Search

US-20260130212-A1 - ELECTRONIC DEVICE

US20260130212A1US 20260130212 A1US20260130212 A1US 20260130212A1US-20260130212-A1

Abstract

An electronic device includes a housing, a substrate disposed in the housing, a package component, a heat sink, and load-bearing components. The package component includes a chip and is mounted on the substrate. The heat sink is disposed between the housing and the chip, and joined to the chip. The load-bearing components are disposed on an extended region of the heat sink where the heat sink extends outward of the package component when viewed in a thickness direction of the substrate. The load-bearing components press the heat sink in a direction from the substrate toward the heat sink.

Inventors

  • Kazuya Hirasawa

Assignees

  • DENSO CORPORATION

Dates

Publication Date
20260507
Application Date
20251030
Priority Date
20241101

Claims (11)

  1. 1 . An electronic device, comprising: a housing; a substrate disposed in the housing; a package component including a chip and mounted on the substrate via solder; a heat sink disposed between the housing and the chip and joined to the chip; and load-bearing components disposed on an extended region of the heat sink where the heat sink extends outward of the package component when viewed in a thickness direction of the substrate, wherein the load-bearing components press the heat sink in a direction from the substrate toward the heat sink.
  2. 2 . The electronic device according to claim 1 , wherein the substrate includes a through-hole through which the load-bearing components extend to press the heat sink.
  3. 3 . The electronic device according to claim 1 , wherein the substrate includes a notch through which the load-bearing components extend to press the heat sink.
  4. 4 . The electronic device according to claim 1 , wherein each of the load-bearing components includes a holding portion located between the heat sink and a portion of the housing which are opposed to each other, and is pressed toward the heat sink by a spring disposed between the portion of the housing and the holding portion.
  5. 5 . The electronic device according to claim 1 , wherein the substrate presses the package component toward the heat sink as a pressing structure.
  6. 6 . The electronic device according to claim 1 , wherein the heat sink has a rectangular shape when viewed in the thickness direction of the substrate, and four corners of the heat sink are pressed by the load-bearing components, respectively, disposed at positions corresponding to the four corners of the heat sink.
  7. 7 . The electronic device according to claim 1 , further comprising a solid first heat dissipating member that joins the chip and the heat sink together.
  8. 8 . The electronic device according to claim 1 , further comprising a second heat dissipating member that is disposed between the heat sink and the housing and is in contact with both the heat sink and the housing.
  9. 9 . The electronic device according to claim 8 , wherein the housing includes a cooling section facing the heat sink via the second heat dissipating member and configured to release a heat from the heat sink via the second heat dissipating member.
  10. 10 . The electronic device according to claim 1 , wherein the heat sink includes a frame portion that protrudes toward the package component from a surface of the heat sink facing the package component, and the frame portion surrounds at least the chip.
  11. 11 . The electronic device according to claim 1 , further comprising columns erected on an inner surface of the housing, wherein the heat sink is mounted on the inner surface of the housing, heights of the columns are less than a distance from the inner surface of the housing to a surface of the substrate on which the package component is mounted, and the substrate is secured on surfaces of the columns facing away from the inner surface of the housing such that an area of the substrate where the package component is mounted is recessed in a direction away from the inner surface of the housing.

Description

CROSS REFERENCE TO RELATED APPLICATION This application is based on and incorporates herein by reference Japanese Patent Application No. 2024-192989 filed on Nov. 1, 2024. TECHNICAL FIELD The present disclosure relates to an electronic device including, for example, a chip. BACKGROUND Conventionally, a technique is known in which a heat-generating component such as a semiconductor chip is mounted on a substrate via solder. SUMMARY According to at least one embodiment of the present disclosure, an electronic device includes a housing, a substrate disposed in the housing, a package component, a heat sink, and load-bearing components. The package component includes a chip and is mounted on the substrate. The heat sink is disposed between the housing and the chip, and joined to the chip. The load-bearing components may be disposed on an extended region of the heat sink where the heat sink extends outward of the package component when viewed in a thickness direction of the substrate. The load-bearing components press the heat sink in a direction from the substrate toward the heat sink. BRIEF DESCRIPTION OF DRAWINGS The details of one or more embodiments are set forth in the accompanying drawings and the description below. Other features and advantages will be apparent from the description and drawings, and from the claims. FIG. 1 is a cross-sectional view showing a schematic structure of an electronic device according to a first embodiment. FIG. 2 is a cross-sectional view showing an enlarged view of a package component of the electronic device and its periphery. FIG. 3 is a bottom view showing a box body of a housing viewed from an opening of the box body. FIG. 4 is a planar view of the electronic device viewed in a thickness direction (i.e., up down direction) showing an arrangement of a lid, a heat sink, and the package component. FIG. 5 is a planar view showing the package component viewed from above. FIG. 6 is a cross-sectional view of an electronic device in the thickness direction, showing a schematic structure of the electronic device according to a second embodiment. FIG. 7 is a cross-sectional view of an electronic device in the thickness direction, showing a schematic structure of the electronic device according to a third embodiment. FIG. 8 is a perspective view showing a heat sink according to the third embodiment viewed from a frame body. FIG. 9 is a planar view showing a substrate including a notch through which a load-bearing component passes. DETAILED DESCRIPTION According to a comparative example, a heat-generating component such as a semiconductor chip is mounted on a substrate via ball-shaped solder (i.e., BGA solder). In this technique, a heat-dissipating member is brought into contact with a surface of the heat-generating component (i.e., a surface facing away the substrate), and the substrate and the heat-dissipating member are integrated with a screw. As a result of the detailed exploration of the inventor, it has been founded that when the substrate and the heat-dissipating member are integrated with the screw, the heat-generating component and the solder arranged between the substrate and the heat-dissipating member are subjected to a load caused by the fastened screw. Therefore, if an excessive load (i.e., stress) is applied to the solder, the solder may deform, potentially causing a short circuit. In contrast to the comparative example, according to the present disclosure, an excessive load can be prevented from being applied to a solder. An electronic device according to one embodiment of the present disclosure includes a housing, a substrate disposed in the housing, a package component including a chip and mounted on the substrate via solder, and a heat sink disposed between the housing and the chip and joined to the chip. Multiple load-bearing components are disposed on an extended region of the heat sink where the heat sink extends outward of the package component when viewed in a thickness direction of the substrate. The multiple load-bearing components press the heat sink in a direction from the substrate toward the heat sink. In the present disclosure, such a configuration can reduce an excessive load applied to the solder. In other words, in the present disclosure, the multiple load-bearing components are disposed on the extended region of the heat sink where the heat sink extends outward of the package component. As a result, even when the load-bearing components press the heat sink in the direction from the substrate toward the heat sink, the load is not applied to the solder. Therefore, since the load applied to the solder can be reduced, the solder is less likely to deform, and an occurrence of short circuits due to deformation of the solder can be prevented. Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, portions that are the same as or equivalent to those described in a precedin