US-20260130074-A1 - ELECTRONIC DEVICE INCLUDING DISPLAY DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

Abstract

A display device includes: a display panel including a display area, a pad area located at one side of the display area, and a bending area between the display area and the pad area; a panel protection film attached to a lower portion of the display panel; a flexible circuit board attached to the pad area; and a cover film attached to the pad area and the flexible circuit board, where the pad area overlaps the display area due to bending of the bending area, and a surface of the cover film, a surface of the display panel, and a surface of the panel protection film are on a same cut surface.

Inventors

• Younggon Kim
• Joo Young Park
• JE YOON YOO
• Taehyun JUNG

Assignees

• SAMSUNG DISPLAY CO., LTD.

Dates

Publication Date

20260507

Application Date

20251103

Priority Date

20241104

Claims (20)

1. 1 . An electronic device comprising a display device, wherein the display device comprises: a display panel including a display area, a pad area located at one side of the display area, and a bending area between the display area and the pad area; a panel protection film attached to a lower portion of the display panel; a flexible circuit board attached to the pad area; and a cover film attached to the pad area and the flexible circuit board, wherein the pad area overlaps the display area in a state where the bending area is bent, and a side surface of the cover film, a side surface of the display panel, and a side surface of the panel protection film are on a same cut surface.
2. 2 . The electronic device of claim 1 , wherein the cover film comprises at least one selected from an insulation film, a conductive film, or a step film.
3. 3 . The electronic device of claim 1 , wherein the cut surface is located on a side of the pad area.
4. 4 . The electronic device of claim 1 , wherein the pad area includes a marker, and the cover film exposes the marker.
5. 5 . The electronic device of claim 1 , wherein an inspection wire is positioned in the pad area, and a distance between the inspection wire and the cut surface is in a range of about 80 μm to about 150 μm.
6. 6 . The electronic device of claim 1 , further comprising a cover layer positioned below the panel protection film.
7. 7 . The electronic device of claim 6 , wherein the cover layer comprises at least one of a cushion layer and a metal plate.
8. 8 . The electronic device of claim 7 , wherein the metal plate comprises a material having an elastic modulus of about 60 GPa or greater at a room temperature.
9. 9 . The electronic device of claim 1 , further comprising an upper protective film attached to an upper portion of the display panel.
10. 10 . The electronic device of claim 1 , wherein the display panel comprises an organic light-emitting diode.
11. 11 . A method of manufacturing an electronic device including a display device, the method comprising: performing a preparation operation of preparing a display panel including a display area, a pad area, and a bending area between the display area and the pad area; performing a panel protection film attachment operation of attaching a panel protection film to a lower surface of the display panel; performing a flexible circuit board attachment operation of attaching a flexible circuit board to the pad area; performing a cover film attachment operation of attaching a cover film to the pad area and the flexible circuit board; performing a cutting operation of simultaneously cutting the cover film, the display panel and the panel protection film; and performing a bending operation of bending the display panel, wherein a side surface of the cover film, a side surface of the display panel, and a side surface of the panel protection film collective define a same cut surface.
12. 12 . The method of claim 11 , wherein, in the performing the cover film attachment operation, the cover film having a greater width than a width of the pad area is attached.
13. 13 . The method of claim 12 , wherein a difference in length between one end of the cover film and one end of the pad area is in a range of about 200 μm to about 500 μm.
14. 14 . The method of claim 11 , wherein, in the performing the cutting operation, the cutting comprises laser cutting.
15. 15 . The method of claim 11 , further comprising, after the performing the cutting operation, attaching an upper protective film on the display panel.
16. 16 . The method of claim 11 , further comprising, after the performing the cutting operation, forming a cover layer below the panel protection film.
17. 17 . The method of claim 11 , wherein the cover film comprises at least one selected from an insulation film, a conductive film, or a step film.
18. 18 . The method of claim 11 , wherein an inspection wire is positioned in the pad area, and a distance between the inspection wire and the cut surface is in a range of about 80 μm to about 150 μm.
19. 19 . The method of claim 11 , wherein the pad area includes a marker, and the cover film exposes the marker.
20. 20 . An electronic device comprising: a memory which stores a program; a processor which operates by executing the program; a display device which receives data from the processor and provides visual information; and a power module which supplies power to the display device, wherein the display device comprises: a display panel including a display area, a pad area located at one side of the display area, and a bending area between the display area and the pad area; a panel protection film attached to a lower portion of the display panel; a flexible circuit board attached to the pad area; and a cover film attached to the pad area and the flexible circuit board, wherein a side surface of the cover film, a side surface of the display panel, and a side surface of the panel protection film are on a same cut surface.

