US-20260130160-A1 - BONDING DEVICE

US20260130160A1US 20260130160 A1US20260130160 A1US 20260130160A1US-20260130160-A1

Abstract

Provided is a bonding device including a lower electrostatic chuck, an upper electrostatic chuck disposed above the lower electrostatic chuck, an elastic part disposed above the upper electrostatic chuck, a first shaft disposed on the upper electrostatic chuck and disposed in a space which is defined inside the elastic part, a first plate disposed on the first shaft and the elastic part, a bracket disposed on the first plate, a first cylinder disposed on the bracket, a guide rod disposed on the first plate, and a second cylinder disposed adjacent to the guide rod in a horizontal direction and connected to an upper end portion of the guide rod.

Inventors

Taeyoung Park
Byung-Moo KIM
Dongho Park
Jun-Hee Lee
CHANG-OOK LEE
Junghyeok LIM
Jaeheung Cho

Assignees

SAMSUNG DISPLAY CO., LTD.

Dates

Publication Date: 20260507
Application Date: 20251017
Priority Date: 20241105

Claims (18)

1 . A bonding device comprising: a lower electrostatic chuck; an upper electrostatic chuck disposed above the lower electrostatic chuck; an elastic part disposed above the upper electrostatic chuck; a first shaft disposed on the upper electrostatic chuck and disposed in a space which is defined inside the elastic part; a first plate disposed on the first shaft and the elastic part; a bracket disposed on the first plate; a first cylinder disposed on the bracket; a guide rod disposed on the first plate; and a second cylinder disposed adjacent to the guide rod in a horizontal direction and connected to an upper end portion of the guide rod.
2 . The bonding device of claim 1 , further comprising: a support plate disposed above the first plate and including a hole, wherein the first cylinder is disposed on the support plate and extends toward the bracket, the second cylinder is disposed on the support plate, and the guide rod extends above the support plate through the hole of the support plate.
3 . The bonding device of claim 2 , wherein the first cylinder comprises: a first body disposed on the support plate; and a first movable rod connected to a lower part of the first body, extending below the support plate, and disposed on the bracket, and the first movable rod is movable vertically.
4 . The bonding device of claim 3 , wherein the first movable rod is separated from the bracket and is in contact with an upper surface of the bracket.
5 . The bonding device of claim 3 , further comprising: a support pillar adjacent to a side of the support plate; and a vertical moving part connected to a side of the support plate and the support pillar and moving in a vertical direction.
6 . The bonding device of claim 5 , wherein in case that process objects disposed on an upper surface of the lower electrostatic chuck and a lower surface of the upper electrostatic chuck are bonded to each other, the vertical moving part is movable in a downward direction by a first distance, and the first movable rod is movable toward the first body by a second distance shorter than the first distance.
7 . The bonding device of claim 2 , wherein the second cylinder comprises: a second body disposed on the support plate; and a second movable rod connected to an upper part of the second body, extending upward, and connected to an upper end portion of the guide rod, and the second movable rod is movable vertically.
8 . The bonding device of claim 7 , further comprising: a connection bar connected to the upper end portion of the guide rod and an upper end portion of the second movable rod.
9 . The bonding device of claim 1 , wherein the first cylinder is provided in plurality, the second cylinder is provided in plurality, the plurality of first cylinders are arranged in a first direction, and the plurality of second cylinders are spaced apart from the plurality of first cylinders in a second direction intersecting the first direction, and are arranged in the first direction.
10 . The bonding device of claim 9 , wherein the guide rod is provided in plurality, the plurality of guide rods are arranged in the first direction and are spaced apart from the plurality of first cylinders in the second direction, and the plurality of second cylinders are disposed between the plurality of guide rods.
11 . The bonding device of claim 1 , further comprising: a second shaft disposed under the lower electrostatic chuck; and a second plate disposed under the second shaft.
12 . The bonding device of claim 1 , wherein an upper surface of the lower electrostatic chuck has a concave curved surface, and a lower surface of the upper electrostatic chuck has a convex curved surface.
13 . The bonding device of claim 12 , wherein a display module is disposed on the upper surface of the lower electrostatic chuck, and a window is disposed on the lower surface of the upper electrostatic chuck.
14 . The bonding device of claim 1 , wherein the elastic part provides an elastic force to the first plate and the lower electrostatic chuck in a vertical direction.
15 . A bonding device comprising: a lower electrostatic chuck; an upper electrostatic chuck disposed above the lower electrostatic chuck; an elastic part disposed above the upper electrostatic chuck; a first shaft disposed on the upper electrostatic chuck and disposed in a space which is defined inside the elastic part; a first plate disposed on the first shaft and the elastic part; a bracket disposed on the first plate; a first cylinder including: a first body disposed on the bracket, and a first movable rod extending from the first body toward the bracket and being in contact with the bracket; a guide rod disposed on the first plate; and a second cylinder disposed adjacent to the guide rod in a horizontal direction and connected to an upper end portion of the guide rod.
16 . The bonding device of claim 15 , wherein the first movable rod is separated from the bracket and is in contact with an upper surface of the bracket.
