bonded to the plurality of electrode pads by sequentially passing through the second non-conductive adhesive member and the first non-conductive adhesive member, and wherein the second curing temperature is higher than the first curing temperature.

Inventors

Sera KWON
Byunghoon Lee
Juseung LEE

Assignees

SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20251230
Priority Date: 20230703

Claims (20)

1 . A display device comprising: a substrate including a plurality of electrode pads; a first non-conductive adhesive member formed on a surface of the substrate and having a first curing temperature; a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature; and a plurality of light emitting elements bonded to the plurality of electrode pads, wherein electrodes of the plurality of light emitting elements are respectively bonded to the plurality of electrode pads by sequentially passing through the second non-conductive adhesive member and the first non-conductive adhesive member, and wherein the second curing temperature is higher than the first curing temperature.
2 . The display device of claim 1 , wherein the first non-conductive adhesive member and the second non-conductive adhesive member are formed on the surface of the substrate as a plurality of layers.
3 . The display device of claim 1 , wherein the first non-conductive adhesive member has a first viscosity, and the second non-conductive adhesive member has a second viscosity, and wherein the second viscosity is higher than the first viscosity.
4 . The display device of claim 1 , wherein the second non-conductive adhesive member is a black non-conductive film.
5 . The display device of claim 1 , wherein the first non-conductive adhesive member is a non-conductive film including conductive particles.
6 . The display device of claim 1 , further comprising a third non-conductive adhesive member formed between the first non-conductive adhesive member and the second non-conductive adhesive member.
7 . The display device of claim 6 , wherein a third curing temperature of the third non-conductive adhesive member is lower than the second curing temperature of the second non-conductive adhesive member.
8 . The display device of claim 7 , wherein the electrodes of the plurality of light emitting elements are respectively bonded to the plurality of electrode pads by sequentially passing through the second non-conductive adhesive member, the third non-conductive adhesive member, and the first non-conductive adhesive member.
9 . The display device of claim 6 , wherein the first non-conductive adhesive member has a first viscosity, and the second non-conductive adhesive member has a second viscosity, wherein the second viscosity is higher than the first viscosity, and wherein a third viscosity of the third non-conductive adhesive member is lower than the second viscosity of the second non-conductive adhesive member.
10 . The display device of claim 6 , wherein at least one of the second non-conductive adhesive member and the third non-conductive adhesive member is a black non-conductive film, and wherein the first non-conductive adhesive member is a non-conductive film including conductive particles.
11 . A method of bonding a plurality of light emitting elements on a substrate of a display device, the method comprising: forming a first non-conductive adhesive member having a first curing temperature on a substrate including a plurality of electrode pads; forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member; aligning a plurality of electrodes of the light emitting elements on the plurality of electrode pads; applying heat and pressure to the plurality of electrodes of the light emitting elements such that the plurality of electrodes of the light emitting elements pass through the second non-conductive adhesive member within a first temperature range; applying the heat and the pressure to the plurality of electrodes of the light emitting elements such that the plurality of electrodes of the light emitting elements are inserted into the first non-conductive adhesive member within a second temperature range and are brought into contact with the plurality of electrode pads; and applying the heat and the pressure to the plurality of electrodes of the light emitting elements after the plurality of electrodes of the light emitting elements have passed through the second non-conductive adhesive member, such that the plurality of electrodes of the light emitting elements are bonded to the plurality of electrode pads within the second non-conductive adhesive member, wherein the second curing temperature is higher than the first curing temperature.
12 . The method of claim 11 , wherein a second viscosity of the second non-conductive adhesive member is higher than a first viscosity of the first non-conductive adhesive member.
13 . The method of claim 11 , wherein the forming of the first non-conductive adhesive member comprises attaching a first non-conductive film having a first curing temperature on the substrate through a lamination process, and wherein the forming of the second non-conductive adhesive member comprises attaching a second non-conductive film having a second curing temperature on the first non-conductive film through the lamination process.
14 . The method of claim 11 , wherein the heat and the pressure are applied to the plurality of electrodes of the light emitting elements, such that the plurality of electrodes of the light emitting elements pass through the second non-conductive adhesive member within a first temperature range lower than the first curing temperature and the second curing temperature.
15 . The method of claim 11 , wherein the heat and the pressure are applied to the plurality of electrodes of the light emitting elements, such that the plurality of electrodes of the light emitting elements are brought into contact with the plurality of electrode pads in the first non-conductive adhesive member within a second temperature range lower than the first curing temperature and the second curing temperature.
16 . The method of claim 11 , further comprising: curing the first non-conductive adhesive member at a temperature higher than the first curing temperature, while the plurality of electrodes of the light emitting elements are in contact with the plurality of electrode pads.
17 . The method of claim 11 , further comprising: curing the second non-conductive adhesive member at a temperature higher than the second curing temperature, while the plurality of electrodes of the light emitting elements are in contact with the plurality of electrode pads.