Description

This application claims priority to Korean Patent Application No. 10-2024-0154295, filed on Nov. 4, 2024, and all the benefits accruing therefrom under 35 U.S.C. § 119, the content of which in its entirety is herein incorporated by reference. BACKGROUND 1. Field The present disclosure relates to an electronic device including a display device and a method of manufacturing the electronic device. 2. Description of the Related Art Recently, various lightweight and compact flat panel display devices are being developed. Examples of the flat panel display devices include liquid crystal displays (LCDs), field emission displays (FEDs), plasma display panels (PDPs), and organic light-emitting displays (OLEDs). Among the flat panel display devices, organic light-emitting display devices (OLEDs) display images using an organic light-emitting diode that emits light through the recombination of electrons and holes. These OLEDs are receiving attention as the next-generation displays because OLEDs typically have fast response speeds and operate with low power consumption. SUMMARY Embodiments of the present disclosure provide an electronic device including a display device with improved waterproof performance and attachment quality, and a method of manufacturing the electronic device. However, the technical objectives to be solved by the present disclosure are not limited to the objectives described above, and other objectives not mentioned may be clearly understood by those skilled in the art from the description of the present disclosure described below. According to an embodiment of the present disclosure, an electronic device includes a display device including: a display panel including a display area, a pad area located at one side of the display area, and a bending area between the display area and the pad area; a panel protection film attached to a lower portion of the display panel; a flexible circuit board attached to the pad area; and a cover film attached to the pad area and the flexible circuit board, where the pad area overlaps the display area in a state where the bending area is bent, and a side surface of the cover film, a side surface of the display panel, and a side surface of the panel protection film are on a same cut surface. In an embodiment, the cover film may include at least one selected from an insulation film, a conductive film, or a step film. In an embodiment, the cut surface may be located at sides of the pad area. In an embodiment, the pad area includes a marker, and the cover film may expose the marker. In an embodiment, an inspection wire may be positioned in the pad area, and a distance between the inspection wire and the cut surface may be in a range of about 80 micrometers (μm) to about 150 μm. In an embodiment, the electronic device may further include a cover layer positioned below the panel protection film. In an embodiment, the cover layer may include at least one selected from a cushion layer and a metal plate. In an embodiment, the metal plate may include a material having an elastic modulus of 60 gigapascals (GPa) or greater at a room temperature. In an embodiment, the electronic device may further include an upper protective film attached to an upper portion of the display panel. In an embodiment, the display panel may include an organic light-emitting diode. According to another embodiment of the present disclosure, a method of manufacturing an electronic device including a display device includes: performing a preparation operation of preparing a display panel including a display area, a pad area, and a bending area between the display area and the pad area; performing a panel protection film attachment operation of attaching a panel protection film to a lower surface of the display panel; performing a flexible circuit board attachment operation of attaching a flexible circuit board to the pad area; performing a cover film attachment operation of attaching a cover film to the pad area and the flexible circuit board; performing a cutting operation of simultaneously cutting the cover film, the display panel and the panel protection film; and performing a bending operation of bending the display panel, where a side surface of the cover film, a side surface of the display panel, and a side surface of the panel protection film are on a same cut surface. In an embodiment, in the performing the cover film attachment operation, the cover film having a greater width than a width of the pad area may be attached. In an embodiment, a difference in length between one end of the cover film and one end of the pad area may be in a range of about 200 μm to about 500 μm. In an embodiment, in the performing the cutting operation, the cutting may include laser cutting. In an embodiment, the method may further include, after the performing the cutting operation, attaching an upper protective film on the display panel. In an embodiment, the method may further include, after the performing the cutt