US-20260130169-A1 - CHIP TRANSFERRING SYSTEM, PROTECTION COVER AND CHIP TRANSFERRING METHOD

Abstract

A chip transferring system including a stage, a protection cover and a pick-and-place component is provided. The stage has a supporting region and is configured to support a workpiece by the supporting region. The protection cover includes a cover body configured to be located above the supporting region to cover the supporting region, wherein the cover body has an opening. The pick-and-place component is configured to pass through the opening of the cover body to pick a chip from the workpiece on the supporting region or place the chip to the workpiece on the supporting region. In addition, a protection cover and a chip transferring method are also provided.

Inventors

• Yi-Chen Li
• Jen-Yuan Chang

Assignees

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Dates

Publication Date

20260507

Application Date

20241104

Claims (20)

1. 1 . A chip transferring system, comprising: a stage, having a supporting region and configured to support a workpiece by the supporting region; a protection cover, comprising a cover body configured to be located above the supporting region to cover the supporting region, wherein the cover body has an opening; and a pick-and-place component, configured to pass through the opening of the cover body to pick a chip from the workpiece on the supporting region or place the chip to the workpiece on the supporting region.
2. 2 . The chip transferring system of claim 1 , wherein the protection cover further comprises at least one ionizer, and the at least one ionizer is disposed on the cover body and configured to provide ions towards the supporting region.
3. 3 . The wafer cleaning system of claim 2 , wherein the at least one ionizer is a non-fan ionizer.
4. 4 . The chip transferring system of claim 1 , wherein a width of the opening is greater than a width of the chip.
5. 5 . The chip transferring system of claim 1 , wherein a width of the cover body is greater than a width of the stage.
6. 6 . The chip transferring system of claim 1 , wherein the protection cover further comprises at least one movable plate, and the at least one movable plate is disposed on the cover body and configured to move along the cover body to at least partially cover the opening.
7. 7 . The chip transferring system of claim 1 , wherein the stage is configured to move relatively to the cover body.
8. 8 . The chip transferring system of claim 1 , wherein the cover body is configured to be placed on the stage.
9. 9 . The chip transferring system of claim 8 , wherein the protection cover further comprises at least one movable plate, and the at least one movable plate is disposed on the cover body and configured to move along the cover body to formed the opening at different positions on the cover body.
10. 10 . The chip transferring system of claim 1 , wherein the workpiece is a wafer, a frame or a chip storage box.
11. 11 . A protection cover adapted to a chip transferring system, the chip transferring system comprising a stage, the stage having a supporting region for supporting a workpiece, the protection cover comprising: a cover body, configured to be located above the supporting region to cover the supporting region; and at least one ionizer, disposed on the cover body and configured to provide ions towards the supporting region.
12. 12 . The protection cover of claim 11 , wherein the at least one ionizer is a non-fan ionizer.
13. 13 . The protection cover of claim 11 , further comprising at least one movable plate, wherein the at least one movable plate is disposed on the cover body and configured to move along the cover body to at least partially cover the opening.
14. 14 . A chip transferring method, comprising: supporting a workpiece by a supporting region of a stage; covering the supporting region by a cover body located above the supporting region; and picking a chip from the workpiece on the supporting region or placing the chip to the workpiece on the supporting region, by a pick-and-place component passing through an opening of the cover body.
15. 15 . The chip transferring method of claim 14 , further comprising providing ions towards the supporting region by at least one ionizer.
16. 16 . The chip transferring method of claim 15 , wherein the at least one ionizer is a non-fan ionizer.
17. 17 . The chip transferring method of claim 14 , further comprising at least partially covering the opening by at least one movable plate moving along the cover body.
18. 18 . The chip transferring method of claim 14 , further comprising moving the stage relatively to the cover body.
19. 19 . The chip transferring method of claim 14 , further comprising placing the cover body on the stage.
20. 20 . The chip transferring method of claim 19 , further comprising forming the opening at different positions on the cover body by at least one movable plate moving along the cover body.

Description

BACKGROUND In recent years, the semiconductor industry has experienced rapid growth due to continuous improvement in integration density of various electronic components, e.g., transistors, diodes, resistors, capacitors, etc. For the most part, this improvement in integration density has come from successive reductions in minimum feature size, which allows more components to be integrated into a given area. These smaller electronic components also require smaller packages that occupy less area than previous packages. Examples of the type of packages for semiconductors include quad flat packages (QFP), pin grid array (PGA) packages, ball grid array (BGA) packages, flip chips (FC) packages, three-dimensional integrated circuits (3DICs), wafer level packages (WLPs), package on package (PoP) devices and wafer on wafer (WoW) devices. There are many challenges related to transferring chips between workpieces (such as a wafer, a frame with a tape therein for carrying chips, a chip storage box, etc.). One challenge is particles on the workpiece. Specifically, in a restructure wafer step in the SoIC (System on Integrated Circuit) chip fabrication process, ion fan blows to the workpiece for avoiding ESD (electrostatic discharge). It was found that the overall chamber particle count was higher than that of ordinary machines. The reason is that the ion fan blows dust onto the workpiece. Therefore, during the chip transferring process, particles on chip will cause the tip of the pick-and-place component to stick with the particles which cause wear. No matter at which step the particle falls, it may affect the surface of the chip and bulge defect will be formed after bonding. BRIEF DESCRIPTION OF THE DRAWINGS Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. FIG. 1A and FIG. 1B illustrate steps of transferring a chip by a chip transferring system in accordance with some embodiments. FIG. 2 is a flow chart illustrating a chip transferring method corresponding to the chip transferring system of FIG. 1A and FIG. 1B. FIG. 3 illustrates a partial step of transferring a chip by a chip transferring system in accordance with some embodiments. FIG. 4 illustrates a partial step of transferring a chip by a chip transferring system in accordance with some embodiments. FIG. 5 illustrates a partial step of transferring a chip by a chip transferring system in accordance with some embodiments. FIG. 6 illustrates a partial step of transferring a chip by a chip transferring system in accordance with some embodiments. FIG. 7A and FIG. 7B illustrate partial steps of transferring a chip by a chip transferring system in accordance with some embodiments. FIG. 8A and FIG. 8B illustrate partial steps of transferring a chip by a chip transferring system in accordance with some embodiments. FIG. 9A and FIG. 9B illustrate steps of transferring a chip by a chip transferring system in accordance with some embodiments. FIG. 10A and FIG. 10B illustrate steps of transferring a chip by a chip transferring system in accordance with some embodiments. DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. In embodime