US-20260130156-A1 - SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME

Abstract

A substrate processing apparatus includes a substrate stage configured to support and rotate a substrate, a dispenser configured to eject a solution toward an edge of the substrate, and a heater configured to heat at least part of the edge of the substrate, wherein the dispenser and the heater are synchronized with an encoder signal of the substrate stage.

Inventors

• Yoonjae Kim
• JuHyung Lee
• Minwoo Rhee
• Junhong MIN
• Seungdon Lee
• Hyunjin Lee
• Hojin Lee
• Joohee Jang

Assignees

• SAMSUNG ELECTRONICS CO., LTD.

Dates

Publication Date

20260507

Application Date

20251103

Priority Date

20241105

Claims (20)

1. 1 . A substrate processing apparatus comprising: a substrate stage configured to support and rotate a substrate; a dispenser configured to eject a solution toward an edge of the substrate; and a heater configured to heat at least part of the edge of the substrate, wherein operation of the dispenser and the heater are synchronized with a signal from an encoder associated with the substrate stage.
2. 2 . The substrate processing apparatus of claim 1 , wherein the substrate comprises a first substrate and a second substrate in contact with each other in a first direction, and wherein the dispenser is configured to eject the solution to a space between the first substrate and the second substrate.
3. 3 . The substrate processing apparatus of claim 2 , wherein the dispenser is configured to eject the solution in a second direction perpendicular to the first direction.
4. 4 . The substrate processing apparatus of claim 2 , wherein the heater is spaced apart from the substrate in a second direction.
5. 5 . The substrate processing apparatus of claim 1 , further comprising: a vision system configured to capture at least one image of the edge of the substrate and to obtain vision information from the at least one image.
6. 6 . The substrate processing apparatus of claim 5 , wherein the vision information comprises a position of the solution ejected from the dispenser.
7. 7 . The substrate processing apparatus of claim 5 , wherein the dispenser and the heater are configured to operate based on the vision information.
8. 8 . The substrate processing apparatus of claim 7 , further comprising: a current controller configured to control intensity of the heater, based on the vision information.
9. 9 . The substrate processing apparatus of claim 1 , wherein the heater is configured to heat the at least part of the edge of the substrate for multiple time periods.
10. 10 . The substrate processing apparatus of claim 1 , wherein the heater is positioned adjacent to the edge of the substrate.
11. 11 . A substrate processing method comprising: obtaining a signal from an encoder associated with a substrate stage that is configured to support a substrate; ejecting a solution, via a dispenser, toward an edge of the substrate in response to an ejection signal that is synchronized with the encoder signal; heating at least part of an edge of the substrate, via a heater, in response to a heat signal that is synchronized with the encoder signal; and obtaining vision information by capturing an image of the edge of the substrate.
12. 12 . The substrate processing method of claim 11 , wherein the vision information comprises a position of the solution ejected to the edge of the substrate.
13. 13 . The substrate processing method of claim 11 , wherein, the solution is ejected toward the edge of the substrate via the dispenser in a horizontal direction.
14. 14 . The substrate processing method of claim 13 , wherein the dispenser is turned on or turned off in response to the vision information.
15. 15 . The substrate processing method of claim 13 , wherein, the ejecting of the solution toward the edge of the substrate via the dispenser comprises ejecting the solution during a first time period and a second time period that are temporally spaced apart and non-overlapping.
16. 16 . The substrate processing method of claim 15 , wherein, the heating of the at least part of the edge of the substrate via the heater comprises heating the at least part of the edge of the substrate during a third time period and a fourth time period that are temporally spaced apart and non-overlapping.
17. 17 . The substrate processing method of claim 16 , wherein one of the first time period and the second time period is between the third time period and the fourth time period.
18. 18 . The substrate processing method of claim 16 , wherein the heater is configured to be turned on or off based on the vision information.
19. 19 . The substrate processing method of claim 16 , wherein, the dispenser and heater are fixed and the substrate is rotated during the ejecting of the solution toward the edge of the substrate and the heating of the at least part of the edge of the substrate.
