US-20260130159-A1 - METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR FLATTENING WORKPIECE

Abstract

A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.

Inventors

• Ya Fang CHAN
• Cong-Wei CHEN
• Kuoching CHENG
• Shih-Yu Wang

Assignees

• ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Dates

Publication Date

20260507

Application Date

20251230

Claims (20)

1. 1 . A method for manufacturing a semiconductor package, comprising: providing a workpiece over a stage; applying an airflow, by a direction of an air supply device, toward a first region of the workpiece; and adjusting the direction of air supply device such that the airflow is applied toward a second region of the workpiece different form the first region of the workpiece.
2. 2 . (canceled)
3. 3 . The method of claim 1 , further comprising: increasing a blowing force of the airflow during adjusting the direction of the air supply device.
4. 4 - 11 . (canceled)
5. 12 . A method for manufacturing a semiconductor package, comprising: providing a workpiece over a stage; applying an airflow, by an air supply device, to the workpiece; and creating a negative pressure between the workpiece and the stage after applying the airflow to the workpiece.
6. 13 . The method of claim 12 , wherein the step of applying the airflow to the workpiece comprises: applying the airflow to press the workpiece to contact the stage.
7. 14 - 15 . (canceled)
8. 16 . The method of claim 12 , wherein the step of applying the airflow and the step of creating the negative pressure comprises: applying a first airflow, by the air supply device, to a first portion of the workpiece; creating a negative pressure between the first portion of the workpiece and the stage; applying a second airflow, by the air supply device, to a second portion of the workpiece; and creating a negative pressure between the second portion of the workpiece and the stage.
9. 17 . The method of claim 12 , further comprising: moving the air supply device from a position corresponding to a center portion of the workpiece to another position corresponding to corner of the workpiece.
10. 18 . The method of claim 12 , further comprising: rotating the air supply device from a first direction toward a first portion of the workpiece to a second direction toward a second portion of the workpiece, wherein the second direction is different from the first direction.
11. 19 . (canceled)
12. 20 . The method of claim 18 , further comprising: increasing a pressure of the airflow when rotating the air supply device from the first direction to the second direction.
13. 21 . The method of claim 2 , wherein the step of adjusting the direction of the air supply device comprises: rotating the air supply device.
14. 22 . The method of claim 1 , further comprising: applying a second airflow, by a second direction of a second air supply device, toward a third region of the workpiece, wherein the second direction of the second air supply device is different from the direction of the air supply device; and adjusting the second direction of the second air supply device such that the second airflow is applied toward a fourth region of the workpiece different form the third region of the workpiece.
15. 23 . The method of claim 22 , wherein the step of adjusting the second direction of the air supply device comprises: rotating the second air supply device.
16. 24 . The method of claim 23 , wherein the step of adjusting the direction of the air supply device comprises: rotating the air supply device clockwise, wherein the step of adjusting the direction of the second air supply device comprises: rotating the second air supply device anticlockwise.
17. 25 . The method of claim 24 , further comprising: rotating the air supply device and the second air supply device concurrently.
18. 26 . The method of claim 24 , wherein the first region of the workpiece and the third region of the workpiece are adjacent to a center portion of the workpiece, wherein the second region of the workpiece is adjacent to a first periphery portion of the workpiece, wherein the fourth region of the workpiece is adjacent to a second periphery portion of the workpiece.
19. 27 . The method of claim 1 , wherein the step of applying the airflow comprises: applying the airflow to press the workpiece to contact the stage.
20. 28 . The method of claim 1 , further comprising: creating a negative pressure between the workpiece and the stage after the workpiece contacts the stage.

Description

CROSS REFERENCE TO RELATED APPLICATION This application is a continuation of U.S. patent application Ser. No. 18/099,867, filed Jan. 20, 2023, now U.S. Pat. No. 12,512,337, the content of which is incorporated herein by reference in its entirety. BACKGROUND 1. Field of the Disclosure The present disclosure relates to a method for manufacturing a semiconductor package structure and an apparatus for flattening a workpiece. 2. Description of the Related Art In order to reduce a thickness of a semiconductor package structure, a molded wafer (panel) that is in an intermediate state of fabrication is thinned. However, the molded wafer may include a semiconductor die and a molding compound covering the semiconductor die. The coefficient of thermal expansion (CTE) mismatch between the semiconductor die and the molding compound may lead to the thinned molded wafer occurring a severe warpage. When the warped molded wafer is disposed on a vacuum stage for flattening, it is difficult to create a negative pressure or a vacuum between the vacuum stage and the warped molded wafer due to the large distance between the vacuum stage and the warped molded wafer. Therefore, the warped molded wafer is difficult to be flattened by the vacuum stage. In addition, the warped molded wafer may shift and vibrate during flattening. Thus, the subsequent manufacturing processes may be difficult to be conducted to the warped and thinned molded wafer. SUMMARY In some embodiments, a method for manufacturing a semiconductor package includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region. In some embodiments, a method for manufacturing a semiconductor package includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface, wherein the lower surface includes a third region spaced apart from the stage by a first distance and a fourth region spaced apart from the stage by a second distance, wherein the second distance is greater than the first distance; applying a first airflow to a first region of the upper surface of the panel opposite to the third region; and applying a second airflow to a second region of the upper surface of the panel opposite to the fourth region, wherein a second blowing force of the second airflow is greater than a first blowing force of the first airflow. In some embodiments, an apparatus for flattening a workpiece includes a stage for carrying the workpiece; and an air supply device above the stage and configured to blow the workpiece, such that a gap between the workpiece and the stage is reduced, wherein the air supply device and the stage are moveable relative to each other. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of some embodiments of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that various structures may not be drawn to scale, and dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion. FIG. 1 illustrates a cross-sectional view of an apparatus for flattening a workpiece according to some embodiments of the present disclosure. FIG. 2 illustrates a schematic top view of a panel according to some embodiments of the present disclosure. FIG. 3 illustrates a bottom view of an air supply device according to some embodiments of the present disclosure. FIG. 4 illustrates a cross-sectional view of an apparatus for flattening a workpiece according to some embodiments of the present disclosure. FIG. 5 illustrates a cross-sectional view of a panel according to some embodiments of the present disclosure. FIG. 6A illustrates a perspective view of an apparatus for flattening a workpiece according to some embodiments of the present disclosure. FIG. 6B illustrates an enlarged perspective view of a region “A” in FIG. 6A. FIG. 6C illustrates a perspective view of an apparatus for flattening a workpiece 10 according to some embodiments of the present disclosure. FIGS. 7A, 7B, 7C and 7D illustrate cross-sectional views of one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. FIGS. 8A, 8B, 8C, 8D, 8E, 8F and 8G illustrate cross-sectional views of one or more stages of an example of a method for manufacturing a semiconductor package structure according to some embodiments of the present disclosure. FIG. 9 illustrates a cross-sectional view of an apparatus for flattening a workpiece according to some embodiments of the present disclosure. FIG. 10 i