17 . The bonding device of claim 15 , further comprising: a support plate disposed above the first plate, wherein the second cylinder includes: a second body disposed on the support plate, and a second movable rod connected to an upper part of the second body and extending upward, and connected to an upper end portion of the guide rod, and the second movable rod is movable vertically.
18 . A bonding device comprising: a lower electrostatic chuck; an upper electrostatic chuck disposed above the lower electrostatic chuck; an elastic part disposed above the upper electrostatic chuck; a first shaft disposed on the upper electrostatic chuck and disposed in a space which is defined inside the elastic part; a first plate disposed on the first shaft and the elastic part; a bracket disposed on the first plate; a first cylinder disposed on the bracket; a guide rod disposed on the first plate; a second cylinder disposed adjacent to the guide rod in a horizontal direction; and a connection bar connected to an upper end portion of the guide rod and an upper end portion of the second cylinder.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S) This patent application claims priority to and benefits of Korean Patent Application No. 10-2024-0155468 under 35 U.S.C. § 119, filed on Nov. 5, 2024, the entire contents of which are incorporated herein by reference. BACKGROUND The disclosure herein relates to a bonding device. An electronic apparatus which provides images to users, such as a smartphone, a digital camera, a laptop computer, a navigation system, and a smart television, includes a display device for displaying the images. The display device generates an image and provides the image to the user through a display screen. Recently, with the technological development for the display device, various types of display devices are being developed. For example, a display device, which is capable of displaying an image not only on a front surface of the display device, but also on a rear surface and a side surface of the display device, is being developed. A display device includes a display panel which displays an image and a window which is disposed on the display panel so as to protect the display panel. The window may be bonded to an upper surface of the display panel by using a bonding device. SUMMARY The disclosure provides a bonding device capable of preventing bonding failure between a display module and a window. However, embodiments are not limited to those set forth herein. The above and other embodiments will become more apparent to one of ordinary skill in the art to which the disclosure pertains by referencing the detailed description of the disclosure given below. An embodiment provides a bonding device including: a lower electrostatic chuck; an upper electrostatic chuck disposed above the lower electrostatic chuck; an elastic part disposed above the upper electrostatic chuck; a first shaft disposed on the upper electrostatic chuck and disposed in a space which is defined inside the elastic part; a first plate disposed on the first shaft and the elastic part; a bracket disposed on the first plate; a first cylinder disposed on the bracket; a guide rod disposed on the first plate; and a second cylinder disposed adjacent to the guide rod in a horizontal direction and connected to an upper end portion of the guide rod. In an embodiment, the bonding device may further include a support plate disposed above the first plate and including a hole, wherein the first cylinder may be disposed on the support plate and extend toward the bracket, the second cylinder may be disposed on the support plate, and the guide rod may extend above the support plate through the hole of the support plate. In an embodiment, the first cylinder may include: a first body disposed on the support plate; and a first movable rod connected to a lower part of the first body, extending below the support plate, and disposed on the bracket, and the first movable rod may be movable vertically. In an embodiment, the first movable rod may be separated from the bracket and be in contact with an upper surface of the bracket. In an embodiment, the bonding device may further include: a support pillar adjacent to a side of the support plate; and a vertical moving part connected to a side of the support plate and the support pillar and moving in a vertical direction. In an embodiment, in case that process objects disposed on an upper surface of the lower electrostatic chuck and a lower surface of the upper electrostatic chuck are bonded to each other, the vertical moving part may be movable in a downward direction by a first distance, and the first movable rod may be movable toward the first body by a second distance shorter than the first distance. In an embodiment, the second cylinder may include: a second body disposed on the support plate; and a second movable rod connected to an upper part of the second body, extending upward, and connected to an upper end portion of the guide rod, and the second movable rod may be movable vertically. In an embodiment, the bonding device may further include a connection bar connected to the upper end portion of the guide rod and an upper end portion of the second movable rod. In an embodiment, the first cylinder may be provided in plurality, the second cylinder may be provided in plurality, the plurality of first cylinders may be arranged in a first direction, and the plurality of second cylinders may be spaced apart from the plurality of first cylinders in a second direction intersecting the first direction, and be arranged in the first direction. In an embodiment, the guide rod may be provided in plurality, the plurality of guide rods may be arranged in the first direction and be spaced apart from the plurality of first cylinders in the second direction, and the plurality of second cylinders may be disposed between the plurality of guide rods. In an embodiment, the bonding device may further include: a second shaft disposed under the lower electrostatic chuck; and a second plate disposed under the secon