20. 20 . A substrate processing apparatus comprising: a substrate stage configured to support a substrate including a first substrate and a second substrate in contact with each other in a first direction; a dispenser configured to eject a solution in a second direction to a space between the first substrate and the second substrate, wherein the second direction is transverse to the first direction; a heater positioned adjacent to the substrate in the second direction; an encoder configured to generate an encoder signal including rotation information of the substrate stage; a dispensing controller configured to control operation of the dispenser by using an ejection signal synchronized with the encoder signal; a current controller configured to control operation of the heater by using a heat signal synchronized with the encoder signal; and a vision system configured to obtain vision information by capturing an image of the substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application is based on and claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2024-0155669, filed on Nov. 5, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety. BACKGROUND The inventive concept relates to a substrate processing apparatus and a substrate processing method using the substrate processing apparatus, and more specifically, to a device and method for processing an edge of a substrate. After a process of bonding wafers to each other is performed in a semiconductor device manufacturing process, a grinding process may be performed to reduce a thickness of a wafer. There may be a gap (or an un-bonding area) in which wafers are not in contact with each other in a structure in which the wafers are bonded to each other. A wafer structure in which the gap is formed may have weak mechanical strength, and accordingly, the wafer structure may be broken (for example, chipping may occur) in a subsequent process, such as a grinding process. SUMMARY OF THE INVENTION The inventive concept provides a substrate processing apparatus that prevents damage, such as cracking and chipping of a wafer, and a substrate processing method using the substrate processing apparatus. Also, objects of the inventive concept are not limited to the objects described above, and the other objects may be clearly understood by those skilled in the art from the description below. According to an aspect of the inventive concept, a substrate processing apparatus includes a substrate stage configured to support and rotate a substrate, a dispenser configured to eject a solution toward an edge of the substrate, and a heater configured to heat at least part of the edge of the substrate, wherein operation of the dispenser and the heater are synchronized with a signal from an encoder associated with the substrate stage. According to another aspect of the inventive concept, a substrate processing method includes obtaining a signal from an encoder associated with a substrate stage that is configured to support a substrate, ejecting a solution, via a dispenser, toward an edge of the substrate in response to an ejection signal that is synchronized with the encoder signal, heating at least part of an edge of the substrate, via a heater, in response to a heat signal that is synchronized with the encoder signal, and obtaining vision information by capturing an image of the edge of the substrate. According to another aspect of the inventive concept, a substrate processing apparatus includes a substrate stage configured to support a substrate including a first substrate and a second substrate in contact with each other in a first direction, a dispenser configured to eject a solution in a second direction to a space between the first substrate and the second substrate, wherein the second direction is transverse to the first direction, a heater positioned adjacent to the substrate in the second direction, an encoder configured to generate an encoder signal including rotation information of the substrate stage, a dispensing controller configured to control operation of the dispenser by using an ejection signal synchronized with the encoder signal, a current controller configured to control operation of the heater by using a heat signal synchronized with the encoder signal, and a vision system configured to obtain vision information by capturing an image of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS Embodiments of the inventive concept will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which: FIG. 1 is a perspective view schematically illustrating a substrate processing apparatus according to an embodiment; FIG. 2A is a cross-sectional view illustrating an example of a substrate structure processed by using a substrate processing method according to an embodiment; FIG. 2B is a plan view illustrating an example of a substrate structure processed by using a substrate processing method according to an embodiment; FIG. 3 is a view illustrating a dispenser of a substrate processing apparatus according to an embodiment; FIG. 4 is a schematic cross-sectional view of a substrate structure illustrating a substrate processing apparatus according to an embodiment; FIG. 5 is a schematic cross-sectional view of a substrate structure illustrating a substrate processing apparatus according to an embodiment; and FIG. 6 is a schematic flowchart illustrating a substrate processing method according to an embodiment. DETAILED DESCRIPTION Hereinafter, embodiments of the inventive concept are described in detail with reference to the attached drawings. The same reference numerals are used for the same components in the drawings, and redundant descriptions thereof are omitted. In the following embodiments, the terms first, second, and so on are used for the p