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US-20260130175-A1 - MASS TRANSFER METHOD

US20260130175A1US 20260130175 A1US20260130175 A1US 20260130175A1US-20260130175-A1

Abstract

A mass transfer method includes providing at least one transfer cavity including a bottom plate with through holes and a cavity wall connecting the bottom plate; providing an array substrate with capture holes; placing micro light emitting diodes into each transfer cavity; attaching the array substrate to the bottom plate; aligning each through hole with a corresponding capture hole by moving the array substrate; causing the micro light emitting diodes to fall into a corresponding capture hole through the corresponding one through hole; and continuously moving the array substrate such that each capture hole in the array substrate is filled with one micro light emitting diode.

Inventors

  • CHEN-FU MAI
  • Ping Liu
  • Jie Xiao
  • ZE-YUAN LI
  • Meng-Chieh Tai

Assignees

  • CENTURY TECHNOLOGY (SHENZHEN) CORPORATION LIMITED

Dates

Publication Date
20260507
Application Date
20251230
Priority Date
20211223

Claims (20)

  1. 1 . A mass transfer method comprising: Block S1-1: providing at least one transfer cavity, wherein each of the at least one transfer cavity comprises a bottom plate, a cavity wall connecting to the bottom plate, and a plurality of through holes defined in the bottom plate; Block S1-2: providing an array substrate defining a plurality of capture holes; Block S2-1: placing a plurality of micro light emitting diodes into each of the at least one transfer cavity; Block S2-2: attaching the array substrate to the bottom plate; Block S3: aligning corresponding capture holes of the plurality of capture holes with the plurality of through holes by moving the array substrate; Block S4: causing the plurality of micro light emitting diodes to fall into the corresponding capture holes through the plurality of through holes; and Block S5: repeating Block S3 and Block S4 until each of the plurality of capture holes in the array substrate is filled with one of the plurality of micro light emitting diodes.
  2. 2 . The mass transfer method of claim 1 , wherein in Block S1-1, each of the at least one transfer cavity further comprises an opening defined in the cavity wall and a baffle detachably arranged in each of the at least one transfer cavity through the opening; before Block S2-1, the mass transfer method further comprises: Block S1-3: moving the baffle such that the bottom plate is covered by the baffle; after Block S2-1, the mass transfer method further comprises: Block S2-3: removing the baffle from the transfer cavity.
  3. 3 . The mass transfer method of claim 2 , wherein Block S1-3 comprises positioning the baffle to cover a corresponding through hole of the plurality of through holes to prevent the plurality of micro light emitting diodes from failing through the plurality of through holes.
  4. 4 . The mass transfer method of claim 2 , wherein Block S1-3, further comprises moving the baffle to block the opening to prevent the plurality of micro light emitting diodes from falling through the opening.
  5. 5 . The mass transfer method of claim 1 , wherein Block S1-1 comprises providing three transfer cavities; Block S2-1 comprises: placing a plurality of micro light emitting diodes, of the plurality of micro light emitting diodes, emitting light of one color in one of the three transfer cavities.
  6. 6 . The mass transfer method of claim 5 , wherein in Block S1-1, the three transfer cavities are provided to accommodate micro light emitting diodes emitting red light, green light, and blue light respectively.
  7. 7 . The mass transfer method of claim 5 , wherein in Block S1-1, the three transfer cavities are further provided such that a size of the plurality of through holes in a corresponding transfer cavity, of the three transfer cavity, is configured to accommodate the plurality of micro light emitting diodes emitting light of the one color.
  8. 8 . The mass transfer method of claim 1 , wherein Block S3 comprises: Block S3-1: aligning the array substrate to the three transfer cavities sequentially, so that the plurality of capture holes are filled with the plurality of micro light emitting diodes via the three transfer cavities respectively; or Block S3-2: aligning the array substrate to the three transfer cavities simultaneously, so that the plurality of capture holes are filled with the plurality of micro light emitting diodes via the three transfer cavities respectively.
  9. 9 . The mass transfer method of claim 8 , wherein in a case that Block S3 further comprises Block S3-1, Block S5 further comprises moving the array substrate along a first direction to align corresponding capture holes, of the plurality of capture holes, with the through holes of the corresponding transfer cavities accommodating the micro light emitting diodes emitting another color.
  10. 10 . The mass transfer method of claim 8 , wherein in a case that Block S3 further comprises Block S3-2, Block S1-1 further comprises providing the plurality of transfer cavities in one line and moving the array substrate accordingly.
  11. 11 . The mass transfer method of claim 1 , wherein each of the plurality of micro light emitting diodes comprises a first magnetic pole, and Block S4 comprises: Block S4-1: providing at least one magnetic generator on a side of the array substrate away from the bottom plate to generate a magnetic field; and Block S4-2: attracting each of the plurality of micro light emitting diodes into the corresponding the capture holes through the plurality of through holes using the magnetic field.
  12. 12 . The mass transfer method of claim 11 , wherein a micro light emitting diode received in one of the plurality of capture holes prevents another micro light emitting diode from falling into a same capture hole.
  13. 13 . The mass transfer method of claim 11 , wherein Block S4-1 comprises providing three magnetic generators corresponding to the three transfer cavities respectively, and powering on a corresponding magnetic generator of the three magnetic generators when the array substrate is aligned with a corresponding one of the three transfer cavities.
  14. 14 . The mass transfer method of claim 11 , wherein Block S4-2 comprises orienting each of the plurality of micro light emitting diodes such that the first magnetic pole faces toward the array substrate during falling.
  15. 15 . The mass transfer method of claim 11 , wherein each of the plurality of micro light-emitting diodes comprises a light emitting part and an electrode on a side of the light emitting part, and the electrode is the first magnetic pole.
  16. 16 . The mass transfer method of claim 1 , wherein Block S4 comprises causing each of the plurality of micro light emitting diodes fall into the corresponding one of the plurality of capture holes by gravity.
  17. 17 . The mass transfer method of claim 16 , wherein each of the plurality of micro light emitting diodes comprises a light-emitting part and two electrodes arranged on opposite sides of the light-emitting part, and falling by gravity causes one of the electrodes to contact a bottom of the corresponding one of the plurality of capture holes.
  18. 18 . The mass transfer method of claim 1 , wherein the plurality of through holes in each of the at least one transfer cavity are arranged in an array, and Block S3 comprises aligning the array of through holes with an array of the plurality of capture holes in the array substrate.
  19. 19 . The mass transfer method of claim 1 , wherein a number of the plurality of micro light emitting diodes in each of the at least one transfer cavity is greater than a number of the plurality capture holes in the array substrate, and the number of the plurality of capture holes is greater than a number of the plurality of through holes.
  20. 20 . A mass transfer method comprising: providing a transfer cavity comprising a bottom plate, a plurality of through holes defined in the bottom plate and a plurality of micro light emitting diodes; providing an array substrate defining a plurality of capture holes; attaching the array substrate to the bottom plate such that the array substrate controls release of the plurality of micro light emitting diodes through the plurality of through holes; moving the array substrate while attached to the bottom plate to sequentially align unfilled capture holes of the plurality of capture holes with the plurality of through holes; and allowing one of the plurality of micro light emitting diodes to fall into each unfilled capture hole of the plurality of capture holes when aligned with a corresponding one of the plurality of through holes.