18 . The method of claim 11 , wherein the second non-conductive adhesive member is a black non-conductive film.
19 . One or more non-transitory computer-readable storage media storing one or more computer programs including computer-executable instructions that, when executed by one or more processors of an electronic device individually or collectively, cause the electronic device to perform operations, the operations comprising: forming a first non-conductive adhesive member having a first curing temperature on a substrate including a plurality of electrode pads; forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member; aligning a plurality of electrodes of light emitting elements on the plurality of electrode pads; applying heat and pressure to the plurality of electrodes of the light emitting elements such that the plurality of electrodes of the light emitting elements pass through the second non-conductive adhesive member within a first temperature range; applying the heat and the pressure to the plurality of electrodes of the light emitting elements such that the plurality of electrodes of the light emitting elements are inserted into the first non-conductive adhesive member within a second temperature range and are brought into contact with the plurality of electrode pads; and applying the heat and the pressure to the plurality of electrodes of the light emitting elements after the plurality of electrodes of the light emitting elements have passed through the second non-conductive adhesive member, such that the plurality of electrodes of the light emitting elements are bonded to the plurality of electrode pads within the second non-conductive adhesive member, wherein the second curing temperature is higher than the first curing temperature.
20 . The one or more non-transitory computer-readable storage media of claim 19 , wherein a second viscosity of the second non-conductive adhesive member is higher than a first viscosity of the first non-conductive adhesive member.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) This application is a continuation application, claiming priority under 35 U.S. C. § 365(c), of an International application No. PCT/KR2024/009251, filed on Jul. 2, 2024, which is based on and claims the benefit of a Korean patent application number 10-2023-0085770, filed on Jul. 3, 2023, in the Korean Intellectual Property Office, and of a Korean patent application number 10-2023-0112939, filed on Aug. 28, 2023, in the Korean Intellectual Property Office, the disclosure of each of which is incorporated by reference herein in its entirety. BACKGROUND 1. Field The disclosure relates to a display module including a substrate having a plurality of non-conductive adhesive members formed thereon, and a manufacturing method therefor. 2. Description of Related Art Along with the development trends of high luminance, high resolution, and large size in display devices mounted on various electronic devices, there has recently been a growing demand for high efficiency and low power consumption. Accordingly, a technology has been developed in which Light Emitting Diodes (LEDs) emitting Red (R), Green (G), and Blue (B) light are directly mounted on a substrate to form a display panel. The LEDs are widely used not only as light sources for lighting devices but also as light sources for various display devices in a wide range of electronic products such as televisions (TVs), mobile phones, Personal Computers (PCs), laptop computers, and Personal Digital Assistants (PDAs). In particular, micro LEDs with sizes of 100 μm or less have recently been developed. Compared to conventional LEDs, the micro LEDs exhibit faster response speed, lower power consumption, and higher luminance, and thus are regarded as light emitting elements for next-generation displays. Furthermore, research has been continuously conducted to improve manufacturing yield of such display devices. The above information is presented as background information only to assist with an understanding of the disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the disclosure. SUMMARY Aspects of the disclosure are to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below. Accordingly, an aspect of the disclosure is to provide a display module including a substrate having a plurality of non-conductive adhesive members formed thereon, and a manufacturing method therefor. Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments. In accordance with an aspect of the disclosure, a display device is provided. The display device includes a substrate including a plurality of electrode pads, a first non-conductive adhesive member formed on a surface of the substrate and having a first curing temperature, a second non-conductive adhesive member formed on the first non-conductive adhesive member and having a second curing temperature, and a plurality of light emitting elements bonded to the plurality of electrode pads, wherein electrodes of the plurality of light emitting elements are respectively bonded to the plurality of electrode pads by sequentially passing through the second non-conductive adhesive member and the first non-conductive adhesive member, and wherein the second curing temperature is higher than the first curing temperature. In accordance with another aspect of the disclosure, a method of bonding a plurality of light emitting elements on a substrate of a display device is provided. The method includes forming a first non-conductive adhesive member having a first curing temperature on a substrate including a plurality of electrode pads, forming a second non-conductive adhesive member having a second curing temperature on the first non-conductive adhesive member, aligning a plurality of electrodes of the light emitting elements on the plurality of electrode pads, applying heat and pressure to the plurality of electrodes of the light emitting elements such that the plurality of electrodes of the light emitting elements pass through the second non-conductive adhesive member within a first temperature range, applying the heat and the pressure to the plurality of electrodes of the light emitting elements such that the plurality of electrodes of the light emitting elements are inserted into the first non-conductive adhesive member within a second temperature range and are brought into contact with the plurality of electrode pads, and applying the heat and the pressure to the plurality of electrodes of the light emitting elements after the plurality of electrodes of the light emitting elements have passed through the second non-conductive adhesive member, such that the plurality of electrodes of the light emitting elements are bonded to