Description

FIELD The subject matter herein generally relates to display field, particularly relates to a mass transfer method. BACKGROUND Recently, most displays are liquid crystal displays. With the development of display technology, the requirements for display resolution and contrast are becoming higher. Micro light emitting diode (micro-LED) display technology, a new technology with higher brightness, better luminous efficiency, and lower efficiency, is being developed. Since micro-LED are sized in tens of microns or even less, assembling such small components on a display substrate with high efficiency and low cost is problematic. Therefore, there is room for improvement in the art. BRIEF DESCRIPTION OF THE DRAWINGS Implementations of the present technology will now be described, by way of embodiments only, with reference to the attached figures. FIG. 1 is a view of a mass transfer device according to an embodiment of the present disclosure. FIG. 2 is an exploded view of a transfer cavity according to an embodiment of the present disclosure. FIG. 3 is a view of a mass transfer system according to embodiment of the present disclosure. FIG. 4 is a planar view of an array substrate in a display according to an embodiment of the present disclosure. FIG. 5 is a cross-sectional view of the mass transfer system according to an embodiment of the present disclosure. FIG. 6 is a cross-sectional view of a mass transfer system according to another embodiment of the present disclosure. FIG. 7 is a view showing a state of the array substrate in the display in the mass transfer process shown in FIG. 6. FIG. 8 is a flowchart of a mass transfer method according to an embodiment of the present disclosure. DETAILED DESCRIPTION It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein may be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure. The term “coupled” is defined as coupled, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently coupled or releasably coupled. The term “comprising” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like. FIG. 1 illustrates a mass transfer device 10. The mass transfer device 10 includes at least one transfer cavity 11. FIG. 1 shows three transfer cavities 11 as an example. Each transfer cavity 11 is used to receive a plurality of micro light emitting diodes (micro-LEDs) 12R. The transfer cavity 11 includes a bottom plate 115 and a cavity wall 111 connecting the bottom plate 115. As shown in FIG. 2, the bottom plate 115 defines a plurality of through holes 117 arranged in an array. The transfer cavity 11 is configured to transfer the plurality of micro-LEDs 12R to an array substrate of a display panel, by the through holes 117. In one embodiment, the mass transfer device 10 also includes a baffle 113. An opening 112 is defined in the cavity wall 111, and the baffle 113 is detachably arranged in the transfer cavity 11 through the opening 112. The baffle 113 is used to carry the micro-LEDs 12R and to control the micro-LEDs 12R to fall onto the bottom plate 115, thereby the micro-LEDs 12R are controlled to pass through the through holes 117. Specifically, the baffle 113 can be moved inside and outside of the transfer cavity 11 through the opening 112. When the baffle 113 is inside of the transfer cavity 11, the micro-LEDs 12R are located on a side of the baffle 113 away from the bottom plate 115 and are supported by the baffle 113. The baffle 113 covers the bottom plate 115. That is, the baffle 113 covers and blocks each through hole 117, so as to prevent the plurality of micro LEDs 12R falling through the plurality of through holes 117. After the baffle 113 is moved from inside to outside of the transfer cavity 11, the through holes 117 are not covered by the baffle 113, so the micro-LEDs 12R drop from the inside to the outside of the transfer cavity 11 by any through hole 117. In the present embodiment, the mass transfer device 10 includes three tran